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    • 8. 发明申请
    • COMPENSATION TECHNIQUES FOR SUBSTRATE HEATING PROCESSES
    • 基板加热工艺补偿技术
    • WO2008063840A1
    • 2008-05-29
    • PCT/US2007/083271
    • 2007-11-01
    • APPLIED MATERIALS, INC.RANISH, Joseph M.ADAMS, Bruce E.
    • RANISH, Joseph M.ADAMS, Bruce E.
    • F27B5/14
    • C23C16/46C21D1/34
    • Methods for compensating for a thermal profile in a substrate heating process are provided herein. In one embodiment, a method of processing a substrate includes determining an initial thermal profile of a substrate resulting from a process; imposing a compensatory thermal profile on the substrate based on the initial thermal profile; and performing the process to create a desired thermal profile on the substrate. In other embodiments of the invention, the initial substrate thermal profile is compensated for by adjusting a local mass heated per unit area, a local heat capacity per unit area, or an absorptivity or reflectivity of a component proximate the substrate prior to performing the process. In another embodiment, the heat provided by an edge ring to the substrate may be controlled either prior to or during the substrate heating process.
    • 本文提供了用于补偿基板加热过程中的热分布的方法。 在一个实施例中,处理衬底的方法包括确定由工艺产生的衬底的初始热分布; 基于初始热分布在衬底上施加补偿热分布; 并执行该过程以在衬底上产生期望的热分布。 在本发明的其它实施例中,通过在执行该过程之前通过调节每单位面积加热的局部质量,每单位面积的局部热容量或接近该衬底的组分的吸收率或反射率来补偿初始衬底热分布。 在另一个实施例中,由边缘环提供到衬底的热可以在衬底加热过程之前或期间被控制。
    • 9. 发明申请
    • PYROMETRY FOR SUBSTRATE PROCESSING
    • 用于基板加工的色温
    • WO2010059300A2
    • 2010-05-27
    • PCT/US2009/059857
    • 2009-10-07
    • APPLIED MATERIALS, INC.PATALAY, Kailash KiranHUNTER, Aaron MuirADAMS, Bruce E.
    • PATALAY, Kailash KiranHUNTER, Aaron MuirADAMS, Bruce E.
    • H01L21/00H01L21/02H01L21/324
    • H01L21/67248
    • A substrate processing system includes a processing chamber, a pedestal for supporting a substrate disposed within the processing chamber, and an optical pyrometry assembly coupled to the processing chamber to measure an emitted light originating substantially from a portion of the pedestal or substrate. The optical pyrometry assembly further includes a light receiver, and an optical detector. The optical pyrometry assembly receives a portion of the emitted light, and a temperature of the substrate is determined from an intensity of the portion of the emitted light near at least one wavelength. A method of measuring a temperature of a substrate during processing, includes disposing a light pipe near a portion of the pedestal supporting the substrate or pedestal, shielding the end of the light pipe from stray light so that the end of the light pipe receives light from the portion of the pedestal or substrate, purging the end of the light pipe with a gas to reduce contamination of the end of the light pipe, detecting a portion of the light emitted from the pedestal and received by the light pipe, and determining a temperature of the substrate from the intensity of the portion of the emitted light from the pedestal or the substrate near at least one wavelength.
    • 基板处理系统包括处理腔室,用于支撑设置在处理腔室内的基板的基座以及耦合到处理腔室的光学高温测定组件,以测量基本上源自一部分的发射光 基座或基板。 光学高温测定组件还包括光接收器和光学检测器。 光学高温测定组件接收一部分发射光,并且基于至少一个波长附近的发射光部分的强度来确定衬底的温度。 在处理期间测量基板的温度的方法包括在支撑基板或基座的基座的一部分附近布置光管,将光管的端部屏蔽以避免杂散光,从而使得光管的端部接收来自 基座或基板的该部分,用气体吹扫光管的端部以减少光管端部的污染,检测从基座发射并由光管接收的一部分光,并且确定温度 从基座或基板发出的光的至少一个波长附近的部分的强度确定基板的厚度。