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1. 发明授权

US07175920B2 Copper foil for high-density ultra-fine printed wiring board 失效
标题翻译：铜箔用于高密度超细印刷线路板
公开(公告)号：US07175920B2
公开(公告)日：2007-02-13
申请号：US11180181
申请日：2005-07-13
申请人： Akitoshi Suzuki , Shin Fukuda , Kazuhiro Hoshino , Tadao Nakaoka
发明人： Akitoshi Suzuki , Shin Fukuda , Kazuhiro Hoshino , Tadao Nakaoka
IPC分类号： B32B15/00 , C23C28/00
CPC分类号： B32B15/08 , B32B15/20 , C25D1/04 , C25D5/10 , C25D7/0614 , H05K3/025 , Y10T428/12431 , Y10T428/12493 , Y10T428/12514 , Y10T428/12535 , Y10T428/12569 , Y10T428/12611 , Y10T428/12771 , Y10T428/12861 , Y10T428/24917 , Y10T428/31678 , Y10T428/31681
摘要： The present invention is to provide an ultra-thin copper foil with a carrier which comprises a release layer, a diffusion preventive layer and a copper electroplating layer laminated in this order, or a diffusion preventive layer, a release layer and a copper electroplating layer laminated in this order on the surface of a carrier foil, wherein a surface of the copper electroplating layer is roughened; a copper-clad laminated board comprising the ultra-thin copper foil with a carrier being laminated on a resin substrate; a printed wiring board comprising the copper-clad laminated board on the ultra-thin copper foil of which is formed a wiring pattern; and a multi-layered printed wiring board which comprising a plural number of the above printed wiring board being laminated.
摘要翻译：本发明提供一种具有载体的超薄铜箔，该载体包括依次层叠的剥离层，扩散防止层和铜电镀层，或层叠了扩散防止层，剥离层和铜电镀层依次在载体箔的表面上，其中铜电镀层的表面被粗糙化; 包括层叠在树脂基板上的具有载体的超薄铜箔的覆铜层压板; 在其超薄铜箔上形成有覆铜层压板的印刷电路板形成布线图案; 以及层叠多个上述印刷电路板的多层印刷电路板。

2. 发明授权

US07026059B2 Copper foil for high-density ultrafine printed wiring boad 失效
标题翻译：铜箔用于高密度超细印刷线路
公开(公告)号：US07026059B2
公开(公告)日：2006-04-11
申请号：US10380900
申请日：2001-09-17
申请人： Akitoshi Suzuki , Shin Fukuda , Kazuhiro Hoshino , Tadao Nakaoka
发明人： Akitoshi Suzuki , Shin Fukuda , Kazuhiro Hoshino , Tadao Nakaoka
IPC分类号： B32B15/08 , B32B9/00
CPC分类号： B32B15/08 , B32B15/20 , C25D1/04 , C25D5/10 , C25D7/0614 , H05K3/025 , Y10T428/12431 , Y10T428/12493 , Y10T428/12514 , Y10T428/12535 , Y10T428/12569 , Y10T428/12611 , Y10T428/12771 , Y10T428/12861 , Y10T428/24917 , Y10T428/31678 , Y10T428/31681
摘要： The present invention is to provide an ultra-thin copper foil with a carrier which comprises a release layer, a diffusion preventive layer and a copper electroplating layer laminated in this order, or a diffusion preventive layer, a release layer and a copper electroplating layer laminated in this order on the surface of a carrier foil, wherein a surface of the copper electroplating layer is roughened; a copper-clad laminated board comprising the ultra-thin copper foil with a carrier being laminated on a resin substrate; a printed wiring board comprising the copper-clad laminated board on the ultra-thin copper foil of which is formed a wiring pattern; and a multi-layered printed wiring board which comprising a plural number of the above printed wiring board being laminated.
摘要翻译：本发明提供一种具有载体的超薄铜箔，该载体包括依次层叠的剥离层，扩散防止层和铜电镀层，或层叠了扩散防止层，剥离层和铜电镀层依次在载体箔的表面上，其中铜电镀层的表面被粗糙化; 包括层叠在树脂基板上的具有载体的超薄铜箔的覆铜层压板; 在其超薄铜箔上形成有覆铜层压板的印刷电路板形成布线图案; 以及层叠多个上述印刷电路板的多层印刷电路板。

3. 发明申请

US20050249927A1 Copper foil for high-density ultra-fine printed wiring board 失效
标题翻译：铜箔用于高密度超细印刷线路板
公开(公告)号：US20050249927A1
公开(公告)日：2005-11-10
申请号：US11180181
申请日：2005-07-13
申请人： Akitoshi Suzuki , Shin Fukuda , Kazuhiro Hoshino , Tadao Nakaoka
发明人： Akitoshi Suzuki , Shin Fukuda , Kazuhiro Hoshino , Tadao Nakaoka
IPC分类号： B32B15/08 , B32B15/20 , C25D1/04 , C25D5/10 , C25D7/06 , H05K3/02 , B32B3/00 , B32B9/00 , B32B15/04
CPC分类号： B32B15/08 , B32B15/20 , C25D1/04 , C25D5/10 , C25D7/0614 , H05K3/025 , Y10T428/12431 , Y10T428/12493 , Y10T428/12514 , Y10T428/12535 , Y10T428/12569 , Y10T428/12611 , Y10T428/12771 , Y10T428/12861 , Y10T428/24917 , Y10T428/31678 , Y10T428/31681
摘要： The present invention is to provide an ultra-thin copper foil with a carrier which comprises a release layer, a diffusion preventive layer and a copper electroplating layer laminated in this order, or a diffusion preventive layer, a release layer and a copper electroplating layer laminated in this order on the surface of a carrier foil, wherein a surface of the copper electroplating layer is roughened; a copper-clad laminated board comprising the ultra-thin copper foil with a carrier being laminated on a resin substrate; a printed wiring board comprising the copper-clad laminated board on the ultra-thin copper foil of which is formed a wiring pattern; and a multi-layered printed wiring board which comprising a plural number of the above printed wiring board being laminated.
摘要翻译：本发明提供一种具有载体的超薄铜箔，该载体包括依次层叠的剥离层，扩散防止层和铜电镀层，或层叠了扩散防止层，剥离层和铜电镀层依次在载体箔的表面上，其中铜电镀层的表面被粗糙化; 包括层叠在树脂基板上的具有载体的超薄铜箔的覆铜层压板; 在其超薄铜箔上形成有覆铜层压板的印刷电路板形成布线图案; 以及层叠多个上述印刷电路板的多层印刷电路板。

4. 发明授权

US07172818B2 Copper foil for chip-on-film use, plasma display panel, or high-frequency printed circuit board 失效
标题翻译：用于片上胶片的铜箔，等离子体显示面板或高频印刷电路板
公开(公告)号：US07172818B2
公开(公告)日：2007-02-06
申请号：US10651099
申请日：2003-08-29
申请人： Tadao Nakaoka , Akitoshi Suzuki , Hideo Otsuka , Hisao Kimijima
发明人： Tadao Nakaoka , Akitoshi Suzuki , Hideo Otsuka , Hisao Kimijima
IPC分类号： B32B3/00 , B32B5/02 , B32B5/16 , B32B15/20
CPC分类号： C25D7/0614 , H05K1/0242 , H05K1/09 , H05K3/384 , H05K2201/0355 , H05K2203/0723 , Y10T428/12063 , Y10T428/12431 , Y10T428/12438 , Y10T428/12569 , Y10T428/12792 , Y10T428/1291 , Y10T428/12993
摘要： A copper foil for chip-on-film use, a plasma display panel, or a high-frequency printed circuit board obtained by rolling copper foil to smooth the surface to give a surface area of not more than 1.30 times an ideal smooth surface, the smoothed copper foil having deposited on it fine roughening particles of Cu or alloy particles of Cu and Mo or alloy particles comprising Cu and at least one element selected among a group of Ni, Co, Fe, and Cr or a mixture of this alloy particles and oxide of at least one element selected among a group of V, Mo, and W.
摘要翻译：一种用于膜片上使用的铜箔，等离子体显示面板或通过轧制铜箔来平滑表面以获得不超过理想平滑表面的1.30倍的表面积而获得的高频印刷电路板，在其上沉积有Cu或Cu或Mo的合金颗粒或Cu或包含Cu和选自Ni，Co，Fe和Cr中的至少一种元素的合金颗粒的Cu或细小的粗糙化颗粒的平滑化铜或该合金颗粒和选自V，Mo和W组中的至少一种元素的氧化物。

5. 发明授权

US07790269B2 Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier 有权
标题翻译：超薄铜箔带载体和印刷线路板，采用超薄铜箔带载体
公开(公告)号：US07790269B2
公开(公告)日：2010-09-07
申请号：US12205439
申请日：2008-09-05
申请人： Akitoshi Suzuki , Shin Fukuda
发明人： Akitoshi Suzuki , Shin Fukuda
IPC分类号： B32B3/10 , B32B15/20 , C25D1/04 , C25D7/06 , H05K1/09
CPC分类号： C25D7/0614 , C25D1/04 , C25D5/48 , H05K3/025 , H05K3/383 , H05K3/384 , Y10T428/12028 , Y10T428/12438 , Y10T428/12472 , Y10T428/12493 , Y10T428/12514 , Y10T428/12569 , Y10T428/12903 , Y10T428/12993 , Y10T428/24802 , Y10T428/24917 , Y10T428/265
摘要： To produce an ultra-thin copper foil with a carrier foil that microscopic crystal grains can be deposited without being affected by the surface roughness of a carrier foil, etching can be performed until an ultra-fine width such that line/space is 15 mum or less, and the microscopic line and a wiring board have large peel strength even after line of 15 mum is etched. An ultra-thin copper foil wherein a carrier foil, a peeling layer, an ultra-thin copper foil are laminated in this order, the ultra-thin copper foil (before roughening treatment is performed) is an electrolytic copper foil that surface roughness of 2.5 mum as ten point height of roughness profile, and the minimum distance between peaks of salients of a based material is 5 mum or more. Moreover, the surface of the ultra-thin copper foil is performed roughening treatment.
摘要翻译：为了制造具有载体箔的超薄铜箔，可以沉积微晶粒而不受载体箔的表面粗糙度的影响，可以进行蚀刻直到超细宽度使得线/间隔为15μm或即使在15um的线被蚀刻之后，微细线和布线板也具有较大的剥离强度。依次层叠载体箔，剥离层，超薄铜箔的超薄铜箔，超薄铜箔（进行粗糙化处理前）是表面粗糙度为2.5的电解铜箔妈妈作为十点高度的粗糙度轮廓，并且基础材料的突起峰之间的最小距离为5um以上。此外，超薄铜箔的表面进行粗糙化处理。

6. 发明申请

US20050158574A1 Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier 审中-公开
标题翻译：超薄铜箔带载体和印刷线路板，采用超薄铜箔带载体
公开(公告)号：US20050158574A1
公开(公告)日：2005-07-21
申请号：US10984896
申请日：2004-11-10
申请人： Akitoshi Suzuki , Shin Fukuda
发明人： Akitoshi Suzuki , Shin Fukuda
IPC分类号： H05K1/09 , C25D5/48 , C25D7/06 , H05K3/02 , H05K3/38 , B32B3/00
CPC分类号： C25D7/0614 , C25D1/04 , C25D5/48 , H05K3/025 , H05K3/383 , H05K3/384 , Y10T428/12028 , Y10T428/12438 , Y10T428/12472 , Y10T428/12493 , Y10T428/12514 , Y10T428/12569 , Y10T428/12903 , Y10T428/12993 , Y10T428/24802 , Y10T428/24917 , Y10T428/265
摘要： To produce an ultra-thin copper foil with a carrier foil that microscopic crystal grains can be deposited without being affected by the surface roughness of a carrier foil, etching can be performed until an ultra-fine width such that line/space is 15 μm or less, and the microscopic line and a wiring board have large peel strength even after line of 15 μm is etched. An ultra-thin copper foil wherein a carrier foil, a peeling layer, an ultra-thin copper foil are laminated in this order, the ultra-thin copper foil (before roughening treatment is performed) is an electrolytic copper foil that surface roughness of 2.5 μm as ten point height of roughness profile, and the minimum distance between peaks of salients of a based material is 5 μm or more. Moreover, the surface of the ultra-thin copper foil is performed roughening treatment.
摘要翻译：为了制造具有载体箔的超薄铜箔，可以沉积微晶粒而不受载体箔的表面粗糙度的影响，可以进行蚀刻直到超细宽度使得线/间隔为15μm或即使在15um的线被蚀刻之后，微细线和布线板也具有较大的剥离强度。依次层叠载体箔，剥离层，超薄铜箔的超薄铜箔，超薄铜箔（进行粗糙化处理前）是表面粗糙度为2.5的电解铜箔妈妈作为十点高度的粗糙度轮廓，并且基础材料的突起峰之间的最小距离为5um以上。此外，超薄铜箔的表面进行粗糙化处理。

7. 发明授权

US06835442B2 Flexible printed wiring board 失效
标题翻译：柔性印刷线路板
公开(公告)号：US06835442B2
公开(公告)日：2004-12-28
申请号：US10221442
申请日：2002-09-12
申请人： Noriaki Kudo , Asaei Takabayashi , Akitoshi Suzuki , Shin Fukuda
发明人： Noriaki Kudo , Asaei Takabayashi , Akitoshi Suzuki , Shin Fukuda
IPC分类号： B32B1500
CPC分类号： H05K3/384 , H05K1/0346 , H05K2201/0154 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , Y10S428/901 , Y10S428/935 , Y10T428/12438 , Y10T428/12569 , Y10T428/12611 , Y10T428/12903 , Y10T428/24917 , Y10T428/31681 , Y10T428/31721
摘要： A flexible printed board contains an unroughened electrodeposited copper foil, a zinc-based metallic layer provided thereon in an amount of 0.25 to 0.40 mg/dm2, and a polyimide resin layer formed through the imidation of a polyamic acid layer provided on the zinc-based metallic layer.
摘要翻译：柔性印刷电路板包含非增韧的电沉积铜箔，其上设置有0.25至0.40mg / dm 2的锌基金属层，以及通过酰亚胺化形成的聚酰亚胺树脂层锌基金属层。

8. 发明授权

US08446804B2 Disc inspecting method and disc inspecting device 失效
标题翻译：光盘检查方法和光盘检测装置
公开(公告)号：US08446804B2
公开(公告)日：2013-05-21
申请号：US13235836
申请日：2011-09-19
申请人： Hiroaki Kobayashi , Toru Aida , Akitoshi Suzuki
发明人： Hiroaki Kobayashi , Toru Aida , Akitoshi Suzuki
IPC分类号： G11B15/52
CPC分类号： G11B7/00458
摘要： A disc inspecting method includes: forming recording marks on a disc; scanning the recording marks from inside to outside or from outside to inside of the disc by a pickup unit to read a reproduction signal while rotating a spindle to move a slider by each predetermined width; acquiring reproduction data from the reproduction signal in a signal acquiring unit; and determining whether or not the reproduction data is proper in a calculation unit, and optimizing a formation condition of the recording marks when it is determined that the reproduction data is not proper.
摘要翻译：盘检查方法包括：在盘上形成记录标记; 通过拾取单元从盘内的内部或外部到外部扫描记录标记，以在旋转主轴的同时读取再现信号，以使滑块以预定的宽度移动; 在信号获取单元中从再现信号获取再现数据; 以及在计算单元中确定再现数据是否合适，以及当确定再现数据不正确时优化记录标记的形成条件。

9. 发明申请

US20130108922A1 ELECTROLYTIC COPPER FOIL, ELECTROLYTIC COPPER FOIL FOR LITHIUM ION SECONDARY BATTERY, ELECTRODE FOR LITHIUM ION SECONDARY BATTERY USING THE ELECTROLYTIC COPPER FOIL, AND LITHIUM ION SECONDARY BATTERY USING THE ELECTRODE 审中-公开
标题翻译：用于锂离子二次电池的电解铜箔，电解铜箔，使用电解铜箔的锂离子二次电池电极和使用电极的锂离子二次电池
公开(公告)号：US20130108922A1
公开(公告)日：2013-05-02
申请号：US13807137
申请日：2011-06-28
申请人： Kensaku Shinozaki , Akitoshi Suzuki
发明人： Kensaku Shinozaki , Akitoshi Suzuki
IPC分类号： H01M4/66 , H01M4/70 , H01M4/134
CPC分类号： H01M4/661 , C25D3/38 , C25D7/0614 , H01M4/13 , H01M4/134 , H01M4/662 , H01M4/70 , H01M10/0525
摘要： A lithium ion secondary battery, which uses a negative electrode wherein an active material is deposited on a collector, and which is characterized in that no wrinkles are formed on the collector, the collector does not fracture, the adhesion between the active material and the collector is high, and stable performance can be maintained for a long period of time; an electrode for the secondary battery; and an electrolytic copper foil that constitutes the electrode. Specifically disclosed is an electrolytic copper foil for a lithium ion secondary battery, in which a surface-roughened layer of copper or copper alloy particles having a particle diameter of 0.1-3 μm is formed on both surfaces of an untreated copper foil by roughening treatment by means of electrolysis, and the surface-roughened layers on both surfaces have a surface roughness Rz of 1.0-5 μm and a surface roughness Ra of 0.25-0.7 μm, with the Rz difference between the front and back surfaces being within 3 μm and the Ra differences between the front and back surfaces being within 0.3 μm.
摘要翻译：一种锂离子二次电池，其使用负极，其中活性材料沉积在集电体上，其特征在于，在集电体上不形成褶皱，集电体不会断裂，活性材料与集电体之间的粘附高性能，长时间保持稳定性能; 用于二次电池的电极; 以及构成电极的电解铜箔。具体公开了一种用于锂离子二次电池的电解铜箔，其中通过粗糙化处理在未处理的铜箔的两个表面上形成具有0.1-3μm的粒径的铜或铜合金颗粒的表面粗糙化层电解方式，两面的表面粗糙化层的表面粗糙度Rz为1.0-5μm，表面粗糙度Ra为0.25〜0.7μm，前后表面之间的Rz差在3μm以内，前后表面之间的差异在0.3μm以内。

10. 发明授权

US07656618B2 Disk device and manufacturing method therefor 失效
标题翻译：磁盘装置及其制造方法
公开(公告)号：US07656618B2
公开(公告)日：2010-02-02
申请号：US11699459
申请日：2007-01-30
申请人： Akitoshi Suzuki
发明人： Akitoshi Suzuki
IPC分类号： G11B5/54
CPC分类号： G11B5/54 , G11B21/22
摘要： According to one embodiment, a disk device includes a case having a bottom wall, a disk-shaped recording medium located in the case, a drive motor which is located in the case and supports and rotates the recording medium, a head which performs information processing for the recording medium, a head actuator, and an inertial latch mechanism which latches and holds the head actuator in a retracted position when an external force is subjected. The inertial latch mechanism is modularized and includes a base plate, a first pivot and a second pivot set up on the base plate, a latch arm supported for rocking motion around the first pivot, an inertial arm which is rockably supported on the second pivot, and a stopper portion which prevents the latch arm and the inertial arm from slipping off the first and second pivots.
摘要翻译：根据一个实施例，盘装置包括具有底壁，位于壳体中的盘形记录介质的壳体，位于壳体中并支撑并旋转记录介质的驱动马达，执行信息处理的磁头用于记录介质，头部致动器和惯性闩锁机构，其在外力受到时将头致动器锁定并保持在缩回位置。惯性闭锁机构是模块化的，包括基板，第一枢轴和设置在基板上的第二枢轴，支撑在第一枢轴周围的摆动运动的锁臂，可旋转地支撑在第二枢轴上的惯性臂，以及阻止所述闩锁臂和所述惯性臂从所述第一枢轴和所述第二枢轴滑落的止动部。

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