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    • 3. 发明授权
    • Method of manufacturing heterojunction bipolar transistor and heterojunction bipolar transistor
    • 异质结双极晶体管和异质结双极晶体管的制造方法
    • US08524551B2
    • 2013-09-03
    • US13547067
    • 2012-07-12
    • Philippe Meunier-BeillardJohannes Josephus Theodorus Marinus DonkersHans MertensTony Vanhoucke
    • Philippe Meunier-BeillardJohannes Josephus Theodorus Marinus DonkersHans MertensTony Vanhoucke
    • H01L21/337
    • H01L29/66242H01L29/1004H01L29/7378
    • A method of forming a heterojunction bipolar transistor by depositing a first stack comprising an polysilicon layer and a sacrificial layer on a mono-crystalline silicon substrate surface; patterning that stack to form a trench extending to the substrate; depositing a silicon layer over the resultant structure; depositing a silicon-germanium-carbon layer over the resultant structure; selectively removing the silicon-germanium-carbon layer from the sidewalls of the trench; depositing a boron-doped silicon-germanium-carbon layer over the resultant structure; depositing a further silicon-germanium-carbon layer over the resultant structure; depositing a boron-doped further silicon layer over the resultant structure; forming dielectric spacers on the trench sidewalls; filling the trench with emitter material; exposing polysilicon regions outside the trench side walls by selectively removing the sacrificial layer; implanting boron impurities into the exposed polysilicon regions to define base implants; and exposing the resultant structure to a thermal budget for annealing the boron impurities.
    • 一种通过在单晶硅衬底表面上沉积包括多晶硅层和牺牲层的第一堆叠来形成异质结双极晶体管的方法; 图案化该叠层以形成延伸到衬底的沟槽; 在所得结构上沉积硅层; 在所得结构上沉积硅 - 锗 - 碳层; 从沟槽的侧壁选择性地去除硅 - 锗 - 碳层; 在所得结构上沉积硼掺杂的硅 - 锗 - 碳层; 在所得结构上沉积另外的硅 - 锗 - 碳层; 在所得结构上沉积硼掺杂的另外的硅层; 在沟槽侧壁上形成电介质间隔物; 用发射体材料填充沟槽; 通过选择性地去除牺牲层来暴露沟槽侧壁外的多晶硅区域; 将硼杂质注入暴露的多晶硅区域以限定基底植入物; 并将所得结构暴露于用于退火硼杂质的热预算。
    • 4. 发明授权
    • Optocoupler circuit
    • 光电耦合器电路
    • US08260098B1
    • 2012-09-04
    • US13029951
    • 2011-02-17
    • Dusan GolubovicGerhard KoopsTony VanhouckeRob Van Dalen
    • Dusan GolubovicGerhard KoopsTony VanhouckeRob Van Dalen
    • G02B6/12H01L21/70H01L21/8238H01L21/336H01L21/331H01L21/76
    • H01L27/15H01L31/173H01L33/343
    • An optocoupler device facilitates on-chip galvanic isolation. In accordance with various example embodiments, an optocoupler circuit includes a silicon-on-insulator substrate having a silicon layer on a buried insulator layer, a silicon-based light-emitting diode (LED) having a silicon p-n junction in the silicon layer, and a silicon-based photodetector in the silicon layer. The LED and photodetector are respectively connected to galvanically isolated circuits in the silicon layer. A local oxidation of silicon (LOCOS) isolation material and the buried insulator layer galvanically isolate the first circuit from the second circuit to prevent charge carriers from moving between the first and second circuits. The LED and photodetector communicate optically to pass signals between the galvanically isolated circuits.
    • 光耦合器件便于片上电流隔离。 根据各种示例实施例,光耦合器电路包括在绝缘体层上具有硅层的绝缘体上硅衬底,在硅层中具有硅pn结的硅基发光二极管(LED),以及 硅层中的硅基光电探测器。 LED和光电检测器分别连接到硅层中的电隔离电路。 硅(LOCOS)隔离材料的局部氧化和掩埋绝缘体层将第一电路与第二电路电隔离,以防止电荷载流子在第一和第二电路之间移动。 LED和光电检测器以光学方式进行通信,以在电隔离电路之间传递信号。