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1. 发明授权

US07339781B2 Electronic component and electronic device 有权
标题翻译：电子元器件及电子元器件
公开(公告)号：US07339781B2
公开(公告)日：2008-03-04
申请号：US11347367
申请日：2006-02-06
申请人： Akitoshi Yoshii , Taisuke Ahiko , Masumi Miyairi , Akio Kikuchi
发明人： Akitoshi Yoshii , Taisuke Ahiko , Masumi Miyairi , Akio Kikuchi
IPC分类号： H01G4/228
CPC分类号： H01G4/232 , H01G4/008 , H01G4/30 , H01G13/006
摘要： An electronic component having an element body, and a terminal electrode disposed on the element body. The terminal electrode has a first electrode layer, a second electrode layer, and a third electrode layer. The first electrode layer is formed on an external surface of the element body and formed by baking of a conductive paste. The second electrode layer is formed by Ni plating on the first electrode layer. The third electrode layer is formed by Sn plating or Sn alloy plating on the second electrode layer. A thickness of the second electrode layer is set in a range of not less than 5 μm, and less than 8 μm.
摘要翻译：具有元件主体的电子部件和设置在元件主体上的端子电极。端子电极具有第一电极层，第二电极层和第三电极层。第一电极层形成在元件体的外表面上，并通过烘烤导电膏形成。在第一电极层上通过Ni电镀形成第二电极层。第三电极层通过在第二电极层上的Sn电镀或Sn合金镀层形成。第二电极层的厚度设定在5μm以上且小于8μm的范围内。

2. 发明申请

US20060193103A1 Electronic component and electronic device 有权
标题翻译：电子元器件及电子元器件
公开(公告)号：US20060193103A1
公开(公告)日：2006-08-31
申请号：US11347367
申请日：2006-02-06
申请人： Akitoshi Yoshii , Taisuke Ahiko , Masumi Miyairi , Akio Kikuchi
发明人： Akitoshi Yoshii , Taisuke Ahiko , Masumi Miyairi , Akio Kikuchi
IPC分类号： H01G4/228
CPC分类号： H01G4/232 , H01G4/008 , H01G4/30 , H01G13/006
摘要： An electronic component comprises an element body, and a terminal electrode disposed on the element body. The terminal electrode has a first electrode layer, a second electrode layer, and a third electrode layer. The first electrode layer is formed on an external surface of the element body and formed by baking of a conductive paste. The second electrode layer is formed by Ni plating on the first electrode layer. The third electrode layer is formed by Sn plating or Sn alloy plating on the second electrode layer. A thickness of the second electrode layer is set in a range of not less than 5 μm, and less than 8 μm.
摘要翻译：电子部件包括元件主体和设置在元件主体上的端子电极。端子电极具有第一电极层，第二电极层和第三电极层。第一电极层形成在元件体的外表面上，并通过烘烤导电膏形成。在第一电极层上通过Ni电镀形成第二电极层。第三电极层通过在第二电极层上的Sn电镀或Sn合金镀层形成。第二电极层的厚度设定在5μm以上且小于8μm的范围内。

3. 发明授权

US07304831B2 Ceramic electronic component and multilayer capacitor 有权
标题翻译：陶瓷电子元器件和多层电容器
公开(公告)号：US07304831B2
公开(公告)日：2007-12-04
申请号：US11347296
申请日：2006-02-06
申请人： Akitoshi Yoshii , Taisuke Ahiko , Atsushi Takeda , Shirou Ootsuki , Shinya Onodera , Miki Kimura , Hiromi Kikuchi
发明人： Akitoshi Yoshii , Taisuke Ahiko , Atsushi Takeda , Shirou Ootsuki , Shinya Onodera , Miki Kimura , Hiromi Kikuchi
IPC分类号： H01G4/06
CPC分类号： H01G4/2325
摘要： A multilayer capacitor comprises a ceramic sintered body, an internal electrode disposed in the ceramic sintered body, and an external electrode disposed on an external surface of the ceramic sintered body. The external electrode has a first electrode layer formed on the external surface of the ceramic sintered body, a second electrode layer formed on the first electrode layer, and a conductive resin layer formed on the second electrode layer. The internal electrode and the first electrode layer consist primarily of a base metal. The second electrode layer consists primarily of a noble metal or a noble metal alloy. The conductive resin layer contains a noble metal or a noble metal alloy as a conductive material.
摘要翻译：多层电容器包括陶瓷烧结体，设置在陶瓷烧结体中的内部电极和设置在陶瓷烧结体的外表面上的外部电极。外部电极具有形成在陶瓷烧结体的外表面上的第一电极层，形成在第一电极层上的第二电极层和形成在第二电极层上的导电树脂层。内部电极和第一电极层主要由贱金属组成。第二电极层主要由贵金属或贵金属合金构成。导电性树脂层含有作为导电材料的贵金属或贵金属合金。

4. 发明授权

US07735713B2 Method for mounting chip component and circuit board 有权
标题翻译：芯片组件和电路板的安装方法
公开(公告)号：US07735713B2
公开(公告)日：2010-06-15
申请号：US11562644
申请日：2006-11-22
申请人： Naruki Kataoka , Taisuke Ahiko , Akitoshi Yoshii , Akira Goshima , Takashi Aoki , Tomohiro Sogabe
发明人： Naruki Kataoka , Taisuke Ahiko , Akitoshi Yoshii , Akira Goshima , Takashi Aoki , Tomohiro Sogabe
IPC分类号： B23K31/02 , H01L21/44
CPC分类号： H01L23/49816 , H01G2/065 , H01L23/49838 , H01L24/81 , H01L2224/1147 , H01L2224/1184 , H01L2224/13019 , H01L2224/16 , H01L2224/16105 , H01L2224/81024 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/014 , H01L2924/15787 , H01L2924/19041 , H05K3/3442 , H05K3/3457 , H05K3/3489 , H05K2201/0373 , H05K2201/10636 , H05K2203/0278 , H05K2203/043 , H05K2203/0485 , Y02P70/611 , Y02P70/613 , H01L2924/00
摘要： A method for mounting a chip component includes the steps of: flattening a solder deposit adhering onto a land terminal of a circuit board; forming grooves on the solder deposit simultaneously with or after flattening the solder deposit; coating the solder deposit with a flux; and placing a chip component on the solder deposit with the flux interposed therebetween.
摘要翻译：一种用于安装芯片部件的方法包括以下步骤：使粘附在电路板的焊盘端子上的焊料沉积物变平; 在焊料沉积物平坦化之后或之后在焊料沉积物上形成凹槽; 用焊剂涂覆焊料沉积物; 并且将焊料沉积物中的芯片部件放置在其间。

5. 发明申请

US20070145101A1 METHOD FOR MOUNTING CHIP COMPONENT AND CIRCUIT BOARD 有权
标题翻译：安装芯片组件和电路板的方法
公开(公告)号：US20070145101A1
公开(公告)日：2007-06-28
申请号：US11562644
申请日：2006-11-22
申请人： Naruki Kataoka , Taisuke Ahiko , Akitoshi Yoshii , Akira Goshima , Takashi Aoki , Tomohiro Sogabe
发明人： Naruki Kataoka , Taisuke Ahiko , Akitoshi Yoshii , Akira Goshima , Takashi Aoki , Tomohiro Sogabe
IPC分类号： A47J36/02
CPC分类号： H01L23/49816 , H01G2/065 , H01L23/49838 , H01L24/81 , H01L2224/1147 , H01L2224/1184 , H01L2224/13019 , H01L2224/16 , H01L2224/16105 , H01L2224/81024 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/014 , H01L2924/15787 , H01L2924/19041 , H05K3/3442 , H05K3/3457 , H05K3/3489 , H05K2201/0373 , H05K2201/10636 , H05K2203/0278 , H05K2203/043 , H05K2203/0485 , Y02P70/611 , Y02P70/613 , H01L2924/00
摘要： A method for mounting a chip component includes the steps of: flattening a solder deposit adhering onto a land terminal of a circuit board; forming grooves on the solder deposit simultaneously with or after flattening the solder deposit; coating the solder deposit with a flux; and placing a chip component on the solder deposit with the flux interposed therebetween.
摘要翻译：一种用于安装芯片部件的方法包括以下步骤：使粘附在电路板的焊盘端子上的焊料沉积物变平; 在焊料沉积物平坦化之后或之后在焊料沉积物上形成凹槽; 用焊剂涂覆焊料沉积物; 并且将焊料沉积物中的芯片部件放置在其间。

6. 发明申请

US20060187613A1 Ceramic electronic component and multilayer capacitor 有权
标题翻译：陶瓷电子元器件和多层电容器
公开(公告)号：US20060187613A1
公开(公告)日：2006-08-24
申请号：US11347296
申请日：2006-02-06
申请人： Akitoshi Yoshii , Taisuke Ahiko , Atsushi Takeda , Shirou Ootsuki , Shinya Onodera , Miki Kimura , Hiromi Kikuchi
发明人： Akitoshi Yoshii , Taisuke Ahiko , Atsushi Takeda , Shirou Ootsuki , Shinya Onodera , Miki Kimura , Hiromi Kikuchi
IPC分类号： H01G4/06
CPC分类号： H01G4/2325
摘要： A multilayer capacitor comprises a ceramic sintered body, an internal electrode disposed in the ceramic sintered body, and an external electrode disposed on an external surface of the ceramic sintered body. The external electrode has a first electrode layer formed on the external surface of the ceramic sintered body, a second electrode layer formed on the first electrode layer, and a conductive resin layer formed on the second electrode layer. The internal electrode and the first electrode layer consist primarily of a base metal. The second electrode layer consists primarily of a noble metal or a noble metal alloy. The conductive resin layer contains a noble metal or a noble metal alloy as a conductive material.
摘要翻译：多层电容器包括陶瓷烧结体，设置在陶瓷烧结体中的内部电极和设置在陶瓷烧结体的外表面上的外部电极。外部电极具有形成在陶瓷烧结体的外表面上的第一电极层，形成在第一电极层上的第二电极层和形成在第二电极层上的导电树脂层。内部电极和第一电极层主要由贱金属组成。第二电极层主要由贵金属或贵金属合金构成。导电性树脂层含有作为导电材料的贵金属或贵金属合金。

7. 发明申请

US20060126264A1 Chip-type electronic component 有权
标题翻译：片式电子元器件
公开(公告)号：US20060126264A1
公开(公告)日：2006-06-15
申请号：US11295487
申请日：2005-12-07
申请人： Akitoshi Yoshii , Taisuke Ahiko , Shirou Ootsuki , Takashi Aoki , Akira Goshima , Hiroki Houchi
发明人： Akitoshi Yoshii , Taisuke Ahiko , Shirou Ootsuki , Takashi Aoki , Akira Goshima , Hiroki Houchi
IPC分类号： H01G4/00
CPC分类号： H01G4/30 , H01G4/232
摘要： A chip-type electronic component comprises a chip element body including an inner circuit element, and a pair of terminal electrodes electrically connected to the inner circuit element. The pair of terminal electrodes are positioned at respective end portions of the chip element body. The chip element body has one side face acting as a mounting surface opposing a circuit substrate. The pair of terminal electrodes include an electrode portion formed on the mounting surface. Here, it is assumed that a first direction is a direction orthogonal to the mounting surface, a second direction is a direction along which the pair of terminal electrodes oppose each other on the mounting surface, and a third direction is a direction orthogonal to the first and second directions. A first length of the electrode portion along the second direction from an edge portion of the mounting surface at a center region in the third direction is set longer than a second length of the electrode portion along the second direction from the edge portion of the mounting surface at both end regions in the third direction.
摘要翻译：芯片型电子部件包括具有内部电路元件的芯片元件主体和与内部电路元件电连接的一对端子电极。一对端子电极位于芯片元件本体的各个端部。芯片元件主体具有作为与电路基板相对的安装面的一个侧面。一对端子电极包括形成在安装面上的电极部。这里，假设第一方向是与安装面正交的方向，第二方向是一对端子电极在安装面上彼此相对的方向，第三方向是与第一方向正交的方向和第二个方向。电极部分沿着第二方向的第一长度从安装表面的沿第三方向的中心区域的边缘部分的长度设定为比安装表面的边缘部分沿着第二方向的电极部分的第二长度长在第三方向的两端区域。

8. 发明授权

US07584853B2 Electronic component series 有权
标题翻译：电子元件系列
公开(公告)号：US07584853B2
公开(公告)日：2009-09-08
申请号：US11313620
申请日：2005-12-22
申请人： Akitoshi Yoshii , Taisuke Ahiko , Tooru Suda , Tsuyoshi Takashima , Yasushi Izumibe
发明人： Akitoshi Yoshii , Taisuke Ahiko , Tooru Suda , Tsuyoshi Takashima , Yasushi Izumibe
IPC分类号： B65D85/00
CPC分类号： H05K13/0084 , Y10S206/813
摘要： The present invention is an electronic component series, comprising a carrier tape which has a plurality of storage recesses cyclically arranged along the longitudinal direction, electronic components to be stored in the plurality of storage recesses, a cover tape established to cover the plurality of storage recesses of the carrier tape, and a pair of adhesive regions which adhere to the carrier tape and to the cover tape, and extend along the longitudinal direction of the carrier tape so as to enclose the plurality of storage recesses from both sides, wherein the adhesive width of the pair of adhesive regions is cyclically increased in size corresponding to the storage recesses respectively. With this electronic component series, the difference in the peel strength of the cover tape between the first adhesive regions and the second adhesive regions can be sufficiently reduced.
摘要翻译：本发明是一种电子部件系列，其包括载带，该载带具有沿着长度方向周期布置的多个存储凹部，要存储在多个存储凹部中的电子部件，覆盖多个存储凹部的盖带的载带，以及粘合到载带和盖带的一对粘合区域，并且沿着载带的纵向方向延伸以便从两侧包围多个存储凹部，其中粘合宽度一对粘合剂区域分别相应于储存凹槽的尺寸周期性地增加。利用该电子部件系列，可以充分降低第一粘合区域和第二粘合区域之间的覆盖带的剥离强度的差异。

9. 发明授权

US07177138B2 Chip-type electronic component 有权
标题翻译：片式电子元器件
公开(公告)号：US07177138B2
公开(公告)日：2007-02-13
申请号：US11295487
申请日：2005-12-07
申请人： Akitoshi Yoshii , Taisuke Ahiko , Shirou Ootsuki , Takashi Aoki , Akira Goshima , Hiroki Houchi
发明人： Akitoshi Yoshii , Taisuke Ahiko , Shirou Ootsuki , Takashi Aoki , Akira Goshima , Hiroki Houchi
IPC分类号： H01G4/228
CPC分类号： H01G4/30 , H01G4/232
摘要： A chip-type electronic component comprises a chip element body including an inner circuit element, and a pair of terminal electrodes electrically connected to the inner circuit element. The pair of terminal electrodes are positioned at respective end portions of the chip element body. The chip element body has one side face acting as a mounting surface opposing a circuit substrate. The pair of terminal electrodes include an electrode portion formed on the mounting surface. Here, it is assumed that a first direction is a direction orthogonal to the mounting surface, a second direction is a direction along which the pair of terminal electrodes oppose each other on the mounting surface, and a third direction is a direction orthogonal to the first and second directions. A first length of the electrode portion along the second direction from an edge portion of the mounting surface at a center region in the third direction is set longer than a second length of the electrode portion along the second direction from the edge portion of the mounting surface at both end regions in the third direction.
摘要翻译：芯片型电子部件包括具有内部电路元件的芯片元件主体和与内部电路元件电连接的一对端子电极。一对端子电极位于芯片元件本体的各个端部。芯片元件主体具有作为与电路基板相对的安装面的一个侧面。一对端子电极包括形成在安装面上的电极部。这里，假设第一方向是与安装面正交的方向，第二方向是一对端子电极在安装面上彼此相对的方向，第三方向是与第一方向正交的方向和第二个方向。电极部分沿着第二方向的第一长度从安装表面的沿第三方向的中心区域的边缘部分的长度设定为比安装表面的边缘部分沿着第二方向的电极部分的第二长度长在第三方向的两端区域。

10. 发明申请

US20060138019A1 Electronic component series 有权
公开(公告)号：US20060138019A1
公开(公告)日：2006-06-29
申请号：US11313620
申请日：2005-12-22
申请人： Akitoshi Yoshii , Taisuke Ahiko , Tooru Suda , Tsuyoshi Takashima , Yasushi Izumibe
发明人： Akitoshi Yoshii , Taisuke Ahiko , Tooru Suda , Tsuyoshi Takashima , Yasushi Izumibe
IPC分类号： B65D85/00
CPC分类号： H05K13/0084 , Y10S206/813
摘要： The present invention is an electronic component series, comprising a carrier tape which has a plurality of storage recesses cyclically arranged along the longitudinal direction, electronic components to be stored in the plurality of storage recesses, a cover tape established to cover the plurality of storage recesses of the carrier tape, and a pair of adhesive regions which adhere to the carrier tape and to the cover tape, and extend along the longitudinal direction of the carrier tape so as to enclose the plurality of storage recesses from both sides, wherein the adhesive width of the pair of adhesive regions is cyclically increased in size corresponding to the storage recesses respectively. With this electronic component series, the difference in the peel strength of the cover tape between the first adhesive regions and the second adhesive regions can be sufficiently reduced.

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