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1. 发明授权

US09000442B2 Light-emitting device, flexible light-emitting device, electronic device, and method for manufacturing light-emitting device and flexible-light emitting device 有权
标题翻译：发光装置，柔性发光装置，电子装置以及制造发光装置和柔性发光装置的方法
公开(公告)号：US09000442B2
公开(公告)日：2015-04-07
申请号：US13005766
申请日：2011-01-13
申请人： Kaoru Hatano , Takaaki Nagata , Nozomu Sugisawa , Tatsuya Okano , Akihiro Chida , Tatsunori Inoue
发明人： Kaoru Hatano , Takaaki Nagata , Nozomu Sugisawa , Tatsuya Okano , Akihiro Chida , Tatsunori Inoue
IPC分类号： H01L27/14 , H01L27/12
CPC分类号： H01L27/1266 , H01L27/1225
摘要： To simply provide a flexible light-emitting device with long lifetime. To provide a flexible light-emitting device with favorable display characteristics, high yield, and high reliability without display unevenness. Provided is a flexible light-emitting device including: a substrate having flexibility and a property of transmitting visible light; an adhesive layer provided over the substrate; a conductive layer having a property of transmitting visible light provided over the adhesive layer; an insulating layer disposed over the conductive layer; a transistor provided over the insulating layer; an interlayer insulating layer covering the transistor, a light-emitting element including a first electrode electrically connected to source or drain electrodes of the transistor and provided over the interlayer insulating layer, a second electrode facing the first electrode, and a layer including an organic compound having a light-emitting property provided between the first and second electrodes; and a sealing layer covering the light-emitting element.
摘要翻译：简单地提供具有长寿命的柔性发光装置。提供具有良好的显示特性，高产率和高可靠性的柔性发光装置，而不会出现显示不均匀。提供一种柔性发光装置，包括：具有柔性的透射可见光的特性的基板; 设置在所述基板上的粘合层; 导电层，其具有透射在所述粘合剂层上方提供的可见光的性质; 设置在所述导电层上的绝缘层; 设置在所述绝缘层上的晶体管; 覆盖晶体管的层间绝缘层，发光元件，包括电连接到晶体管的源极或漏极并设置在层间绝缘层上的第一电极，面对第一电极的第二电极和包含有机化合物的层具有设置在第一和第二电极之间的发光特性; 以及覆盖发光元件的密封层。

2. 发明授权

US07888163B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07888163B2
公开(公告)日：2011-02-15
申请号：US12473299
申请日：2009-05-28
申请人： Akihiro Chida , Takaaki Nagata
发明人： Akihiro Chida , Takaaki Nagata
IPC分类号： H01L21/00
CPC分类号： H01L23/49855 , H01L21/561 , H01L21/568 , H01L23/293 , H01L23/295 , H01L23/3114 , H01L23/5389 , H01L23/60 , H01L25/50 , H01L2223/6677 , H01L2224/16 , H01L2924/12044
摘要： An object is to increase resistance against an electrostatic breakdown and to increase resistance to an external stress. Another object is to reduce cost by simplifying the manufacturing process. In a step in which an element formation layer is provided between a first organic resin layer provided with a first conductive film on its surface and a second organic resin layer provided with a second conductive film on its surface to electrically connect the first conductive film and the second conductive film with a contact conductor formed in each of the organic resin layers, the contact conductor provided in each of the first organic resin layer and the second organic resin layer is manufactured by making paste penetrate before an organic resin is cured and then curing the organic resin layer.
摘要翻译：目的是提高抗静电击穿的阻力并增加对外部应力的抵抗力。另一个目的是通过简化制造过程来降低成本。在其表面上设置有第一导电膜的第一有机树脂层和其表面上设置有第二导电膜的第二有机树脂层之间设置元件形成层以将第一导电膜和第二导电膜电连接的步骤在每个有机树脂层中形成有接触导体的第二导电膜，通过在有机树脂固化之前使糊状物渗透，然后固化所述第一有机树脂层和第二有机树脂层中的每一个中的接触导体有机树脂层。

3. 发明申请

US20100045919A1 Flexible Light-Emitting Device, and Method for Fabricating the Same 有权
标题翻译：柔性发光装置及其制造方法
公开(公告)号：US20100045919A1
公开(公告)日：2010-02-25
申请号：US12538975
申请日：2009-08-11
申请人： Akihiro Chida , Kaoru Hatano , Takaaki Nagata , Satoshi Seo
发明人： Akihiro Chida , Kaoru Hatano , Takaaki Nagata , Satoshi Seo
IPC分类号： G02F1/1345 , H01L33/00
CPC分类号： H01L27/1266 , H01L27/1225 , H01L27/124 , H01L27/1248 , H01L27/3244 , H01L27/3248 , H01L27/3276 , H01L51/56 , H01L2227/326 , H01L2251/5338
摘要： Provided is a flexible light-emitting device including: a base insulating film; a thin film transistor formed over a first surface of the base insulating film; an interlayer insulating film formed over the first surface of the base insulating film with the thin film transistor interposed therebetween; a first pixel electrode formed on a second surface of the base insulating film opposite to the first surface; an electroluminescent layer formed on the second surface of the base insulating film with the first pixel electrode interposed therebetween; a second pixel electrode formed on the second surface of the base insulating film with the first pixel electrode and the electroluminescent layer interposed therebetween; and a wiring electrically connected to a semiconductor layer of the thin film transistor in a contact hole provided in the interlayer insulating film and electrically connected to the first pixel electrode in a through-hole penetrating through at least the interlayer insulating film and the base insulating film.
摘要翻译：提供一种柔性发光装置，包括：基底绝缘膜; 形成在所述基底绝缘膜的第一表面上的薄膜晶体管; 在所述基底绝缘膜的所述第一表面上形成有夹在其间的薄膜晶体管的层间绝缘膜; 形成在与第一表面相对的基底绝缘膜的第二表面上的第一像素电极; 形成在所述基底绝缘膜的第二表面上的电致发光层，其间插入有所述第一像素电极; 形成在所述基底绝缘膜的所述第二表面上的第二像素电极，其间插入有所述第一像素电极和所述电致发光层; 以及布线，电连接到所述薄膜晶体管的半导体层，所述接触孔设置在所述层间绝缘膜中，并且至少贯穿至少所述层间绝缘膜和所述基底绝缘膜的通孔中与所述第一像素电极电连接。

4. 发明授权

US08555497B2 Manufacturing method of a wiring substrate 有权
标题翻译：布线基板的制造方法
公开(公告)号：US08555497B2
公开(公告)日：2013-10-15
申请号：US12485957
申请日：2009-06-17
申请人： Kaoru Hatano , Akihiro Chida , Takaaki Nagata , Masayuki Sakakura
发明人： Kaoru Hatano , Akihiro Chida , Takaaki Nagata , Masayuki Sakakura
IPC分类号： H01R43/00
CPC分类号： H01L27/1266 , G06K19/07745 , G06K19/07747 , G06K19/07749 , G06K19/0775 , H01L21/6835 , H01L23/145 , H01L23/49827 , H01L23/5389 , H01L27/1218 , H01L2221/6835 , H01L2924/0002 , H01L2924/12044 , H01L2924/14 , H01L2924/19041 , H01L2924/3025 , H05K1/0366 , H05K3/002 , H05K3/4069 , H05K3/4644 , H05K2203/1163 , Y10T29/49126 , Y10T29/49169 , H01L2924/00
摘要： To form a conductive region in a prepreg without opening a through hole in a fibrous body. A wiring substrate is provided, including: an organic resin layer and a fibrous body, wherein the fibrous body is impregnated with the organic resin layer; and a wiring with which the fibrous body is impregnated and which is formed by dissolving the organic resin layer. The wiring is exposed on both surfaces of the organic resin layer and penetrates the fibrous body so that the fibrous body is positioned in the through wiring. Further, a semiconductor device is provided by adhering an integrated circuit chip having a bump to the wiring substrate so that the bump is in contact with the wiring.
摘要翻译：在预浸料坯中形成导电区域，而不在纤维体内打开通孔。提供一种布线基板，包括：有机树脂层和纤维体，其中所述纤维体浸渍有机树脂层; 以及纤维体浸渍并通过溶解有机树脂层而形成的布线。布线暴露在有机树脂层的两个表面上并穿透纤维体，使得纤维体位于贯通布线中。此外，通过将具有凸块的集成电路芯片粘附到布线基板以使得凸块与布线接触来提供半导体器件。

5. 发明授权

US08284369B2 Flexible light-emitting device, and method for fabricating the same 有权
标题翻译：柔性发光装置及其制造方法
公开(公告)号：US08284369B2
公开(公告)日：2012-10-09
申请号：US12538975
申请日：2009-08-11
申请人： Akihiro Chida , Kaoru Hatano , Takaaki Nagata , Satoshi Seo
发明人： Akihiro Chida , Kaoru Hatano , Takaaki Nagata , Satoshi Seo
IPC分类号： G02F1/1345 , B60Q1/14 , H01L21/00
CPC分类号： H01L27/1266 , H01L27/1225 , H01L27/124 , H01L27/1248 , H01L27/3244 , H01L27/3248 , H01L27/3276 , H01L51/56 , H01L2227/326 , H01L2251/5338
摘要： Provided is a flexible light-emitting device including: a base insulating film; a thin film transistor formed over a first surface of the base insulating film; an interlayer insulating film formed over the first surface of the base insulating film with the thin film transistor interposed therebetween; a first pixel electrode formed on a second surface of the base insulating film opposite to the first surface; an electroluminescent layer formed on the second surface of the base insulating film with the first pixel electrode interposed therebetween; a second pixel electrode formed on the second surface of the base insulating film with the first pixel electrode and the electroluminescent layer interposed therebetween; and a wiring electrically connected to a semiconductor layer of the thin film transistor in a contact hole provided in the interlayer insulating film and electrically connected to the first pixel electrode in a through-hole penetrating through at least the interlayer insulating film and the base insulating film.
摘要翻译：提供一种柔性发光装置，包括：基底绝缘膜; 形成在所述基底绝缘膜的第一表面上的薄膜晶体管; 在所述基底绝缘膜的所述第一表面上形成有夹在其间的薄膜晶体管的层间绝缘膜; 形成在与第一表面相对的基底绝缘膜的第二表面上的第一像素电极; 形成在所述基底绝缘膜的第二表面上的电致发光层，其间插入有所述第一像素电极; 形成在所述基底绝缘膜的所述第二表面上的第二像素电极，其间插入有所述第一像素电极和所述电致发光层; 以及布线，电连接到所述薄膜晶体管的半导体层，所述接触孔设置在所述层间绝缘膜中，并且至少贯穿至少所述层间绝缘膜和所述基底绝缘膜的通孔中与所述第一像素电极电连接。

6. 发明申请

US20090302455A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20090302455A1
公开(公告)日：2009-12-10
申请号：US12473299
申请日：2009-05-28
申请人： Akihiro Chida , Takaaki Nagata
发明人： Akihiro Chida , Takaaki Nagata
IPC分类号： H01L23/538 , H01L21/56 , H01L21/768
CPC分类号： H01L23/49855 , H01L21/561 , H01L21/568 , H01L23/293 , H01L23/295 , H01L23/3114 , H01L23/5389 , H01L23/60 , H01L25/50 , H01L2223/6677 , H01L2224/16 , H01L2924/12044
摘要： An object is to increase resistance against an electrostatic breakdown and to increase resistance to an external stress. Another object is to reduce cost by simplifying the manufacturing process. In a step in which an element formation layer is provided between a first organic resin layer provided with a first conductive film on its surface and a second organic resin layer provided with a second conductive film on its surface to electrically connect the first conductive film and the second conductive film with a contact conductor formed in each of the organic resin layers, the contact conductor provided in each of the first organic resin layer and the second organic resin layer is manufactured by making paste penetrate before an organic resin is cured and then curing the organic resin layer.
摘要翻译：目的是提高抗静电击穿的阻力并增加对外部应力的抵抗力。另一个目的是通过简化制造过程来降低成本。在其表面上设置有第一导电膜的第一有机树脂层和其表面上设置有第二导电膜的第二有机树脂层之间设置元件形成层以将第一导电膜和第二导电膜电连接的步骤在每个有机树脂层中形成有接触导体的第二导电膜，通过在有机树脂固化之前使糊状物渗透，然后固化所述第一有机树脂层和第二有机树脂层中的每一个中的接触导体有机树脂层。

7. 发明授权

US08597965B2 Light-emitting device and electronic device using the light-emitting device 有权
标题翻译：发光装置和使用发光装置的电子装置
公开(公告)号：US08597965B2
公开(公告)日：2013-12-03
申请号：US13467166
申请日：2012-05-09
申请人： Kaoru Hatano , Akihiro Chida , Akihisa Shimomura , Shunpei Yamazaki
发明人： Kaoru Hatano , Akihiro Chida , Akihisa Shimomura , Shunpei Yamazaki
IPC分类号： H01L21/00 , H01L33/00
CPC分类号： H01L27/3246 , H01L51/0024 , H01L51/003 , H01L51/525 , H01L51/56
摘要： An object is to provide a method for manufacturing a light-emitting device including a flexible substrate, in which separation is performed without separation at the interface between the light-emitting layer and the electrode. A spacer formed of a light absorbing material which absorbs laser light is formed over a partition of one of substrates, a coloring layer is formed over the other substrate, and the substrates are bonded to each other with the use of a bonding layer. The light-emitting layer and the electrode which are formed over the spacer are irradiated with laser light through the coloring layer, so that at least the bonding layer among the light-emitting layer, the electrode, the coloring layer, and the bonding layer is melted to form a fixed portion where the bonding layer and the spacer are bonded by welding.
摘要翻译：本发明的目的是提供一种制造包括柔性基板的发光装置的方法，其中在发光层和电极之间的界面处进行分离而不分离。由吸收激光的吸光材料形成的间隔物形成在一个基板的隔板上，在另一个基板上形成着色层，并且通过使用接合层将基板彼此接合。通过着色层，用激光照射在间隔物上形成的发光层和电极，使得至少发光层，电极，着色层和接合层的结合层为熔化以形成固定部分，其中粘合层和间隔物通过焊接结合。

8. 发明授权

US08044499B2 Wiring substrate, manufacturing method thereof, semiconductor device, and manufacturing method thereof 有权
标题翻译：配线基板及其制造方法，半导体装置及其制造方法
公开(公告)号：US08044499B2
公开(公告)日：2011-10-25
申请号：US12465703
申请日：2009-05-14
申请人： Akihiro Chida , Tomoyuki Aoki
发明人： Akihiro Chida , Tomoyuki Aoki
IPC分类号： H01L23/48 , H01L21/00
CPC分类号： H05K3/4647 , H01L21/6835 , H01L23/3733 , H01L27/124 , H01L27/1266 , H01L29/78603 , H01L2221/6835 , H01L2224/29499 , H01L2924/01067 , H01L2924/01068 , H01L2924/01079 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/19043 , H01L2924/3025 , H05K1/0366 , H05K3/4069 , H05K2201/029 , H05K2203/1147 , Y10T442/2418 , H01L2924/00
摘要： A wiring substrate is provided, including an insulating resin layer which is provided on both surfaces of a sheet-like fibrous body and with which the sheet-like fibrous body is impregnated, and a through wiring provided in a region surrounded by the insulating resin layer. The through wiring is formed using a conductive material, the conductive material is exposed on both surfaces of the insulating resin layer, the sheet-like fibrous body is positioned in the conductive material, and the sheet-like fibrous body is impregnated with the conductive material. A manufacturing method of the wiring substrate is also provided.
摘要翻译：提供了一种布线基板，包括设置在片状纤维体的两个表面上且被片状纤维体浸渍的绝缘树脂层，以及设置在由绝缘树脂层围绕的区域中的通孔。贯通布线使用导电材料形成，导电材料暴露在绝缘树脂层的两个表面上，片状纤维体位于导电材料中，并且片状纤维体浸渍有导电材料。还提供了布线基板的制造方法。

9. 发明授权

US07398864B2 Elevator controller 有权
标题翻译：电梯控制器
公开(公告)号：US07398864B2
公开(公告)日：2008-07-15
申请号：US10572351
申请日：2004-05-24
申请人： Akihiro Chida
发明人： Akihiro Chida
IPC分类号： B66B1/00 , B66B1/34
CPC分类号： B66B5/0031
摘要： In an elevator control apparatus, a power supply voltage monitoring circuit monitors a power supply voltage supplied to a processing portion. A voltage monitoring soundness checking function circuit outputs a monitoring input voltage forcible change signal for forcibly changing a power supply voltage input to the power supply voltage monitoring circuit in response to a control signal from the processing portion. A voltage abnormality detection signal from the power supply voltage monitoring circuit is input to the voltage monitoring soundness checking function circuit. The processing portion checks the soundness of the power supply voltage monitoring circuit by reading data held by the voltage monitoring soundness checking function circuit.
摘要翻译：在电梯控制装置中，电源电压监视电路监视供给到处理部的电源电压。电压监视声音检查功能电路响应于来自处理部分的控制信号输出监视输入电压强制变化信号，强制变更输入到电源电压监视电路的电源电压。来自电源电压监视电路的电压异常检测信号被输入到电压监视正确性检查功能电路。处理部通过读取由电压监视健全性检查功能电路保持的数据来检查电源电压监视电路的健全性。

10. 发明授权

US06405834B1 Elevator maintenance/operation apparatus 有权
标题翻译：电梯维修/操作装置
公开(公告)号：US06405834B1
公开(公告)日：2002-06-18
申请号：US09856249
申请日：2001-05-18
申请人： Akihiro Chida , Junichiro Ishikawa , Shigeki Yamakawa , Hiroshi Ando , Kunio Katou
发明人： Akihiro Chida , Junichiro Ishikawa , Shigeki Yamakawa , Hiroshi Ando , Kunio Katou
IPC分类号： B66B1108
CPC分类号： B66B11/001 , B66B1/46 , B66B1/466 , B66B1/467 , B66B5/0087
摘要： In a maintenance driving control apparatus of an elevator, switches and other components operated at the time of maintenance are separated from a control panel and combined in a driving operation panel. A maintenance operation panel having this driving operation panel and at least one of a brake release device for remote operation, a meter for indicating a voltage of a speed generator, and car position confirmation unit utilizing movement of a rope or some other member is provided in the vicinity of an elevator hall. The maintenance driving control apparatus enables maintenance operations without directly operating the control panel or a hoisting machine.
摘要翻译：在电梯的维修驱动控制装置中，在维护时操作的开关等部件与控制面板分离，并组合在驱动操作面板中。具有该驱动操作面板的维护操作面板和用于远程操作的制动器释放装置中的至少一个，用于指示速度发生器的电压的仪表以及利用绳索或其它构件的移动的轿厢位置确认单元电梯大厅附近。维护驱动控制装置能够在不直接操作控制面板或起重机的情况下进行维护操作。

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