会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明授权
    • Semiconductor device with a tunnel diode and method of manufacturing same
    • US06242762B1
    • 2001-06-05
    • US09078231
    • 1998-05-13
    • Adam R. BrownGodefridus A. M. HurkxWiebe B. De BoerJan W. Slotboom
    • Adam R. BrownGodefridus A. M. HurkxWiebe B. De BoerJan W. Slotboom
    • H01L29861
    • H01L29/885Y10S438/979
    • A semiconductor device with a tunnel diode (23) is particularly suitable for various applications. Such a device comprises two mutually adjoining semiconductor regions (2, 3) of opposed conductivity types and having doping concentrations which are so high that breakdown between them leads to conduction by means of tunnelling. A disadvantage of the known device is that the current-voltage characteristic is not yet steep enough for some applications. In a device according to the invention, the portions (2A, 3A) of the semiconductor regions (2, 3) adjoining the junction (23) comprise a mixed crystal of silicon and germanium. It is surprisingly found that the doping concentration of both phosphorus and boron are substantially increased, given the same amount of dopants being offered as during the formation of the remainder of the regions (2, 3). The tunnelling efficiency is substantially improved as a result of this, and also because of the reduced bandgap of said portions (2A, 3A), and the device according to the invention has a much steeper current-voltage characteristic both in the forward and in the reverse direction. This opens perspectives for inter alia an attractive application where the tunnelling pn junction (23) is used as a transition between two conventional diodes, for example pn or pin diodes, which are used one stacked on the other and which can be formed in a single epitaxial growing process thanks to the invention. The portions (2A, 3A) adjoining the tunnelling junction (22) are preferably 5 to 30 nm thick and comprise between 10 and 50 at % germanium. The doping concentration may be 6×1019 or even more than 1020 at/cm3. The invention further relates to a simple method of manufacturing a device according to the invention. This is preferably done at a temperature of between 550° C. and 800° C.
    • 3. 发明授权
    • Enhanced flux semiconductor device with mesa and method of manufacturing same
    • 具有台面的增强型通量半导体器件及其制造方法
    • US06459133B1
    • 2002-10-01
    • US09545782
    • 2000-04-07
    • Adam R. BrownGodefridus A. M. HurkxWiebe B. De BoerHendrik G. A. HuizingEddie Huang
    • Adam R. BrownGodefridus A. M. HurkxWiebe B. De BoerHendrik G. A. HuizingEddie Huang
    • H01L2358
    • H01L29/8618
    • The invention relates to a so-called punch-through diode with a mesa (12) comprising, in succession, a first (1), a second (2) and a third (3) semiconductor region (1) of, respectively, a first, a second and the first conductivity type, which punch-through diode is provided with two connection conductors (5, 6). During operation of said diode, a voltage is applied such that the second semiconductor region (2) is fully depleted. A drawback of the known punch-through diode resides in that the current flow is too large at lower voltages. In a punch-through diode according to the invention, a part (2A, 2B) of the second semiconductor region (2), which, viewed in projection, borders on the edge of the mesa (12), is provided with a larger flux of doping atoms of the second conductivity type than the remainder (2A) of the second semiconductor region (2). It has been found that the high current at a low voltage of the known diode is caused by the fact that the second semiconductor region (2) at the edge of the mesa (12) is depleted before the remainder of the second semiconductor region (2). By locally increasing the flux of doping atoms, the depletion at the edge is delayed as compared to the remainder of the second semiconductor region. Preferably, this result is obtained by locally increasing the thickness of the second semiconductor region (2). In this manner, a substantial current reduction at lower voltages is obtained in the diode in accordance with the invention.
    • 本发明涉及一种所谓的穿通二极管,其具有台面(12),它们分别包括第一(1),第二(2)和第三(3)半导体区域(1) 第一和第二导电类型,该穿通二极管设置有两个连接导体(5,6)。 在所述二极管的操作期间,施加电压使得第二半导体区域(2)完全耗尽。 已知的穿通二极管的缺点在于电流在较低的电压下太大。 在根据本发明的穿通二极管中,第二半导体区域(2)的一部分(2A,2B)在投影面上与台面(12)的边缘相邻地设置有较大的通量 的第二导电类型的掺杂原子比第二半导体区域(2)的其余部分(2A)。 已经发现,已知二极管的低电压下的高电流是由于在第二半导体区域(2)的剩余部分之前在台面(12)的边缘处的第二半导体区域(2)被耗尽的事实引起的, )。 通过局部增加掺杂原子的通量,与第二半导体区域的剩余部分相比,边缘处的耗尽被延迟。 优选地,通过局部增加第二半导体区域(2)的厚度来获得该​​结果。 以这种方式,在根据本发明的二极管中获得在较低电压下的实质电流降低。
    • 4. 发明授权
    • Semiconductor device having a rectifying junction and method of manufacturing same
    • 具有整流结的半导体装置及其制造方法
    • US06417526B2
    • 2002-07-09
    • US09288395
    • 1999-04-08
    • Adam R. BrownGodefridus A. M. HurkxMichael S. PeterHendrik G. A. HuizingWiebe B. De Boer
    • Adam R. BrownGodefridus A. M. HurkxMichael S. PeterHendrik G. A. HuizingWiebe B. De Boer
    • H01L29861
    • H01L29/885H01L29/32Y10S438/979
    • The invention relates to a semiconductor device having a rectifying junction (5) which is situated between two (semiconductor) regions (1, 2) of an opposite conductivity type. The second region (2), which includes silicon, is thicker and has a smaller doping concentration than the first region (1) which includes a sub-region comprising a mixed crystal of silicon and germanium. The two regions (1, 2) are each provided with a connection conductor (3, 4). Such a device can very suitably be used as a switching element, in particular as a switching element for a high voltage and/or high power. In the known device, the silicon-germanium mixed crystal is relaxed, leading to the formation of misfit dislocations. These serve to reduce the service life of the minority charge carriers, thus enabling the device to be switched very rapidly. In a device in accordance with the invention, the entire first region (1) comprises a mixed crystal of silicon and germanium, and the germanium content and the thickness of the first region (1) are selected so that the voltage built up in the semiconductor device remains below the level at which misfit dislocations develop. Surprisingly, it has been found that such a device can also be switched very rapidly, even more rapidly than the known device. The absence of misfit dislocations has an additional advantage, namely that the device is very reliable. Misfit dislocations do not develop if the product of said relative deviation in the lattice constant and the thickness of the first region is smaller than or equal to 40 nm %. A safe upper limit for said product is 30 nm %.
    • 本发明涉及一种半导体器件,其具有位于相反导电型的两个(半导体)区域(1,2)之间的整流结(5)。 包括硅的第二区域(2)比第一区域(1)更厚并且具有更小的掺杂浓度,该第一区域包括包含硅和锗的混合晶体的子区域。 两个区域(1,2)各自设置有连接导体(3,4)。 这种装置可以非常适合地用作开关元件,特别是用作高电压和/或高功率的开关元件。 在已知的器件中,硅 - 锗混晶被放宽,导致失配位错的形成。 这些用于减少少数电荷载体的使用寿命,从而使装置能够非常快地切换。 在根据本发明的装置中,整个第一区域(1)包括硅和锗的混合晶体,并且选择锗含量和第一区域(1)的厚度,使得在半导体中积聚的电压 器件仍然低于发生错配位错的水平。 令人惊讶的是,已经发现,这种装置也可以非常快速地切换,甚至比已知装置更快地切换。 没有错配位错具有额外的优点,即该装置非常可靠。 如果晶格常数相对偏差和第一区域的厚度的乘积小于或等于40nm%,则不会发生失配位错。 所述产品的安全上限为30nm%。
    • 6. 发明授权
    • Semiconductor resistor using back-to-back zener diodes
    • 半导体电阻采用背对背齐纳二极管
    • US5760450A
    • 1998-06-02
    • US828238
    • 1997-03-31
    • Godefridus A. M. HurkxJan W. SlotboomAndreas H. Montree
    • Godefridus A. M. HurkxJan W. SlotboomAndreas H. Montree
    • H01L27/04H01L21/822H01L23/64H01L27/08H01L29/8605H01L29/866H01L29/78
    • H01L29/866H01L27/0814H01L29/8605
    • Very high resistance values may be necessary in integrated circuits, for example in the gigaohm range, for example for realizing RC times of 1 ms to 1 s. Such resistance values cannot or substantially not be realized by known methods in standard i.c. processes because of the too large space occupation. In addition, known embodiments are usually strongly dependent on the temperature. According to the invention, therefore, two zener diodes (10, 4; 11, 4) connected back-to-back are used as the resistor. The current through each zener diode is mainly determined by band--band tunneling when the voltage is not too high, for example up to approximately 0.2 V. This current has a value such that resistors in the giga range can be readily realized on a small surface area. Since the current is mainly determined by intrinsic material properties of silicon, the temperature dependence is very small. The resistor may furthermore be manufactured in any standard CMOS process or bipolar process.
    • 在集成电路中可能需要非常高的电阻值,例如在高戈范围内,例如用于实现1ms至1s的RC时间。 这种电阻值不能或基本上不能通过标准电流中的已知方法来实现。 因为占用空间太大。 此外,已知的实施方案通常强烈地依赖于温度。 因此,根据本发明,使用背对背连接的两个齐纳二极管(10,4; 11,4)作为电阻器。 通过每个齐纳二极管的电流主要由电压不太高(例如高达约0.2V)时的带带隧穿确定。该电流具有这样的值,使得可以在小的表面上容易地实现千兆范围内的电阻 区。 由于电流主要取决于硅的固有材料性质,因此温度依赖性非常小。 此外,电阻器可以以任何标准CMOS工艺或双极工艺制造。
    • 7. 发明授权
    • Charge carrier stream generating electronic device and method
    • 电荷载流子流生成电子器件及方法
    • US08362821B2
    • 2013-01-29
    • US12743400
    • 2008-11-12
    • Tony VanhouckeGodefridus A. M. HurkxJan W. Slotboom
    • Tony VanhouckeGodefridus A. M. HurkxJan W. Slotboom
    • H03K17/00H03K17/60
    • G11C13/0004
    • An electronic device comprising a generator for generating a stream of charge carriers. The generator comprises a bipolar transistor having an emitter region, a collector region and a base region oriented between the emitter region and the collector region, and a controller for controlling exposure of the bipolar transistor to a voltage in excess of its open base breakdown voltage (BVCEO) such that the emitter region generates the stream of charge carriers from a first area being smaller than the emitter region surface area. The electronic device may further comprise a material arranged to receive the stream of charge carriers for triggering a change in a property of said material, the emitter region being arranged between the base region and the material.
    • 一种电子设备,包括用于产生电荷载流子的发生器。 发生器包括双极晶体管,其具有发射极区域,集电极区域和定向在发射极区域和集电极区域之间的基极区域;以及控制器,用于控制双极晶体管的暴露于超过其开路基极击穿电压的电压( BVCEO),使得发射极区域从小于发射极区域表面积的第一区域产生电荷载流子。 电子设备还可以包括布置成接收电荷载流子的材料,用于触发所述材料的性质的变化,发射极区域布置在基底区域和材料之间。
    • 9. 发明授权
    • Method of manufacturing a trench gate field effect semiconductor device
    • 制造沟槽栅场效应半导体器件的方法
    • US06331467B1
    • 2001-12-18
    • US09538467
    • 2000-03-29
    • Adam R. BrownRaymond J. E. HuetingGodefridus A. M. Hurkx
    • Adam R. BrownRaymond J. E. HuetingGodefridus A. M. Hurkx
    • H01L21336
    • H01L29/7813H01L29/165H01L29/66348H01L29/7397Y10S438/97
    • A semiconductor body (1) is provided having a first semiconductor region (3) of one conductivity type separated from a first major surface (5a) by a second semiconductor region (5) of the opposite conductivity type. A trench (7) is etched through the second semiconductor region (5) to an etch stop layer (4) provided in the region of the pn junction between the first (3) and second (5) regions, by using an etching process which enables the etching process to be stopped at the etch stop layer. A gate (8, 9) is provided within the trench (7). A source (12) separated from the first region (3) by the second region (5) is formed adjacent the trench so that a conduction channel area (50) of the second region (5) adjacent the trench provides a conduction path between the source and first regions which is controllable by the gate.
    • 半导体本体(1)具有通过相反导电类型的第二半导体区域(5)与第一主表面(5a)分离的一种导电类型的第一半导体区域(3)。 通过使用蚀刻工艺将沟槽(7)通过第二半导体区域(5)蚀刻到设置在第一(3)和第二(5)区域之间的pn结区域中的蚀刻停止层(4),其中 使蚀刻工艺在蚀刻停止层处停止。 在沟槽(7)内设有一个门(8,9)。 与沟槽相邻地形成与第一区域(3)分离的源极(12),使得邻近沟槽的第二区域(5)的导电通道区域(50)提供在第二区域 源极和第一区域,其可由栅极控制。