专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2009111393A Advanced fi blade for extracting substrate at high temperature 审中-公开
标题翻译：用于在高温下提取基材的先进的叶片
公开(公告)号：JP2009111393A
公开(公告)日：2009-05-21
申请号：JP2008280952
申请日：2008-10-31
申请人： Applied Materials Inc , アプライドマテリアルズインコーポレイテッドApplied Materials,Incorporated
发明人： KANAWADE DINESH , METZNER CRAIG R , BALASUBRAMANYAM CHANDRASEKHAR
IPC分类号： H01L21/677
CPC分类号： H01L21/67742 , H01L21/68707
摘要： PROBLEM TO BE SOLVED: To provide an apparatus for transferring substrates in a processing system where the substrate is exposed to high temperatures; and a blade for transporting a substrate in one embodiment.
SOLUTION: The blade comprises a base part having an arcuate lateral shoulder part, a first finger part extending outward from and perpendicularly to the base part, a second finger part extending outward from the base part and in parallel to and spaced-apart from the first finger, a first support tab configured to support the substrate and positioned along the arcuate lateral shoulder part, a second support tab configured to support the substrate and coupled with the first finger part, and a third support tab configured to support the substrate and coupled with the second finger, wherein the arcuate lateral shoulder extends from an outer edge of the first finger part to an outer edge of the second finger part.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于在衬底暴露于高温的处理系统中转移衬底的装置; 以及在一个实施例中用于输送基板的叶片。解决方案：刀片包括具有弓形侧肩部的基部，从基部向外延伸并垂直于基部的第一指部，从基部向外延伸并平行并间隔开的第二指部从所述第一指状物构造的第一支撑突片，被配置为支撑所述基板并且沿着所述弓形侧肩部部件定位;第二支撑突出部，被配置为支撑所述基板并与所述第一指状部分联接;以及第三支撑突出部，并且与所述第二手指联接，其中所述弓形横向肩部从所述第一手指部分的外边缘延伸到所述第二手指部分的外边缘。版权所有（C）2009，JPO＆INPIT

2. 发明专利

SG175022A1 SUBSTRATE COOL DOWN CONTROL 未知
公开(公告)号：SG175022A1
公开(公告)日：2011-11-28
申请号：SG2011071701
申请日：2010-04-12
申请人： APPLIED MATERIALS INC
发明人： NEWMAN JACOB , KANAWADE DINESH , BARANDICA HENRY , MERRY NIR
摘要： Methods and apparatus for precise substrate cool down control are provided. Apparatus for measuring temperature of substrates may include a cool down plate to support a substrate; a sensor to provide data corresponding to a temperature of the substrate when disposed on the cool down plate; and a computer coupled to the sensor to determine the temperature of the substrate from the sensor data. A method for measuring the temperature of a substrate may include providing a substrate to be cooled to a chamber having a cool down plate disposed therein, a sensor to provide data corresponding to a temperature of the substrate, and a computer coupled to the sensor; sensing a first temperature of the substrate after a predetermined first time interval has elapsed; comparing the first temperature to a predetermined temperature; and determining whether the first temperature is greater than, equal to, or less than the predetermined temperature.

3. 发明申请

WO2010123711A3 SUBSTRATE COOL DOWN CONTROL 审中-公开
标题翻译：基板冷却控制
公开(公告)号：WO2010123711A3
公开(公告)日：2011-01-20
申请号：PCT/US2010030741
申请日：2010-04-12
申请人： APPLIED MATERIALS INC , NEWMAN JACOB , KANAWADE DINESH , BARANDICA HENRY , MERRY NIR
发明人： NEWMAN JACOB , KANAWADE DINESH , BARANDICA HENRY , MERRY NIR
IPC分类号： H01L21/02
CPC分类号： G01K13/00 , G01J5/0003 , G01J5/0007 , G01J5/02 , G01J5/0255 , G01K11/18 , H01L21/67103 , H01L21/67248
摘要： Methods and apparatus for precise substrate cool down control are provided. Apparatus for measuring temperature of substrates may include a cool down plate to support a substrate; a sensor to provide data corresponding to a temperature of the substrate when disposed on the cool down plate; and a computer coupled to the sensor to determine the temperature of the substrate from the sensor data. A method for measuring the temperature of a substrate may include providing a substrate to be cooled to a chamber having a cool down plate disposed therein, a sensor to provide data corresponding to a temperature of the substrate, and a computer coupled to the sensor; sensing a first temperature of the substrate after a predetermined first time interval has elapsed; comparing the first temperature to a predetermined temperature; and determining whether the first temperature is greater than, equal to, or less than the predetermined temperature.
摘要翻译：提供了精确的基板冷却控制的方法和装置。用于测量衬底温度的装置可包括用于支撑衬底的冷却板; 传感器，当设置在所述冷却板上时，提供对应于所述基板的温度的数据; 以及耦合到所述传感器的计算机，以从所述传感器数据确定所述基板的温度。用于测量衬底的温度的方法可以包括将待冷却的衬底设置到设置有冷却板的腔室，传感器以提供对应于衬底的温度的数据和耦合到传感器的计算机; 在经过预定的第一时间间隔之后感测衬底的第一温度; 将第一温度与预定温度进行比较; 以及确定所述第一温度是否大于，等于或小于所述预定温度。

4. 发明申请

WO2010054206A3 IMPROVED PROCESS EQUIPMENT ARCHITECTURE 审中-公开
标题翻译：改进工艺设备建筑
公开(公告)号：WO2010054206A3
公开(公告)日：2010-07-22
申请号：PCT/US2009063568
申请日：2009-11-06
申请人： APPLIED MATERIALS INC , NEWMAN JACOB , KANAWADE DINESH , SCHWARTZ MIRIAM , MERRY NIR , HAAG MICHAEL THOMAS
发明人： NEWMAN JACOB , KANAWADE DINESH , SCHWARTZ MIRIAM , MERRY NIR , HAAG MICHAEL THOMAS
IPC分类号： H01L21/00 , H01L21/02
CPC分类号： H01L21/6719
摘要： Embodiments of the present invention relate to improvements to single-substrate, multi-chamber processing platform architecture for minimizing fabrication facility floor space requirements. Prior art systems require significant floor space around all sides to allow for adequate installation and servicing. Embodiments of the present invention provide platforms that allow for servicing the chambers and supporting systems via a front and rear of the platform allowing multiple, side-by-side platform placement within a fabrication facility, while providing improved serviceability of the platform components.
摘要翻译：本发明的实施例涉及对用于最小化制造设备占地面积要求的单基板多室处理平台架构的改进。现有技术的系统需要围绕所有侧面的显着的地板空间以允许适当的安装和维修。本发明的实施例提供了平台，其允许经由平台的前部和后部维护腔室和支撑系统，从而允许在制造设备内多个并排平台放置，同时提供平台组件的改进的可维护性。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式