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    • 5. 发明授权
    • Thick film thermal printing head
    • 厚膜热敏打印头
    • US5359351A
    • 1994-10-25
    • US671083
    • 1991-03-18
    • Kazutaka SatoMichihiro WatanabeShogo MatsumotoHiroyuki Tobita
    • Kazutaka SatoMichihiro WatanabeShogo MatsumotoHiroyuki Tobita
    • B41J2/345B41J2/335
    • B41J2/345H01L2224/05554H01L2224/49175
    • A thick film thermal printing head having a substrate, an insulating glaze layer formed on the substrate, a heating resistor formed into a straight elongated shape, a driver IC for controlling energization of the heating resistor, a plurality of first lead wires for connection between the heating resistor and the driver IC, a common electrode serving as an intermediate power supply point through which electric power is supplied to the heating resistor, and a plurality of second lead wires for connection between the heating resistor and the common electrode, the first and second lead wires are alternately disposed parallel to each other, at least the first lead wires, the second lead wires and the common electrode being formed on the glaze layer. The heating resistor is formed in the vicinity of an end surface of the substrate, and the lead wires, the common electrode and the driver IC and other components are suitably arranged to form a thick film thermal printing head structure having no insulating interlayer and no through holes at the connection between the lead wires and the common electrode, enabling simplification of the manufacture process and a reduction in the manufacture cost. It is also possible to improve the printing performance of a thermal transfer facsimile apparatus or thermal transfer printer as well as to reduce the size thereof by using the thick film thermal printing head of the present invention.
    • 一种厚膜热敏打印头,其具有基板,形成在基板上的绝缘釉层,形成为直的细长形状的加热电阻器,用于控制加热电阻器的通电的驱动器IC,用于连接加热电阻器的多个第一引线 加热电阻器和驱动器IC,作为用于向加热电阻器供电的中间电源点的公共电极以及用于在加热电阻器和公共电极之间连接的多个第二引线,第一和第二 引线彼此平行地交替布置,至少第一引线,第二引线和公共电极形成在釉层上。 加热电阻器形成在基板的端面附近,并且引线,公共电极和驱动器IC等部件适当地布置成形成不具有绝缘夹层和不通过的厚膜热敏打印头结构 引线和公共电极之间的连接处的孔,能够简化制造工艺并降低制造成本。 也可以通过使用本发明的厚膜热敏打印头来提高热转印传真装置或热转印打印机的打印性能以及减小其尺寸。