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1. 发明授权

US07253091B2 Process for assembling three-dimensional systems on a chip and structure thus obtained 有权
标题翻译：用于组装如此获得的芯片和结构上的三维系统的方法
公开(公告)号：US07253091B2
公开(公告)日：2007-08-07
申请号：US10256336
申请日：2002-09-26
申请人： Peter D. Brewer , Michael G. Case , Andrew T. Hunter , Mehran Matloubian , John A. Roth , Carl W. Pobanz
发明人： Peter D. Brewer , Michael G. Case , Andrew T. Hunter , Mehran Matloubian , John A. Roth , Carl W. Pobanz
IPC分类号： H01L21/4763 , H01L23/34
CPC分类号： H01L24/95 , H01L21/6835 , H01L21/8221 , H01L21/8258 , H01L24/24 , H01L24/82 , H01L25/50 , H01L27/0605 , H01L27/0688 , H01L2221/68345 , H01L2221/6835 , H01L2224/24145 , H01L2224/95085 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/04953 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/1305 , H01L2924/13064 , H01L2924/14 , H01L2924/1423 , H01L2924/3011 , Y10S438/928 , H01L2924/00
摘要： A method for assembling an electronic system with a plurality of layers. Recesses in formed in one or more dielectric layers and electronic components are positioned within the recesses. One or more layers containing the components are placed on a host substrate containing host circuits. Electrical interconnects are provided between and among the electronic components in the dielectric layers and the host circuits. The layers containing the components may also be provided by growing the electronic devices on a growth substrate. The growth substrate is then removed after the layer is attached to the host substrate.
摘要翻译：一种用于组装具有多层的电子系统的方法。在一个或多个电介质层和电子元件中形成的凹陷定位在凹槽内。将含有这些组分的一个或多个层放置在包含主体电路的主机衬底上。在电介质层和主电路中的电子部件之间提供电互连。包含组分的层也可以通过在生长衬底上生长电子器件来提供。然后在该层附着于该主体底物之后移除该生长衬底。

2. 发明授权

US09524872B1 Heterogeneous integrated circuits and devices thereof with a surrogate substrate and transferred semiconductor devices 有权
标题翻译：异质集成电路及其装置具有替代衬底和转移的半导体器件
公开(公告)号：US09524872B1
公开(公告)日：2016-12-20
申请号：US13096780
申请日：2011-04-28
申请人： Peter D. Brewer , Andrew T. Hunter , Yakov Royter
发明人： Peter D. Brewer , Andrew T. Hunter , Yakov Royter
IPC分类号： H01L21/30 , H01L21/18
CPC分类号： H01L21/185 , H01L21/18 , H01L21/187 , H01L21/76251 , H01L21/76264 , H01L21/82 , H01L21/8258
摘要： A heterogeneous integrated circuit and method of making the same. An integrated circuit includes a surrogate substrate including a material selected from the group consisting of Group II, Group III, Group IV, Group V, and Group VI materials and their combinations; at least one active semiconductor device including a material combination selected from the group consisting of Group IV-IV, Group III-V and Group II-VI materials; and at least one transferred semiconductor device including a material combination selected from the group consisting of Group IV-IV, Group III-V and Group II-VI materials. The at least one active semiconductor device and the at least one transferred device are interconnected.
摘要翻译：异构集成电路及其制作方法。集成电路包括包括选自由组II，组III，组IV，组V和组VI材料及其组合组成的组的材料的替代衬底; 至少一个活性半导体器件，其包括选自由IV-IV族，III-V族和II-VI族组成的组的材料组合; 以及至少一个转移的半导体器件，其包括选自由IV-IV族，III-V族和II-VI族组成的组的材料组合。所述至少一个有源半导体器件和所述至少一个转移器件互连。

3. 发明授权

US07391372B2 Integrated phased array antenna 有权
标题翻译：集成相控阵天线
公开(公告)号：US07391372B2
公开(公告)日：2008-06-24
申请号：US10862043
申请日：2004-06-03
申请人： Jonathan J. Lynch , Peter D. Brewer , Andrew T. Hunter
发明人： Jonathan J. Lynch , Peter D. Brewer , Andrew T. Hunter
IPC分类号： H01Q1/38
CPC分类号： H01Q9/0457 , H01L24/20 , H01L2224/24137 , H01L2224/48091 , H01L2224/73267 , H01L2924/12032 , H01L2924/1305 , H01L2924/14 , H01Q21/0093 , H01Q21/065 , H01Q23/00 , H01L2924/00014 , H01L2924/00
摘要： An integrated communication device having a substrate layer of substantially electrically nonconductive material with two substantially parallel surfaces, an antenna element disposed on one of the surfaces, a ground layer of substantially electrically conductive material disposed on the other surface and having an opening formed therethrough opposite from the antenna element, and a transceiver device mounted to the ground layer to transmit and/or receive electromagnetic energy through the opening.
摘要翻译：一种集成通信装置，具有基本上不导电材料的基底层，具有两个基本平行的表面，设置在其中一个表面上的天线元件，设置在另一个表面上的基本上导电材料的接地层，天线元件和安装到接地层的收发器装置，以通过开口传输和/或接收电磁能。

4. 发明授权

US06974604B2 Method of self-latching for adhesion during self-assembly of electronic or optical components 失效
标题翻译：电子或光学部件自组装过程中自锁的方法
公开(公告)号：US06974604B2
公开(公告)日：2005-12-13
申请号：US10218053
申请日：2002-08-12
申请人： Andrew T. Hunter , Peter D. Brewer
发明人： Andrew T. Hunter , Peter D. Brewer
IPC分类号： B05D3/10 , B32B7/00 , C09J5/04 , G02B3/00 , H01L21/98 , H01L23/00 , H01Q21/00
CPC分类号： H01L25/50 , H01L24/95 , H01L2224/95085 , H01L2924/01322 , H01L2924/00
摘要： A method for assembling components on a substrate including the steps of: (a) selectively coating at least a first receptor site of the substrate with a liquid precursor that forms a solid adhesive upon contact with an initiator; (b) providing each of the components with an adhesion surface that has the initiator; and (c) depositing the components on the substrate in a manner that causes a first of the components to contact the at least first receptor site whereupon contact between the initiator and the liquid precursor causes formation of the adhesive which affixes the first compound to the first receptor site. In a preferred embodiment of the invention, the precursor is a liquid monomer and the initiator initiates a polymerization reaction upon contact with the monomer to form a solid polymer.
摘要翻译：一种用于在基板上组装部件的方法，包括以下步骤：（a）用与引发剂接触时形成固体粘合剂的液体前体选择性地涂覆基材的至少第一受体部位; （b）为每个组分提供具有引发剂的粘合表面; 和（c）以使得第一组分接触所述至少第一受体部位的方式将组分沉积在基底上，由此引发剂和液体前体之间的接触引起粘合剂的形成，所述粘合剂将第一化合物固定到第一受体位点。在本发明的优选实施方案中，前体是液体单体，并且引发剂在与单体接触时引发聚合反应以形成固体聚合物。

5. 发明授权

US08808857B1 Carbon nanotube array interface material and methods 有权
标题翻译：碳纳米管阵列界面材料及方法
公开(公告)号：US08808857B1
公开(公告)日：2014-08-19
申请号：US12185020
申请日：2008-08-01
申请人： Peter D. Brewer , Andrew T. Hunter
发明人： Peter D. Brewer , Andrew T. Hunter
IPC分类号： B32B9/00
CPC分类号： B32B9/00 , B32B5/24 , Y10T428/30
摘要： An interface material employing carbon nanotube (CNT) array and a method of fabricating the same. A first CNT array is provided on a first substrate. A second CNT array is provided on a second substrate. A first support layer is disposed on the first CNT array, wherein the first CNT array is between the first support layer and the first substrate. A second support layer is disposed on the second CNT array, wherein the second CNT array is between the second support layer and the second substrate. The first support layer is attached to the second support layer. The first and second substrates are removed, thereby providing the interface material.
摘要翻译：使用碳纳米管（CNT）阵列的界面材料及其制造方法。在第一衬底上提供第一CNT阵列。第二CNT阵列设置在第二基板上。第一支撑层设置在第一CNT阵列上，其中第一CNT阵列位于第一支撑层和第一基底之间。第二支撑层设置在第二CNT阵列上，其中第二CNT阵列位于第二支撑层和第二基板之间。第一支撑层附接到第二支撑层。去除第一和第二基板，从而提供界面材料。

6. 发明授权

US07619567B2 Integrated phased array antenna 有权
标题翻译：集成相控阵天线
公开(公告)号：US07619567B2
公开(公告)日：2009-11-17
申请号：US11809175
申请日：2007-05-30
申请人： Jonathan J. Lynch , Peter D. Brewer , Andrew T. Hunter
发明人： Jonathan J. Lynch , Peter D. Brewer , Andrew T. Hunter
IPC分类号： H01Q1/38
CPC分类号： H01Q9/0457 , H01L24/20 , H01L2224/24137 , H01L2224/48091 , H01L2224/73267 , H01L2924/12032 , H01L2924/1305 , H01L2924/14 , H01Q21/0093 , H01Q21/065 , H01Q23/00 , H01L2924/00014 , H01L2924/00
摘要： An integrated communication device having a substrate layer of substantially electrically nonconductive material with two substantially parallel surfaces, an antenna element disposed on one of the surfaces, a ground layer of substantially electrically conductive material disposed on the other surface and having an opening formed therethrough opposite from the antenna element, and a transceiver device mounted to the ground layer to transmit and/or receive electromagnetic energy through the opening.
摘要翻译：一种集成通信装置，具有基本上不导电材料的基底层，具有两个基本平行的表面，设置在其中一个表面上的天线元件，设置在另一个表面上的基本上导电材料的接地层，天线元件和安装到接地层的收发器装置，以通过开口传输和/或接收电磁能。

7. 发明授权

US07972936B1 Method of fabrication of heterogeneous integrated circuits and devices thereof 有权
标题翻译：异质集成电路的制造方法及其装置
公开(公告)号：US07972936B1
公开(公告)日：2011-07-05
申请号：US12365112
申请日：2009-02-03
申请人： Peter D. Brewer , Andrew T. Hunter , Yakov Royter
发明人： Peter D. Brewer , Andrew T. Hunter , Yakov Royter
IPC分类号： H01L21/30
CPC分类号： H01L21/185 , H01L21/18 , H01L21/187 , H01L21/76251 , H01L21/76264 , H01L21/82 , H01L21/8258
摘要： A heterogeneous integrated circuit and method of making the same. An integrated circuit includes a surrogate substrate including a material selected from the group consisting of Group II, Group III, Group IV, Group V, and Group VI materials and their combinations; at least one active semiconductor device including a material combination selected from the group consisting of Group IV-IV, Group III-V and Group II-VI materials; and at least one transferred semiconductor device including a material combination selected from the group consisting of Group IV-IV, Group III-V and Group II-VI materials. The at least one active semiconductor device and the at least one transferred device are interconnected.
摘要翻译：异构集成电路及其制作方法。集成电路包括包括选自由组II，组III，组IV，组V和组VI材料及其组合组成的组的材料的替代衬底; 至少一个活性半导体器件，其包括选自由IV-IV族，III-V族和II-VI族组成的组的材料组合; 以及至少一个转移的半导体器件，其包括选自由IV-IV族，III-V族和II-VI族组成的组的材料组合。所述至少一个有源半导体器件和所述至少一个转移器件互连。

8. 发明授权

US07105376B1 Self-location method and apparatus 失效
标题翻译：自定位方法和装置
公开(公告)号：US07105376B1
公开(公告)日：2006-09-12
申请号：US10888178
申请日：2004-07-08
申请人： Peter D. Brewer , Clifford A. Lebeau , Andrew T. Hunter
发明人： Peter D. Brewer , Clifford A. Lebeau , Andrew T. Hunter
IPC分类号： H01L21/50 , H01L21/48 , H01L21/46
CPC分类号： H01L24/95 , H01L21/68 , H01L25/50 , H01L2224/95085 , H01L2224/95122 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01075 , H01L2924/14
摘要： A method and apparatus for transporting and dispersing microstructures on a substrate by fluidic self-assembly. The apparatus has an assembly vessel that is tilted and rotated to apply uncaptured microstructures back onto the substrate as the assembly vessel rotates. The assembly vessel has ramp structures that collect the microstructures that have not been captured by the substrate at the lower edge of the assembly vessel, carry the microstructures as the assembly vessel rotates, and release the microstructures back on to the substrate at the upper edge of the assembly vessel. Vibrational energy may also be applied to the assembly vessel to assist in the dispersal and location of the microstructures on the substrate.
摘要翻译：一种用于通过流体自组装在基底上传送和分散微结构的方法和装置。该装置具有一个组装容器，该容器在组装容器旋转时倾斜并旋转以将未捕获的微结构施加到衬底上。组装容器具有倾斜结构，其收集在组装容器的下边缘处未被基底捕获的微结构，当组装容器旋转时承载微结构，并将微结构释放回到基底上的上边缘装配船。也可以将振动能量施加到组装容器上以帮助微结构在基底上的分散和定位。

9. 发明授权

US07018575B2 Method for assembly of complementary-shaped receptacle site and device microstructures 失效
公开(公告)号：US07018575B2
公开(公告)日：2006-03-28
申请号：US10218052
申请日：2002-08-12
申请人： Peter D. Brewer , Andrew T. Hunter , Luisa M. Deckard
发明人： Peter D. Brewer , Andrew T. Hunter , Luisa M. Deckard
IPC分类号： H01L21/00 , B29C59/00 , B28B5/00
CPC分类号： H01L24/95 , B82Y10/00 , B82Y30/00 , H01L23/13 , H01L24/26 , H01L24/83 , H01L25/0655 , H01L25/50 , H01L29/0657 , H01L2224/8319 , H01L2224/8385 , H01L2224/95085 , H01L2224/95145 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01033 , H01L2924/01061 , H01L2924/01072 , H01L2924/01075 , H01L2924/01079 , H01L2924/01322 , H01L2924/07802 , H01L2924/09701 , H01L2924/10158 , H01L2924/10329 , H01L2924/14 , H01L2924/1423 , H01L2924/15153 , H01L2924/15157 , H01L2924/15165 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , Y10T428/12528 , H01L2924/00
摘要： A method for assembly including the steps of:(a) providing a plurality of microstructure components with each of the components having a bottom with the same three dimensional shape;(b) forming a mold with at least one protuberance from a surface thereof so that the at least one protuberance has the same shape;(c) molding a moldable substrate with the mold to form a molded substrate having a surface with at least one recess having the same shape; and(d) positioning a first of the plurality of microstructure components into said at least one recess. Each of the microstructure components may be formed by a masking and etching process, with the mold being formed by the same masking and etching process. The positioning step may consist of mixing the microstructure components with a fluid to form a slurry; and depositing the slurry on the surface of the molded substrate to cause the first of the plurality of microstructure components to self-align in the recess.

10. 发明申请

US20120072751A1 POWER CONSERVATION IN WIRELESS CLIENT TERMINALS AND SYSTEM LATENCY REDUCTION USING A PROXY DEVICE 有权
标题翻译：无线客户终端中的电源保护和使用代理设备的系统延迟减少
公开(公告)号：US20120072751A1
公开(公告)日：2012-03-22
申请号：US12883467
申请日：2010-09-16
申请人： Soumya Das , Samir S. Soliman , Nishith Chaubey , Andrew T. Hunter , Paul B. McAllister
发明人： Soumya Das , Samir S. Soliman , Nishith Chaubey , Andrew T. Hunter , Paul B. McAllister
IPC分类号： G06F1/32 , G06F15/173 , G06F15/16
CPC分类号： H04W52/0229 , H04W76/45 , H04W84/047 , Y02D70/1222 , Y02D70/1242 , Y02D70/142 , Y02D70/144 , Y02D70/146 , Y02D70/24
摘要： A scheme is provided for conserving power in client terminals and/or reducing latency in wireless systems by using a proxy device. The client terminal may have a primary communication interface for communications with an access node and a secondary communication interface to communicate with the proxy device. The client terminal may indicate to the access node a short cycle rate for monitoring its signaling/control channel(s). The client terminal may the power off its primary communication interface without informing the access node. Prior to powering off its primary communication interface, the client terminal may assign the proxy device to act as its proxy and monitor the signaling/control channel with the access node. The proxy device monitors the signaling/control channel(s) according to the indicated short cycle rate. Upon detection of a message for the client terminal, the proxy device forwards the message to the client terminal via a secondary communication interface.
摘要翻译：提供了一种用于在客户终端中节省功率和/或通过使用代理设备来减少无线系统中的等待时间的方案。客户端可以具有用于与接入节点进行通信的主通信接口和用于与代理设备通信的辅助通信接口。客户终端可以向接入节点指示用于监视其信令/控制信道的短周期速率。客户终端可以关闭其主通信接口，而不通知接入节点。在断电其主通信接口之前，客户终端可以分配代理设备作为其代理并且与接入节点一起监视信令/控制信道。代理设备根据指示的短周期速率来监视信令/控制信道。在检测到客户终端的消息时，代理设备经由辅助通信接口将消息转发给客户终端。

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