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    • 7. 发明授权
    • Mixed-scale electronic interface
    • 混合电子接口
    • US07692215B2
    • 2010-04-06
    • US11701086
    • 2007-01-31
    • R. Stanley WilliamsGregory S. SniderDuncan Stewart
    • R. Stanley WilliamsGregory S. SniderDuncan Stewart
    • H01L27/10H01L29/73
    • H01L29/0665B82Y10/00G11C2213/81H01H1/0094H01L27/285H01L29/0673H01L29/0676H01L51/0591H01L51/0595
    • Embodiments of the present invention are directed to mixed-scale electronic interfaces, included in integrated circuits and other electronic devices, that provide for dense electrical interconnection between microscale features of a predominantly microscale or submicroscale layer and nanoscale features of a predominantly nanoscale layer. The predominantly nanoscale layer, in one embodiment of the present invention, comprises a tessellated pattern of submicroscale or microscale pads densely interconnected by nanowire junctions between sets of parallel, closely spaced nanowire bundles. The predominantly submicroscale or microscale layer includes pins positioned complementarily to the submicroscale or microscale pads in the predominantly nanoscale layer. Pins can be configured according to any periodic tiling of the microscale layer.
    • 本发明的实施例涉及包括在集成电路和其他电子设备中的混合比例电子接口,其提供主要是微米级或亚微米级的微尺度特征之间的密集电互连以及主要为纳米尺度层的纳米尺度特征。 在本发明的一个实施方案中,主要是纳米尺度层包括通过平行的,紧密间隔的纳米线束组之间的纳米线结密合地互连的亚微米级或微米级的镶嵌图案。 主要是亚微米级或微尺度层包括与主要是纳米级层中的亚微米级或微尺度焊盘互补定位的引脚。 引脚可以根据微层的任何周期性平铺进行配置。