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    • 4. 发明申请
    • THERMAL INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF
    • 热界面材料,生产方法及其用途
    • US20090111925A1
    • 2009-04-30
    • US11932094
    • 2007-10-31
    • Kikue S. BurnhamWenya Fan
    • Kikue S. BurnhamWenya Fan
    • C08L83/04C08K5/053
    • C08L83/04C08G77/12C08G77/20C08L71/02C08L2666/14C08L83/00
    • Thermal interface materials comprise at least one silicon-based polymer and are formed from a combination of at least one silicon-based material, at least one catalyst and at least one elasticity promoter. In some embodiments, contemplated materials are also formed utilizing at least one polymerization component. Thermal interface materials are also disclosed that are capable of withstanding temperatures of at least 250 C where the material comprises at least one silicon-based polymer coupled with at least one elasticity promoter. Methods of forming these thermal interface materials comprise providing each of the at least one silicon-based material, at least one catalyst and at least one elasticity promoter, blending the components and optionally including the at least one polymerization component. Contemplated thermal interface materials disclosed are thermally stable, sticky, and elastic, and show a good thermal conductivity and strong adhesion when deposited on the high thermally conductive material. The thermal interface materials may then be utilized as formed or the materials may be cured pre- or post-application of the thermal interface material to the surface, substrate or component.
    • 热界面材料包括至少一种硅基聚合物,并且由至少一种硅基材料,至少一种催化剂和至少一种弹性促进剂的组合形成。 在一些实施方案中,还使用至少一种聚合组分形成预期的材料。 还公开了热界面材料,其能够耐受至少250℃的温度,其中该材料包含至少一种与至少一种弹性促进剂偶联的硅基聚合物。 形成这些热界面材料的方法包括提供至少一种硅基材料,至少一种催化剂和至少一种弹性促进剂中的每一种,共混组分和任选地包含至少一种聚合组分。 所公开的考虑的热界面材料是热稳定的,粘性的和弹性的,并且当沉积在高导热材料上时显示出良好的导热性和强粘附性。 然后可以将热界面材料用作形成的材料,或者材料可以在将热界面材料施加到表面,基底或部件之前或之后固化。