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1. 发明申请

US20100045919A1 Flexible Light-Emitting Device, and Method for Fabricating the Same 有权
标题翻译：柔性发光装置及其制造方法
公开(公告)号：US20100045919A1
公开(公告)日：2010-02-25
申请号：US12538975
申请日：2009-08-11
申请人： Akihiro Chida , Kaoru Hatano , Takaaki Nagata , Satoshi Seo
发明人： Akihiro Chida , Kaoru Hatano , Takaaki Nagata , Satoshi Seo
IPC分类号： G02F1/1345 , H01L33/00
CPC分类号： H01L27/1266 , H01L27/1225 , H01L27/124 , H01L27/1248 , H01L27/3244 , H01L27/3248 , H01L27/3276 , H01L51/56 , H01L2227/326 , H01L2251/5338
摘要： Provided is a flexible light-emitting device including: a base insulating film; a thin film transistor formed over a first surface of the base insulating film; an interlayer insulating film formed over the first surface of the base insulating film with the thin film transistor interposed therebetween; a first pixel electrode formed on a second surface of the base insulating film opposite to the first surface; an electroluminescent layer formed on the second surface of the base insulating film with the first pixel electrode interposed therebetween; a second pixel electrode formed on the second surface of the base insulating film with the first pixel electrode and the electroluminescent layer interposed therebetween; and a wiring electrically connected to a semiconductor layer of the thin film transistor in a contact hole provided in the interlayer insulating film and electrically connected to the first pixel electrode in a through-hole penetrating through at least the interlayer insulating film and the base insulating film.
摘要翻译：提供一种柔性发光装置，包括：基底绝缘膜; 形成在所述基底绝缘膜的第一表面上的薄膜晶体管; 在所述基底绝缘膜的所述第一表面上形成有夹在其间的薄膜晶体管的层间绝缘膜; 形成在与第一表面相对的基底绝缘膜的第二表面上的第一像素电极; 形成在所述基底绝缘膜的第二表面上的电致发光层，其间插入有所述第一像素电极; 形成在所述基底绝缘膜的所述第二表面上的第二像素电极，其间插入有所述第一像素电极和所述电致发光层; 以及布线，电连接到所述薄膜晶体管的半导体层，所述接触孔设置在所述层间绝缘膜中，并且至少贯穿至少所述层间绝缘膜和所述基底绝缘膜的通孔中与所述第一像素电极电连接。

2. 发明授权

US08284369B2 Flexible light-emitting device, and method for fabricating the same 有权
标题翻译：柔性发光装置及其制造方法
公开(公告)号：US08284369B2
公开(公告)日：2012-10-09
申请号：US12538975
申请日：2009-08-11
申请人： Akihiro Chida , Kaoru Hatano , Takaaki Nagata , Satoshi Seo
发明人： Akihiro Chida , Kaoru Hatano , Takaaki Nagata , Satoshi Seo
IPC分类号： G02F1/1345 , B60Q1/14 , H01L21/00
CPC分类号： H01L27/1266 , H01L27/1225 , H01L27/124 , H01L27/1248 , H01L27/3244 , H01L27/3248 , H01L27/3276 , H01L51/56 , H01L2227/326 , H01L2251/5338
摘要： Provided is a flexible light-emitting device including: a base insulating film; a thin film transistor formed over a first surface of the base insulating film; an interlayer insulating film formed over the first surface of the base insulating film with the thin film transistor interposed therebetween; a first pixel electrode formed on a second surface of the base insulating film opposite to the first surface; an electroluminescent layer formed on the second surface of the base insulating film with the first pixel electrode interposed therebetween; a second pixel electrode formed on the second surface of the base insulating film with the first pixel electrode and the electroluminescent layer interposed therebetween; and a wiring electrically connected to a semiconductor layer of the thin film transistor in a contact hole provided in the interlayer insulating film and electrically connected to the first pixel electrode in a through-hole penetrating through at least the interlayer insulating film and the base insulating film.
摘要翻译：提供一种柔性发光装置，包括：基底绝缘膜; 形成在所述基底绝缘膜的第一表面上的薄膜晶体管; 在所述基底绝缘膜的所述第一表面上形成有夹在其间的薄膜晶体管的层间绝缘膜; 形成在与第一表面相对的基底绝缘膜的第二表面上的第一像素电极; 形成在所述基底绝缘膜的第二表面上的电致发光层，其间插入有所述第一像素电极; 形成在所述基底绝缘膜的所述第二表面上的第二像素电极，其间插入有所述第一像素电极和所述电致发光层; 以及布线，电连接到所述薄膜晶体管的半导体层，所述接触孔设置在所述层间绝缘膜中，并且至少贯穿至少所述层间绝缘膜和所述基底绝缘膜的通孔中与所述第一像素电极电连接。

3. 发明授权

US08555497B2 Manufacturing method of a wiring substrate 有权
标题翻译：布线基板的制造方法
公开(公告)号：US08555497B2
公开(公告)日：2013-10-15
申请号：US12485957
申请日：2009-06-17
申请人： Kaoru Hatano , Akihiro Chida , Takaaki Nagata , Masayuki Sakakura
发明人： Kaoru Hatano , Akihiro Chida , Takaaki Nagata , Masayuki Sakakura
IPC分类号： H01R43/00
CPC分类号： H01L27/1266 , G06K19/07745 , G06K19/07747 , G06K19/07749 , G06K19/0775 , H01L21/6835 , H01L23/145 , H01L23/49827 , H01L23/5389 , H01L27/1218 , H01L2221/6835 , H01L2924/0002 , H01L2924/12044 , H01L2924/14 , H01L2924/19041 , H01L2924/3025 , H05K1/0366 , H05K3/002 , H05K3/4069 , H05K3/4644 , H05K2203/1163 , Y10T29/49126 , Y10T29/49169 , H01L2924/00
摘要： To form a conductive region in a prepreg without opening a through hole in a fibrous body. A wiring substrate is provided, including: an organic resin layer and a fibrous body, wherein the fibrous body is impregnated with the organic resin layer; and a wiring with which the fibrous body is impregnated and which is formed by dissolving the organic resin layer. The wiring is exposed on both surfaces of the organic resin layer and penetrates the fibrous body so that the fibrous body is positioned in the through wiring. Further, a semiconductor device is provided by adhering an integrated circuit chip having a bump to the wiring substrate so that the bump is in contact with the wiring.
摘要翻译：在预浸料坯中形成导电区域，而不在纤维体内打开通孔。提供一种布线基板，包括：有机树脂层和纤维体，其中所述纤维体浸渍有机树脂层; 以及纤维体浸渍并通过溶解有机树脂层而形成的布线。布线暴露在有机树脂层的两个表面上并穿透纤维体，使得纤维体位于贯通布线中。此外，通过将具有凸块的集成电路芯片粘附到布线基板以使得凸块与布线接触来提供半导体器件。

4. 发明授权

US09000442B2 Light-emitting device, flexible light-emitting device, electronic device, and method for manufacturing light-emitting device and flexible-light emitting device 有权
标题翻译：发光装置，柔性发光装置，电子装置以及制造发光装置和柔性发光装置的方法
公开(公告)号：US09000442B2
公开(公告)日：2015-04-07
申请号：US13005766
申请日：2011-01-13
申请人： Kaoru Hatano , Takaaki Nagata , Nozomu Sugisawa , Tatsuya Okano , Akihiro Chida , Tatsunori Inoue
发明人： Kaoru Hatano , Takaaki Nagata , Nozomu Sugisawa , Tatsuya Okano , Akihiro Chida , Tatsunori Inoue
IPC分类号： H01L27/14 , H01L27/12
CPC分类号： H01L27/1266 , H01L27/1225
摘要： To simply provide a flexible light-emitting device with long lifetime. To provide a flexible light-emitting device with favorable display characteristics, high yield, and high reliability without display unevenness. Provided is a flexible light-emitting device including: a substrate having flexibility and a property of transmitting visible light; an adhesive layer provided over the substrate; a conductive layer having a property of transmitting visible light provided over the adhesive layer; an insulating layer disposed over the conductive layer; a transistor provided over the insulating layer; an interlayer insulating layer covering the transistor, a light-emitting element including a first electrode electrically connected to source or drain electrodes of the transistor and provided over the interlayer insulating layer, a second electrode facing the first electrode, and a layer including an organic compound having a light-emitting property provided between the first and second electrodes; and a sealing layer covering the light-emitting element.
摘要翻译：简单地提供具有长寿命的柔性发光装置。提供具有良好的显示特性，高产率和高可靠性的柔性发光装置，而不会出现显示不均匀。提供一种柔性发光装置，包括：具有柔性的透射可见光的特性的基板; 设置在所述基板上的粘合层; 导电层，其具有透射在所述粘合剂层上方提供的可见光的性质; 设置在所述导电层上的绝缘层; 设置在所述绝缘层上的晶体管; 覆盖晶体管的层间绝缘层，发光元件，包括电连接到晶体管的源极或漏极并设置在层间绝缘层上的第一电极，面对第一电极的第二电极和包含有机化合物的层具有设置在第一和第二电极之间的发光特性; 以及覆盖发光元件的密封层。

5. 发明授权

US08188474B2 Flexible light-emitting device 有权
标题翻译：柔性发光装置
公开(公告)号：US08188474B2
公开(公告)日：2012-05-29
申请号：US12578687
申请日：2009-10-14
申请人： Kaoru Hatano , Satoshi Seo , Takaaki Nagata , Tatsuya Okano
发明人： Kaoru Hatano , Satoshi Seo , Takaaki Nagata , Tatsuya Okano
IPC分类号： H01L29/04 , H01L29/10 , H01L31/036 , H01L31/0376 , H01L31/20 , H01L29/15 , H01L27/148 , H01L29/74 , H01L29/768 , H01L31/062 , H01L31/113
CPC分类号： H01L27/3258 , H01L27/1214 , H01L27/1225 , H01L27/1266 , H01L27/322 , H01L27/3244 , H01L29/78678 , H01L33/48 , H01L51/0097 , H01L51/5237 , H01L51/5243 , H01L51/5246 , H01L51/5253 , H01L2227/326 , H01L2251/5338 , H01L2251/558 , Y02E10/549 , Y02P70/521
摘要： It is an object to provide a flexible light-emitting device with long lifetime in a simple way and to provide an inexpensive electronic device with long lifetime using the flexible light-emitting device. A flexible light-emitting device is provided, which includes a substrate having flexibility and a light-transmitting property with respect to visible light; a first adhesive layer over the substrate; an insulating film containing nitrogen and silicon over the first adhesive layer; a light-emitting element including a first electrode, a second electrode facing the first electrode, and an EL layer between the first electrode and the second electrode; a second adhesive layer over the second electrode; and a metal substrate over the second adhesive layer, wherein the thickness of the metal substrate is 10 μm to 200 μm inclusive. Further, an electronic device using the flexible light-emitting device is provided.
摘要翻译：本发明的目的是以简单的方式提供具有长寿命的柔性发光器件，并且使用柔性发光器件提供具有长寿命的便宜的电子器件。提供一种柔性发光装置，其包括具有柔性和相对于可见光的透光性的基板; 衬底上的第一粘合剂层; 在第一粘合剂层上含有氮和硅的绝缘膜; 包括第一电极，面向第一电极的第二电极和第一电极和第二电极之间的EL层的发光元件; 在第二电极上的第二粘合剂层; 以及在所述第二粘合剂层上的金属基板，其中所述金属基板的厚度为10μm〜200μm。此外，提供了使用柔性发光装置的电子装置。

6. 发明授权

US08581265B2 Light-emitting device and electronic device including substrate having flexibility 有权
标题翻译：发光装置和包括具有柔性的基板的电子装置
公开(公告)号：US08581265B2
公开(公告)日：2013-11-12
申请号：US13480693
申请日：2012-05-25
申请人： Kaoru Hatano , Satoshi Seo , Takaaki Nagata , Tatsuya Okano
发明人： Kaoru Hatano , Satoshi Seo , Takaaki Nagata , Tatsuya Okano
IPC分类号： H01L27/15 , H01L29/26 , H01L31/12 , H01L33/00 , H01L29/20 , H01L29/06 , H01L31/0328 , H01L31/0336 , H01L31/072 , H01L31/109
CPC分类号： H01L27/3258 , H01L27/1214 , H01L27/1225 , H01L27/1266 , H01L27/322 , H01L27/3244 , H01L29/78678 , H01L33/48 , H01L51/0097 , H01L51/5237 , H01L51/5243 , H01L51/5246 , H01L51/5253 , H01L2227/326 , H01L2251/5338 , H01L2251/558 , Y02E10/549 , Y02P70/521
摘要： It is an object to provide a flexible light-emitting device with long lifetime in a simple way and to provide an inexpensive electronic device with long lifetime using the flexible light-emitting device. A flexible light-emitting device is provided, which includes a substrate having flexibility and a light-transmitting property with respect to visible light; a first adhesive layer over the substrate; an insulating film containing nitrogen and silicon over the first adhesive layer; a light-emitting element including a first electrode, a second electrode facing the first electrode, and an EL layer between the first electrode and the second electrode; a second adhesive layer over the second electrode; and a metal substrate over the second adhesive layer, wherein the thickness of the metal substrate is 10 μm to 200 μm inclusive. Further, an electronic device using the flexible light-emitting device is provided.
摘要翻译：本发明的目的是以简单的方式提供具有长寿命的柔性发光器件，并且使用柔性发光器件提供具有长寿命的便宜的电子器件。提供一种柔性发光装置，其包括具有柔性和相对于可见光的透光性的基板; 衬底上的第一粘合剂层; 在第一粘合剂层上含有氮和硅的绝缘膜; 包括第一电极，面向第一电极的第二电极和第一电极和第二电极之间的EL层的发光元件; 在第二电极上的第二粘合剂层; 以及在所述第二粘合剂层上的金属基材，其中所述金属基材的厚度为10〜200μm。此外，提供了使用柔性发光装置的电子装置。

7. 发明授权

US07888163B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07888163B2
公开(公告)日：2011-02-15
申请号：US12473299
申请日：2009-05-28
申请人： Akihiro Chida , Takaaki Nagata
发明人： Akihiro Chida , Takaaki Nagata
IPC分类号： H01L21/00
CPC分类号： H01L23/49855 , H01L21/561 , H01L21/568 , H01L23/293 , H01L23/295 , H01L23/3114 , H01L23/5389 , H01L23/60 , H01L25/50 , H01L2223/6677 , H01L2224/16 , H01L2924/12044
摘要： An object is to increase resistance against an electrostatic breakdown and to increase resistance to an external stress. Another object is to reduce cost by simplifying the manufacturing process. In a step in which an element formation layer is provided between a first organic resin layer provided with a first conductive film on its surface and a second organic resin layer provided with a second conductive film on its surface to electrically connect the first conductive film and the second conductive film with a contact conductor formed in each of the organic resin layers, the contact conductor provided in each of the first organic resin layer and the second organic resin layer is manufactured by making paste penetrate before an organic resin is cured and then curing the organic resin layer.
摘要翻译：目的是提高抗静电击穿的阻力并增加对外部应力的抵抗力。另一个目的是通过简化制造过程来降低成本。在其表面上设置有第一导电膜的第一有机树脂层和其表面上设置有第二导电膜的第二有机树脂层之间设置元件形成层以将第一导电膜和第二导电膜电连接的步骤在每个有机树脂层中形成有接触导体的第二导电膜，通过在有机树脂固化之前使糊状物渗透，然后固化所述第一有机树脂层和第二有机树脂层中的每一个中的接触导体有机树脂层。

8. 发明申请

US20090302455A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20090302455A1
公开(公告)日：2009-12-10
申请号：US12473299
申请日：2009-05-28
申请人： Akihiro Chida , Takaaki Nagata
发明人： Akihiro Chida , Takaaki Nagata
IPC分类号： H01L23/538 , H01L21/56 , H01L21/768
CPC分类号： H01L23/49855 , H01L21/561 , H01L21/568 , H01L23/293 , H01L23/295 , H01L23/3114 , H01L23/5389 , H01L23/60 , H01L25/50 , H01L2223/6677 , H01L2224/16 , H01L2924/12044
摘要： An object is to increase resistance against an electrostatic breakdown and to increase resistance to an external stress. Another object is to reduce cost by simplifying the manufacturing process. In a step in which an element formation layer is provided between a first organic resin layer provided with a first conductive film on its surface and a second organic resin layer provided with a second conductive film on its surface to electrically connect the first conductive film and the second conductive film with a contact conductor formed in each of the organic resin layers, the contact conductor provided in each of the first organic resin layer and the second organic resin layer is manufactured by making paste penetrate before an organic resin is cured and then curing the organic resin layer.
摘要翻译：目的是提高抗静电击穿的阻力并增加对外部应力的抵抗力。另一个目的是通过简化制造过程来降低成本。在其表面上设置有第一导电膜的第一有机树脂层和其表面上设置有第二导电膜的第二有机树脂层之间设置元件形成层以将第一导电膜和第二导电膜电连接的步骤在每个有机树脂层中形成有接触导体的第二导电膜，通过在有机树脂固化之前使糊状物渗透，然后固化所述第一有机树脂层和第二有机树脂层中的每一个中的接触导体有机树脂层。

9. 发明申请

US20100248403A1 Light-Emitting Device and Method for Manufacturing the Same 有权
标题翻译：发光装置及其制造方法
公开(公告)号：US20100248403A1
公开(公告)日：2010-09-30
申请号：US12729487
申请日：2010-03-23
申请人： Kaoru Hatano , Takaaki Nagata , Takuya Tsurume
发明人： Kaoru Hatano , Takaaki Nagata , Takuya Tsurume
IPC分类号： H01L51/56
CPC分类号： H01L51/56 , H01L27/3211 , H01L27/3246 , H01L2227/323 , H01L2227/326
摘要： In a manufacturing method of a light-emitting device, a separation layer is formed over a substrate; a semiconductor circuit element layer and first electrodes are formed over the separation layer; a partition wall overlapping with end portions of the first electrodes is formed; and organic material layers are formed over the first electrodes. Organic material layers emitting light of the same color are arranged adjacent to each other in a line and extend in a first direction. A second electrode is formed using a material having high adhesiveness to the partition wall over the organic material layers to be in contact with the partition wall. A stack structure including the semiconductor circuit element layer, the first electrodes, the partition wall, the organic material layers, and the second electrode is separated from the substrate using the separation layer in a second direction perpendicular to the first direction.
摘要翻译：在发光装置的制造方法中，在基板上形成分离层，半导体电路元件层和第一电极形成在分离层上; 形成与第一电极的端部重叠的分隔壁; 并且在第一电极上形成有机材料层。发射相同颜色的光的有机材料层以一条线彼此相邻布置并沿第一方向延伸。第二电极使用与有机材料层上的隔壁具有高粘合性的材料形成，以与分隔壁接触。在垂直于第一方向的第二方向上，使用分离层将包括半导体电路元件层，第一电极，分隔壁，有机材料层和第二电极的堆叠结构与基板分离。

10. 发明授权

US08372668B2 Light-emitting device and method for manufacturing the same 有权
标题翻译：发光装置及其制造方法
公开(公告)号：US08372668B2
公开(公告)日：2013-02-12
申请号：US12729487
申请日：2010-03-23
申请人： Kaoru Hatano , Takaaki Nagata , Takuya Tsurume
发明人： Kaoru Hatano , Takaaki Nagata , Takuya Tsurume
IPC分类号： H01L21/00
CPC分类号： H01L51/56 , H01L27/3211 , H01L27/3246 , H01L2227/323 , H01L2227/326
摘要： In a manufacturing method of a light-emitting device, a separation layer is formed over a substrate; a semiconductor circuit element layer and first electrodes are formed over the separation layer; a partition wall overlapping with end portions of the first electrodes is formed; and organic material layers are formed over the first electrodes. Organic material layers emitting light of the same color are arranged adjacent to each other in a line and extend in a first direction. A second electrode is formed using a material having high adhesiveness to the partition wall over the organic material layers to be in contact with the partition wall. A stack structure including the semiconductor circuit element layer, the first electrodes, the partition wall, the organic material layers, and the second electrode is separated from the substrate using the separation layer in a second direction perpendicular to the first direction.
摘要翻译：在发光装置的制造方法中，在基板上形成分离层，半导体电路元件层和第一电极形成在分离层上; 形成与第一电极的端部重叠的分隔壁; 并且在第一电极上形成有机材料层。发射相同颜色的光的有机材料层以一条线彼此相邻布置并沿第一方向延伸。第二电极使用与有机材料层上的隔壁具有高粘合性的材料形成，以与分隔壁接触。在垂直于第一方向的第二方向上，使用分离层将包括半导体电路元件层，第一电极，分隔壁，有机材料层和第二电极的堆叠结构与基板分离。

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