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    • 1. 发明申请
    • SUBSTRATE COOL DOWN CONTROL
    • 基板冷却控制
    • WO2010123711A3
    • 2011-01-20
    • PCT/US2010030741
    • 2010-04-12
    • APPLIED MATERIALS INCNEWMAN JACOBKANAWADE DINESHBARANDICA HENRYMERRY NIR
    • NEWMAN JACOBKANAWADE DINESHBARANDICA HENRYMERRY NIR
    • H01L21/02
    • G01K13/00G01J5/0003G01J5/0007G01J5/02G01J5/0255G01K11/18H01L21/67103H01L21/67248
    • Methods and apparatus for precise substrate cool down control are provided. Apparatus for measuring temperature of substrates may include a cool down plate to support a substrate; a sensor to provide data corresponding to a temperature of the substrate when disposed on the cool down plate; and a computer coupled to the sensor to determine the temperature of the substrate from the sensor data. A method for measuring the temperature of a substrate may include providing a substrate to be cooled to a chamber having a cool down plate disposed therein, a sensor to provide data corresponding to a temperature of the substrate, and a computer coupled to the sensor; sensing a first temperature of the substrate after a predetermined first time interval has elapsed; comparing the first temperature to a predetermined temperature; and determining whether the first temperature is greater than, equal to, or less than the predetermined temperature.
    • 提供了精确的基板冷却控制的方法和装置。 用于测量衬底温度的装置可包括用于支撑衬底的冷却板; 传感器,当设置在所述冷却板上时,提供对应于所述基板的温度的数据; 以及耦合到所述传感器的计算机,以从所述传感器数据确定所述基板的温度。 用于测量衬底的温度的方法可以包括将待冷却的衬底设置到设置有冷却板的腔室,传感器以提供对应于衬底的温度的数据和耦合到传感器的计算机; 在经过预定的第一时间间隔之后感测衬底的第一温度; 将第一温度与预定温度进行比较; 以及确定所述第一温度是否大于,等于或小于所述预定温度。
    • 3. 发明申请
    • VERTICAL SUBSTRATE BUFFERING SYSTEM
    • 垂直底板缓冲系统
    • WO2010022309A2
    • 2010-02-25
    • PCT/US2009054577
    • 2009-08-21
    • APPLIED MATERIALS INCMERRY NIRNEWMAN JACOB
    • MERRY NIRNEWMAN JACOB
    • H01L21/677H01L21/00
    • H01L21/67769Y10S414/14
    • A substrate buffering system is provided herein. In some embodiments, a substrate buffering system may include a frame having a vertical shaft disposed therethrough; two storage platforms, one each disposed on either side of the frame, each to receive a substrate carrier thereon; and a transfer mechanism coupled to the vertical shaft and capable of vertical movement along the vertical shaft and lateral movement sufficient to move the transfer mechanism over either of the two storage platforms. The transfer mechanism may further include a telescoping fork arm capable of laterally extending in a first direction and in a second direction corresponding to lateral positions of the two storage platforms on either side of the frame. In some embodiments, the substrate may be a wafer. In some embodiments, the substrate may be a semiconductor wafer.
    • 本文提供了一种衬底缓冲系统。 在一些实施例中,衬底缓冲系统可以包括具有穿过其的竖直轴的框架; 两个存储平台,一个设置在框架的任一侧上,每个用于在其上接收衬底载体; 以及耦合到垂直轴并且能够沿垂直轴垂直移动的传送机构和足以使传送机构移动到两个存储平台中的任何一个上的横向移动。 传送机构还可以包括能够在第一方向和第二方向上横向延伸的伸缩叉臂,对应于框架两侧的两个存储平台的横向位置。 在一些实施例中,衬底可以是晶片。 在一些实施例中,衬底可以是半导体晶片。
    • 6. 发明申请
    • SUBSTRATE PROCESSING CHAMBER WITH OFF-CENTER GAS DELIVERY FUNNEL
    • 带中心气体输送机的基板加工室
    • WO2010036999A3
    • 2010-08-12
    • PCT/US2009058557
    • 2009-09-28
    • APPLIED MATERIALS INCMERRY NIRNGUYEN SON T
    • MERRY NIRNGUYEN SON T
    • H01L21/205H01L21/00
    • C23C16/45544C23C16/45502C23C16/45563
    • Methods and apparatus for processing substrates are disclosed herein. The process chamber includes a chamber body, a substrate support pedestal, a pump port and a gas injection funnel. The chamber body has an inner volume and the substrate support pedestal is disposed in the inner volume of the chamber body. The pump port is coupled to the inner volume and is disposed off-center from a central axis of the substrate support pedestal. The pump port provides azimuthally non-uniform pumping proximate to a surface of the substrate support pedestal and creates localized regions of high pressure and low pressure within the inner volume during use. The gas injection funnel is disposed in a ceiling of the chamber body and opposite the substrate support pedestal. The gas injection funnel is offset from the central axis of the substrate support pedestal and is disposed in a region of low pressure.
    • 本文公开了处理衬底的方法和设备。 处理室包括室主体,基板支撑基座,泵口和气体注入漏斗。 腔体具有内部体积,并且衬底支撑基座设置在腔体的内部体积中。 泵口连接到内部体积并且设置在离基板支撑基座的中心轴线偏心的位置。 泵端口提供靠近基板支撑基座的表面的方位不均匀的泵送,并且在使用期间在内部体积内产生高压和低压的局部区域。 气体注入漏斗设置在室主体的顶部并与衬底支撑基座相对。 气体注入漏斗偏离衬底支撑基座的中心轴线并且设置在低压区域中。
    • 9. 发明申请
    • BATCH DEPOSITION TOOL AND COMPRESSED BOAT
    • 批量沉没工具和压缩船
    • WO2007027458A2
    • 2007-03-08
    • PCT/US2006032413
    • 2006-08-17
    • APPLIED MATERIALS INCYUDOVSKY JOSEPHCOOK ROBERT CMERRY NIR
    • YUDOVSKY JOSEPHCOOK ROBERT CMERRY NIR
    • H01L21/677
    • H01L21/67309H01L21/67757
    • Aspects of the invention include methods and apparatus for processing a batch of substrates. In one embodiment, a compressed substrate boat is configured to reduce pumping volume in a batch processing chamber. The compressed substrate boat comprises a stationary substrate boat and a movable substrate boat, each may be loaded/unloaded independently. The movable substrate boat and the stationary substrate boat may be interleaving with one another such that the distance between the substrates is reduced. In another embodiment, a substrate boat having removable substrate holder is configured to provide susceptors without dramatically increasing pumping volume. The removable substrate holder may be loaded/unloaded away from the substrate boat with susceptors. The removable substrate holder is engaged with the substrate boat such that substrates thereon are interleaving with the susceptors. Embodiments of the present invention reduces pumping volume and increases throughput, hence reduces cost of ownership during batch processing.
    • 本发明的方面包括用于处理一批基底的方法和装置。 在一个实施例中,压缩衬底舟被配置成减少间歇处理室中的泵送体积。 压缩的基板舟皿包括固定的基板船和可移动的基板船,每个可以独立地加载/卸载。 可移动衬底舟皿和固定衬底舟皿可以彼此交错,使得衬底之间的距离减小。 在另一个实施例中,具有可移除衬底保持器的衬底舟皿构造成提供感受器而不会显着增加泵送容积。 可移除的基板保持器可以与基座一起装载/卸载离开基板舟皿。 可拆卸衬底保持器与衬底舟皿接合,使得其上的衬底与感受器交错。 本发明的实施例减少了泵送量并增加了生产量,因此在批量处理期间降低了所有权成本。