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    • 2. 发明申请
    • Flexible Light-Emitting Device, and Method for Fabricating the Same
    • 柔性发光装置及其制造方法
    • US20100045919A1
    • 2010-02-25
    • US12538975
    • 2009-08-11
    • Akihiro ChidaKaoru HatanoTakaaki NagataSatoshi Seo
    • Akihiro ChidaKaoru HatanoTakaaki NagataSatoshi Seo
    • G02F1/1345H01L33/00
    • H01L27/1266H01L27/1225H01L27/124H01L27/1248H01L27/3244H01L27/3248H01L27/3276H01L51/56H01L2227/326H01L2251/5338
    • Provided is a flexible light-emitting device including: a base insulating film; a thin film transistor formed over a first surface of the base insulating film; an interlayer insulating film formed over the first surface of the base insulating film with the thin film transistor interposed therebetween; a first pixel electrode formed on a second surface of the base insulating film opposite to the first surface; an electroluminescent layer formed on the second surface of the base insulating film with the first pixel electrode interposed therebetween; a second pixel electrode formed on the second surface of the base insulating film with the first pixel electrode and the electroluminescent layer interposed therebetween; and a wiring electrically connected to a semiconductor layer of the thin film transistor in a contact hole provided in the interlayer insulating film and electrically connected to the first pixel electrode in a through-hole penetrating through at least the interlayer insulating film and the base insulating film.
    • 提供一种柔性发光装置,包括:基底绝缘膜; 形成在所述基底绝缘膜的第一表面上的薄膜晶体管; 在所述基底绝缘膜的所述第一表面上形成有夹在其间的薄膜晶体管的层间绝缘膜; 形成在与第一表面相对的基底绝缘膜的第二表面上的第一像素电极; 形成在所述基底绝缘膜的第二表面上的电致发光层,其间插入有所述第一像素电极; 形成在所述基底绝缘膜的所述第二表面上的第二像素电极,其间插入有所述第一像素电极和所述电致发光层; 以及布线,电连接到所述薄膜晶体管的半导体层,所述接触孔设置在所述层间绝缘膜中,并且至少贯穿至少所述层间绝缘膜和所述基底绝缘膜的通孔中与所述第一像素电极电连接 。
    • 3. 发明授权
    • Flexible light-emitting device, and method for fabricating the same
    • 柔性发光装置及其制造方法
    • US08284369B2
    • 2012-10-09
    • US12538975
    • 2009-08-11
    • Akihiro ChidaKaoru HatanoTakaaki NagataSatoshi Seo
    • Akihiro ChidaKaoru HatanoTakaaki NagataSatoshi Seo
    • G02F1/1345B60Q1/14H01L21/00
    • H01L27/1266H01L27/1225H01L27/124H01L27/1248H01L27/3244H01L27/3248H01L27/3276H01L51/56H01L2227/326H01L2251/5338
    • Provided is a flexible light-emitting device including: a base insulating film; a thin film transistor formed over a first surface of the base insulating film; an interlayer insulating film formed over the first surface of the base insulating film with the thin film transistor interposed therebetween; a first pixel electrode formed on a second surface of the base insulating film opposite to the first surface; an electroluminescent layer formed on the second surface of the base insulating film with the first pixel electrode interposed therebetween; a second pixel electrode formed on the second surface of the base insulating film with the first pixel electrode and the electroluminescent layer interposed therebetween; and a wiring electrically connected to a semiconductor layer of the thin film transistor in a contact hole provided in the interlayer insulating film and electrically connected to the first pixel electrode in a through-hole penetrating through at least the interlayer insulating film and the base insulating film.
    • 提供一种柔性发光装置,包括:基底绝缘膜; 形成在所述基底绝缘膜的第一表面上的薄膜晶体管; 在所述基底绝缘膜的所述第一表面上形成有夹在其间的薄膜晶体管的层间绝缘膜; 形成在与第一表面相对的基底绝缘膜的第二表面上的第一像素电极; 形成在所述基底绝缘膜的第二表面上的电致发光层,其间插入有所述第一像素电极; 形成在所述基底绝缘膜的所述第二表面上的第二像素电极,其间插入有所述第一像素电极和所述电致发光层; 以及布线,电连接到所述薄膜晶体管的半导体层,所述接触孔设置在所述层间绝缘膜中,并且至少贯穿至少所述层间绝缘膜和所述基底绝缘膜的通孔中与所述第一像素电极电连接 。
    • 5. 发明授权
    • Light-emitting device and electronic device using light-emitting device
    • 发光装置和使用发光装置的电子装置
    • US09337244B2
    • 2016-05-10
    • US13404692
    • 2012-02-24
    • Kaoru HatanoSatoshi SeoAkihiro ChidaYoshiaki Oikawa
    • Kaoru HatanoSatoshi SeoAkihiro ChidaYoshiaki Oikawa
    • H01L33/08H01L27/32H01L51/52
    • H01L27/3246H01L51/525
    • Provided is a highly reliable light-emitting device in which a light-emitting element is prevented from being damaged when external physical force is applied. The light-emitting device includes a light-emitting element formed over a first substrate, including a first electrode layer, a light-emitting layer, and a second electrode layer; a structure body formed over the first substrate; a second substrate provided to face the first substrate; and a bonding layer provided between the first substrate and the second substrate. The light-emitting layer is separated by the structure body. By strengthening adhesion between the structure body and the bonding layer, or between the structure body and the second electrode, the highly reliable light-emitting device in which damage of the light-emitting element is prevented can be provided.
    • 提供了一种高度可靠的发光装置,其中当施加外部物理力时防止发光元件被损坏。 发光装置包括形成在第一基板上的发光元件,包括第一电极层,发光层和第二电极层; 形成在所述第一基板上的结构体; 设置成面对第一基板的第二基板; 以及设置在第一基板和第二基板之间的接合层。 发光层被结构体分开。 通过加强结构体与结合层之间或结构体与第二电极之间的粘附性,可以提供防止发光元件损坏的高度可靠的发光装置。
    • 7. 发明授权
    • Separation apparatus, separation method, and method for manufacturing semiconductor element
    • 分离装置,分离方法以及半导体元件的制造方法
    • US08409973B2
    • 2013-04-02
    • US13168059
    • 2011-06-24
    • Akihiro ChidaKaoru Hatano
    • Akihiro ChidaKaoru Hatano
    • H01L21/304
    • H01L27/1266H01L21/67092H01L21/6838H01L21/68735H01L27/1214Y10T156/1906
    • Objects are to reduce the number of steps in a process for separating a substrate and a semiconductor element, to provide a separation apparatus capable of reducing the number of steps, to suppress manufacturing cost by reducing the number of steps in a separation process, and to improve productivity in manufacturing semiconductor elements. A separation apparatus including a frame body, a porous body having a chamfered, rounded corner portion, a suction unit configured to create suction in the porous body and the frame body, and a jig which includes a unit adopted to press down part of an object to be separated and a unit adopted to lift another part of the object to be separated, and also a separation method and a method for manufacturing a semiconductor element by using the separation apparatus, are provided.
    • 目的是减少用于分离衬底和半导体元件的工艺中的步骤数量,以提供能够减少步骤数量的分离装置,通过减少分离工艺中的步骤数来抑制制造成本,以及 提高制造半导体元件的生产率。 一种分离装置,包括框体,具有倒角的圆角部分的多孔体,构造成在多孔体和框体中产生吸力的吸引单元,以及包括用于将物体的一部分压下的单元的夹具 以及用于提升要分离的物体的另一部分的单元,还提供了使用分离装置制造半导体元件的分离方法和方法。