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    • 10. 发明授权
    • Trench isolation and method of fabricating trench isolation
    • 沟槽隔离和制造沟槽隔离的方法
    • US08012848B2
    • 2011-09-06
    • US11839585
    • 2007-08-16
    • Terence Blackwell HookJeffrey Bowman JohnsonJames Spiros Nakos
    • Terence Blackwell HookJeffrey Bowman JohnsonJames Spiros Nakos
    • H01L21/76
    • H01L21/76224H01L21/76237H01L21/76283H01L21/82H01L21/823878H01L21/823892
    • Trench isolation structure and method of forming trench isolation structures. The structures includes a trench in a silicon region of a substrate, the trench extending from a top surface of the substrate into the silicon region; an ion implantation stopping layer over sidewalls of the trench; a dielectric fill material filling remaining space in the trench, the dielectric fill material not including any materials found in the stopping layer; an N-type dopant species in a first region of the silicon region on a first side of the trench; the N-type dopant species in a first region of the dielectric material adjacent to the first side of the trench; a P-type dopant species in a second region of the silicon region on a second side of the trench; and the P-type dopant species in a second region of the dielectric material adjacent to the second side of the trench.
    • 沟槽隔离结构和形成沟槽隔离结构的方法。 所述结构包括在衬底的硅区域中的沟槽,所述沟槽从所述衬底的顶表面延伸到所述硅区域中; 在沟槽的侧壁上的离子注入停止层; 填充沟槽中的剩余空间的介电填充材料,所述介电填充材料不包括在所述停止层中发现的任何材料; 在所述沟槽的第一侧上的所述硅区域的第一区域中的N型掺杂剂物质; 所述N型掺杂剂物质在所述电介质材料的与所述沟槽的第一侧相邻的第一区域中; 在沟槽的第二侧上的硅区域的第二区域中的P型掺杂物种; 以及邻近沟槽第二侧的电介质材料的第二区域中的P型掺杂剂物质。