会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 5. 发明申请
    • PVD SPUTTERING TARGET WITH A PROTECTED BACKING PLATE
    • 带有保护背板的PVD溅射目标
    • WO2012109069A3
    • 2013-01-03
    • PCT/US2012023474
    • 2012-02-01
    • APPLIED MATERIALS INCRASHEED MUHAMMAD MWANG RONGJUN
    • RASHEED MUHAMMAD MWANG RONGJUN
    • C23C14/34C23C14/50
    • C23C14/3407C22C9/00C22C9/04C22C19/03C23C14/3414H01J37/3426H01J37/3435
    • Embodiments of the invention provide sputtering targets utilized in physical vapor deposition (PVD) and methods to form such sputtering targets. In one embodiment, a sputtering target contains a target layer disposed on a backing plate, and a protective coating layer - usually containing a nickel material - covering and protecting a region of the backing plate that would otherwise be exposed to plasma during the PVD processes. In many examples, the target layer contains a nickel-platinum alloy, the backing plate contains a copper alloy (e.g., copper-zinc), and the protective coating layer contains metallic nickel. The protective coating layer eliminates the formation of highly conductive, copper contaminants typically derived by plasma erosion of the copper alloy contained within the exposed surfaces of the backing plate. Therefore, the substrates and the interior surfaces of the PVD chamber remain free of such copper contaminants during the PVD processes.
    • 本发明的实施例提供了用于物理气相沉积(PVD)的溅射靶和形成这种溅射靶的方法。 在一个实施例中,溅射靶包含设置在背板上的目标层和通常包含镍材料的保护涂层 - 覆盖并保护背衬板的区域,否则在PVD工艺期间将暴露于等离子体。 在许多实施例中,靶层含有镍 - 铂合金,背板含有铜合金(例如铜 - 锌),保护涂层含有金属镍。 保护涂层消除了形成高度导电的铜污染物,通常由包含在背板的暴露表面内的铜合金的等离子体侵蚀导致。 因此,在PVD工艺期间,PVD室的基板和内表面保持没有这种铜污染物。