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1. 发明授权

US5929154A Flame retarded polystyrenic resin composition and molded article of a polystyrenic resin 失效
标题翻译：阻燃聚苯乙烯树脂组合物和聚苯乙烯树脂的模塑制品
公开(公告)号：US5929154A
公开(公告)日：1999-07-27
申请号：US793922
申请日：1997-04-07
申请人： Akitoshi Masuyama , Tohru Iwashita , Shinobu Yamao , Masami Mihara
发明人： Akitoshi Masuyama , Tohru Iwashita , Shinobu Yamao , Masami Mihara
IPC分类号： C08K3/22 , C08K3/00 , C08K3/24 , C08K5/00 , C08K5/03 , C08L25/04 , C08L25/06 , C08L53/02 , C08L101/00 , C08K3/10
CPC分类号： C08L25/06 , C08K5/03 , C08L53/02
摘要： A flame retarded polystyrenic resin composition comprising: (A) 100 parts by weight of a resin which comprises (a-1) 1 to 100% by weight of a styrenic polymer having the syndiotactic configuration, (a-2) 0 to 10% by weight of a polymer having compatibility or affinity with component (a-1) and having a polar group, and (a-3) 0 to 99% by weight of a thermoplastic resin and/or a rubbery elastomer other than components (a-1) and (a-2), (B) 2 to 100 parts by weight of a brominated diphenyl compound, (C) 0.5 to 50 parts by weight of at least one compound selected from antimony oxides, sodium antimonate, iron oxides, and zinc oxide, the ratio by weight of component (B) to component (C) being in the range of 1 to 10; a flame retarded polystyrenic resin composition comprising (D) an inorganic filler in addition to the above components; and a molded article of a polystyrenic resin prepared by using the compositions as a material. The flame retarded polystyrenic resin composition has an improved flame retarding property while the proper characteristics of syndiotactic polystyrene such as excellent heat stability, chemical resistance, and mechanical strength are maintained, realizes suppressed generation of gases and decreased attachment of-materials to molds during heat molding, and exhibits excellent heat stability so that the molded product is provided with little change in color and mechanical strength.
摘要翻译： PCT No.PCT / JP96 / 01987 Sec。 371日期1997年4月7日 102（e）1997年4月7日PCT PCT 1996年7月17日PCT公布。出版物WO97 / 04027 日期：1997年2月6日一种阻燃聚苯乙烯树脂组合物，其包含：（A）100重量份的树脂，其包含（a-1）1至100重量％的具有间同立构构型的苯乙烯聚合物，（a-2） 0〜10重量％的与组分（a-1）具有相容性或亲和性且具有极性基团的聚合物，和（a-3）0至99重量％的热塑性树脂和/或除橡胶弹性体之外的橡胶状弹性体组分（a-1）和（a-2），（B）2至100重量份溴化二苯基化合物，（C）0.5至50重量份的至少一种选自氧化锑，锑酸钠，氧化铁和氧化锌，组分（B）与组分（C）的重量比在1至10的范围内; 阻燃聚苯乙烯树脂组合物，除了上述组分外还包含（D）无机填料; 和通过使用该组合物作为材料制备的聚苯乙烯树脂的模塑制品。阻燃型聚苯乙烯树脂组合物具有改进的阻燃性能，同时保持诸如优异的热稳定性，耐化学性和机械强度的间规聚苯乙烯的适当特性，实现了热成型期间抑制气体的产生和减少材料与模具的附着。并且表现出优异的热稳定性，使得模制产品的颜色和机械强度几乎没有变化。

2. 发明授权

US06348540B1 Styrenic resin composition and semiconductor carrier device 失效
标题翻译：苯乙烯树脂组合物和半导体载体装置
公开(公告)号：US06348540B1
公开(公告)日：2002-02-19
申请号：US09291049
申请日：1999-04-14
申请人： Taizou Sugioka , Shinichi Miura , Masami Mihara , Shinobu Yamao , Masahiro Nakamichi
发明人： Taizou Sugioka , Shinichi Miura , Masami Mihara , Shinobu Yamao , Masahiro Nakamichi
IPC分类号： C08L2500
CPC分类号： H01B3/442 , C08L23/08 , C08L25/06 , C08L53/02 , C08L71/12 , H01L21/673 , C08L2666/02 , C08L2666/04
摘要： Provided is a syndiotactic polystyrenic resin composition, of which the resin moiety comprises any of (A) a syndiotactic styrenic polymer (B) a rubber-like elastomer having affinity for the component (A), (E) a polymer having compatibility with or affinity for the component (A) and having a polar group, (F) a thermoplastic resin except (A), and (G) a polyolefin having MI of at most 25, and which contains from 10 to 350 parts by weight, relative to 100 parts by weight of the resin moiety, of (C) a fibrous filler, and from 10 to 350 parts by weight, relative to the same, of (D) a tabular filler having a mean grain size of from 4 to 700 &mgr;m and a mean aspect ratio of from 12 to 120. Moldings of the composition have good impact resistance and warp little, still having good heat resistance and other good properties intrinsic to styrenic resins.
摘要翻译：提供间同立构聚苯乙烯树脂组合物，其树脂部分包含（A）间规苯乙烯系聚合物（B）对组分（A）具有亲和性的橡胶状弹性体，（E）与（A）具有相容性或亲和性的聚合物对于组分（A）并具有极性基团，（F）除（A）之外的热塑性树脂和（G）具有至多25的MI的聚烯烃，并且相对于100重量份含有10至350重量份（C）纤维状填料的重量份，相对于（D）平均粒径为4〜700μm的平板状填料为10〜350重量份，以及平均纵横比为12至120.组合物的成型具有良好的抗冲击性和翘曲，仍具有良好的耐热性和苯乙烯树脂固有的其他良好性能。

3. 发明申请

US20120225310A1 ELECTRICALLY CONDUCTIVE COMPOSITION 有权
标题翻译：电导体组成
公开(公告)号：US20120225310A1
公开(公告)日：2012-09-06
申请号：US13414159
申请日：2012-03-07
申请人： Shota TOTSUKA , Toru Bando , Shinobu Yamao , Mitsutake Nakamura
发明人： Shota TOTSUKA , Toru Bando , Shinobu Yamao , Mitsutake Nakamura
IPC分类号： H01B1/12 , B32B27/06
CPC分类号： H01B1/20 , C08G73/0266 , C08G2261/3221 , C08G2261/3223 , C08G2261/792 , C08K5/13 , C08L79/02 , C08L101/12 , H01B1/124 , Y10T428/31938
摘要： A conductive composition including:a solvent;a π-conjugated conductive polymer having a chlorine content of 0.6 wt % or less; anda compound represented by the following formula (1);wherein the π-conjugated conductive polymer is dissolved andthe weight ratio of the compound represented by the formula (1) to the π-conjugated conductive polymer (compound represented by the formula (1)/π-conjugated conductive polymer) is 0.01 to 22.0.
摘要翻译：导电组合物，包括：溶剂; 具有0.6重量％以下的氯含量的共轭导电性聚合物; 和由下式（1）表示的化合物; 其中所述共轭导电聚合物溶解，由式（1）表示的化合物与共轭导电聚合物（由式（1）表示的化合物/共轭导电聚合物）的重量比为 0.01〜22.0。

4. 发明授权

US6037422A Polyarylene sulfide resin compositions 失效
公开(公告)号：US6037422A
公开(公告)日：2000-03-14
申请号：US112986
申请日：1993-08-30
申请人： Shinobu Yamao , Wataru Kosaka
发明人： Shinobu Yamao , Wataru Kosaka
IPC分类号： C08G75/02 , C08L63/00 , C08L77/00 , C08L77/02 , C08L77/06 , C08L81/02 , C08F283/00
CPC分类号： C08L77/06 , C08G75/0222 , C08G75/029 , C08L63/00 , C08L77/00 , C08L77/02 , C08L81/02
摘要： A polyarylene sulfide resin composition contains a polyarylene sulfide containing at least one group selected from a group consisting of an amino group and an amide group, a polyamide resin, an epoxy resin and, as needed, a filler. A further composition contains 100 parts by weight of the polyarylene sulfide, 0.05 to 5 parts of the epoxy resin, and 5 to 400 parts of the filler. Another type of the resin composition contains the polyarylene sulfide, the polyamide, a compound selected from an acid, an acid anhydride and an acid halide, each having in its molecule not less than two functional groups reactive with the amino group or the amide group, and, as needed, the filler. A further type of the resin composition contains the polyarylene sulfide, the compound and, as needed, an inorganic filler subjected to surface treatment with a silane type coupling agent. A still further type of the resin composition contains the polyarylene sulfide and the compound. A still further type of the resin composition contains the polyarylene sulfide and the inorganic filler subjected to surface treatment with an epoxysilane type coupling agent.

5. 发明授权

US5733823A Prepreg for printed circuit board and substrate for printed circuit using said prepreg 失效
标题翻译：用于印刷电路板的预浸料和使用所述预浸料的印刷电路用基板
公开(公告)号：US5733823A
公开(公告)日：1998-03-31
申请号：US706691
申请日：1996-09-06
申请人： Taizou Sugioka , Shinobu Yamao
发明人： Taizou Sugioka , Shinobu Yamao
IPC分类号： B32B27/04 , C08J5/24 , C08K3/22 , C08K3/24 , C08L21/00 , C08L25/00 , C08L25/04 , C08L25/18 , C08L101/00 , H05K1/03 , B32B7/00 , B32B17/10
CPC分类号： C08J5/24 , B32B27/04 , H05K1/0373 , C08J2325/00 , H05K1/0353 , H05K2201/012 , H05K2201/0129 , H05K2201/0133 , H05K2201/0158 , H05K2201/0209 , H05K2201/0212 , Y10S428/901 , Y10T428/31518 , Y10T428/31522 , Y10T428/31627 , Y10T428/31681 , Y10T428/31761 , Y10T428/31964 , Y10T442/2418 , Y10T442/2426 , Y10T442/2475 , Y10T442/2631 , Y10T442/3447
摘要： There are provided a prepreg for a printed circuit board which comprises a glass cloth impregnated with a flame retardative resin composition comprising a (A) resin composed of a (a) styrenic polymer having syndiotactic configuration, a (b) polymer having compatibility with or affinity for the component (a) and further containing polar group, and a (c) thermoplastic resin other than the components (a) and (b) and/or a rubbery elastomer; a (B) halogenated polystyrene in which the amount of halogen atoms contained in halogen compounds generated under specific conditions is at most 1000 ppm by weight; a (C) flame retardant aid; an (D) organic filler or inorganic filler; and the above glass cloth, and also a substrate for printed circuit which comprises the prepreg or a laminate comprising a plurality of the prepregs laminated on each other, at least one side of the prepreg or laminate being laminated with a metallic layer. The above substrate is greatly improved in resistance to electrolytic corrosion and imparted with high reliability, and thus can cope with high density commercial devices.
摘要翻译：提供一种用于印刷电路板的预浸料，其包括浸渍有阻燃树脂组合物的玻璃布，所述阻燃树脂组合物包含（A）由（a）间同立构构型的（a）苯乙烯聚合物组成的树脂，（b）与（a）成分，还含有极性基团和（c）成分（a）和（b）以外的热塑性树脂和/或橡胶状弹性体; （B）卤化聚苯乙烯，其中在特定条件下产生的卤素化合物中所含的卤素原子的量为至多1000重量ppm; （C）阻燃助剂; （D）有机填料或无机填料; 以及上述玻璃布，还有一种印刷电路用基板，该基板包括预浸料或层叠有多个预浸料的层叠体，预浸料坯或层合体的至少一侧与金属层层叠。上述基板在耐电腐蚀性方面大大提高，并且具有高可靠性，因此可以应对高密度商业装置。

6. 发明授权

US5248730A Polyarylenesulfide resin compositions 失效
标题翻译：聚烯烃树脂组合物
公开(公告)号：US5248730A
公开(公告)日：1993-09-28
申请号：US803445
申请日：1991-12-06
申请人： Shinobu Yamao
发明人： Shinobu Yamao
IPC分类号： C08K7/02 , C08G59/00 , C08L9/02 , C08L15/00 , C08L63/00 , C08L81/02
CPC分类号： C08L81/02 , C08L15/00 , C08L9/02
摘要： The present invention provides:(1) a polyarylenesulfide resin composition comprising 60 to 99 wt. % of polyarylenesulfide and 40 to 1 wt. % of acrylonitrile-butadiene rubber which has been hydrogenated to the extent that the unsaturation degree is not more than 7 mol % (First Composition);( (2) a polyarylenesulfide resin composition comprising 100 parts by weight of the First Composition and 0.05 to 5 parts by weight of an epoxy resin (Second Composition);(3) a polyarylenesulfide resin composition comprising 100 parts by weight of the First Composition and 5 to 200 parts by weight of a fibrous reinforcing material and/or an inorganic filler (Third Composition); and(4) a polyarylenesulfide resin composition comprising 100 parts by weight of the Second Composition and 5 to 200 parts by weight of a fibrous reinforcing material and/or an inorganic filler (Fourth Composition). The polyarylenesulfide resin compositions according to the present invention exhibit improved impact strength without sacrificing resistance to oil and heat distortion temperature.

7. 发明申请

US20100130712A1 ADAMANTANE DERIVATIVE, RESIN COMPOSITION USING THE SAME, AND RESIN CURED PRODUCT 审中-公开
标题翻译： ADAMANTANE衍生物，使用该树脂的树脂组合物和树脂固化产品
公开(公告)号：US20100130712A1
公开(公告)日：2010-05-27
申请号：US12594254
申请日：2008-03-31
申请人： Katsuki Ito , Yasunari Okada , Hideki Yamane , Shinobu Yamao
发明人： Katsuki Ito , Yasunari Okada , Hideki Yamane , Shinobu Yamao
IPC分类号： C08F124/00 , C07D205/04
CPC分类号： C07D303/12 , C07D305/06 , C08F220/28 , C08F220/32 , C08G65/105 , C08G65/18 , C08L63/00
摘要： Provided is a cured resin of an adamantane derivative having a specific structure, which has excellent optical properties such as transparency and (long-term) light stability, long-term heat resistance, dielectric constant, and mechanical properties, and which can be utilized suitably in the field of electronic and optical materials.
摘要翻译：提供具有特定结构的金刚烷衍生物的固化树脂，其具有优异的光学性能如透明度和（长期）光稳定性，长期耐热性，介电常数和机械性能，并且可以适当地使用在电子和光学材料领域。

8. 发明授权

US5604287A Polyarylene sulfide resin composition 失效
标题翻译：聚芳硫醚树脂组合物
公开(公告)号：US5604287A
公开(公告)日：1997-02-18
申请号：US545571
申请日：1995-11-17
申请人： Shinobu Yamao
发明人： Shinobu Yamao
IPC分类号： C08K3/36 , C08K5/54 , C08L23/02 , C08L23/08 , C08L33/06 , C08L35/00 , C08L51/00 , C08L51/04 , C08L51/06 , C08L51/08 , C08L81/02 , C08K3/34
CPC分类号： C08K5/5406 , C08K3/36 , C08K5/54 , C08L23/08 , C08L51/04 , C08L51/085 , C08L81/02 , C08L23/02 , C08L33/06 , C08L35/00 , C08L51/00 , C08L51/06
摘要： A polyarylene sulfide resin composition comprising (A) a polyarylene sulfide resin, (B) silica, (C) (cl) a terpolymeric elastomer made from ethylene, an .alpha., .beta.-unsaturated carboxylate, and maleic acid anhydride and/or (c2) a graft composite elastomer which is a vinyl monomer grafted composite elastomer of polyorganosiloxane and alkyl (meth)acrylate, and (D) a mercaptosilane coupling agent, at a specific proportion. The composition exhibits superior mechanical strength and high fluidity and can be used effectively for sealing ICs and various electronic parts.
摘要翻译： PCT No.PCT / JP95 / 00443 Sec。 371日期：1985年11月17日 102（e）日期1985年11月17日PCT 1995年3月16日PCT公布。出版物WO95 / 25142 日期：1995年9月21日一种聚亚芳基硫醚树脂组合物，其包含（A）聚芳硫醚树脂，（B）二氧化硅，（C）（c）由乙烯，α，β-不饱和羧酸酯和马来酸酐制成的三元共聚弹性体， /或（c2）作为聚有机硅氧烷和（甲基）丙烯酸烷基酯的乙烯基单体接枝复合弹性体的接枝复合弹性体，（D）巯基硅烷偶联剂。该组合物表现出优异的机械强度和高流动性，并且可以有效地用于密封IC和各种电子部件。

9. 发明授权

US08535812B2 Electrically conductive composition 有权
标题翻译：导电组合物
公开(公告)号：US08535812B2
公开(公告)日：2013-09-17
申请号：US13414159
申请日：2012-03-07
申请人： Shota Totsuka , Toru Bando , Shinobu Yamao , Mitsutake Nakamura
发明人： Shota Totsuka , Toru Bando , Shinobu Yamao , Mitsutake Nakamura
IPC分类号： B32B27/32 , H01B1/00
CPC分类号： H01B1/20 , C08G73/0266 , C08G2261/3221 , C08G2261/3223 , C08G2261/792 , C08K5/13 , C08L79/02 , C08L101/12 , H01B1/124 , Y10T428/31938
摘要： A conductive composition including: a solvent; a π-conjugated conductive polymer having a chlorine content of 0.6 wt % or less; and a compound represented by the following formula (1); wherein the π-conjugated conductive polymer is dissolved and the weight ratio of the compound represented by the formula (1) to the π-conjugated conductive polymer (compound represented by the formula (1)/π-conjugated conductive polymer) is 0.01 to 22.0.
摘要翻译：导电组合物，包括：溶剂; 氯含量为0.6重量％以下的π共轭导电性聚合物; 和由下式（1）表示的化合物; 其中，π共轭导电性聚合物溶解，式（1）表示的化合物与由π-共轭导电性聚合物（式（1）表示的化合物/π-共轭导电性聚合物）的重量比为0.01〜22.0 。

10. 发明授权

US6117950A Polyarylene sulfide resin compositions 失效
标题翻译：聚芳硫醚树脂组合物
公开(公告)号：US6117950A
公开(公告)日：2000-09-12
申请号：US412987
申请日：1999-10-06
申请人： Shinobu Yamao , Wataru Kosaka
发明人： Shinobu Yamao , Wataru Kosaka
IPC分类号： C08G75/02 , C08L63/00 , C08L77/00 , C08L77/02 , C08L77/06 , C08L81/02 , C08F283/00
CPC分类号： C08L77/06 , C08G75/0222 , C08G75/029 , C08L63/00 , C08L77/00 , C08L77/02 , C08L81/02
摘要： A polyarylene sulfide resin composition contains a polyarylene sulfide containing at least one group selected from a group consisting of an amino group and an amide group, a polyamide resin, an epoxy resin and, as needed, a filler. A further composition contains 100 parts by weight of the polyarylene sulfide, 0.05 to 5 parts of the epoxy resin, and 5 to 400 parts of the filler. Another type of the resin composition contains the polyarylene sulfide, the polyamide, a compound selected from an acid, an acid anhydride and an acid halide, each having in its molecule not less than two functional groups reactive with the amino group or the amide group, and, as needed, the filler. A further type of the resin composition contains the polyarylene sulfide, the compound and, as needed, an inorganic filler subjected to surface treatment with a silane type coupling agent. A still further type of the resin composition contains the polyarylene sulfide and the compound. A still further type of the resin composition contains the polyarylene sulfide and the inorganic filler subjected to surface treatment with an epoxysilane type coupling agent.
摘要翻译：聚芳硫醚树脂组合物包含含有选自氨基和酰胺基中的至少一个基团的聚芳硫醚，聚酰胺树脂，环氧树脂和根据需要的填料。另外的组合物含有聚芳撑硫醚100重量份，环氧树脂0.05〜5重量份，填料5〜400重量份。另一种类型的树脂组合物含有聚亚芳基硫醚，聚酰胺，选自酸，酸酐和酰卤的化合物，其分子中不少于两个与氨基或酰胺基反应的官能团，并根据需要填充。另一种类型的树脂组合物包含聚芳硫醚，该化合物和根据需要的用硅烷型偶联剂进行表面处理的无机填料。另一种类型的树脂组合物含有聚芳硫醚和该化合物。另一种类型的树脂组合物包含用环氧硅烷型偶联剂进行表面处理的聚芳硫醚和无机填料。

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