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    • 1. 发明申请
    • CURABLE EPOXY RESIN COMPOSITION
    • 可固化环氧树脂组合物
    • WO2011023227A1
    • 2011-03-03
    • PCT/EP2009/061038
    • 2009-08-27
    • ABB RESEARCH LTDSINGH, BandeepSCHAAL, StéphaneKORNMANN, XavierPURI, Prateek
    • SINGH, BandeepSCHAAL, StéphaneKORNMANN, XavierPURI, Prateek
    • C08G59/42C08G59/58
    • C08G59/4284C08G59/58C08L63/00H01B3/40
    • A curable epoxy resin composition comprising at least an epoxy resin component and a hardener component, and optionally further additives, characterized in that: (a) said epoxy resin component is a conventional epoxy resin compound or a mixture of such compounds; (b) said hardener component comprises (b1) an aliphatic and cycloaliphatic or aromatic poly-carbonic acid anhydride, preferably a phthalic acid anhydride; and (b2) a polyether-amine of the general formula (I) : H 2 N-(C n H 2n -O) m -C n H 2n -NH 2 (I) wherein n is an integer from 2 to 8; and m is from about 3 to about 100; wherein (c) the polycarbonic acid anhydride, preferably the phthalic acid anhydride [component (b1) ] is present in the curable epoxy resin composition in a concentration of 0.60 MoI to 0.93 MoI, calculated per one epoxy group weight equivalent present in the epoxy resin component of the composition; and (d) the polyether-amine of the general formula (I) [component (b2) ] is present in the curable epoxy resin composition in a concentration of about 0.02 MoI to about 0.1 MoI, calculated per one epoxy group weight equivalent present in the epoxy resin component of the composition; and electrical articles comprising an insulation material made therefrom.
    • 一种可固化环氧树脂组合物,其至少包含环氧树脂组分和硬化剂组分,以及任选的其它添加剂,其特征在于:(a)所述环氧树脂组分是常规的环氧树脂化合物或这些化合物的混合物; (b)所述固化剂组分包含(b1)脂族和脂环族或芳族聚碳酸酐,优选邻苯二甲酸酐; 和(b2)通式(I)的聚醚 - 胺:H 2 N-(C n H 2n-O)m -C n H 2n-NH 2(I)其中n是2至8的整数; m为约3至约100; 其中(c)聚碳酸酐,优选邻苯二甲酸酐[组分(b1)]以0.60摩尔至0.93摩尔的浓度存在于可固化环氧树脂组合物中,每环氧树脂组合物中存在的环氧基重量当量计算 组分的组分; 和(d)通式(I)[组分(b2)]的聚醚胺存在于可固化环氧树脂组合物中,其浓度约为0.02MoI至约0.1MoI,按每个环氧基重量当量存在 组合物的环氧树脂组分; 以及包括由其制成的绝缘材料的电气制品。
    • 2. 发明申请
    • EPOXY RESIN COMPOSITION
    • 环氧树脂组合物
    • WO2011006530A1
    • 2011-01-20
    • PCT/EP2009/058965
    • 2009-07-14
    • ABB RESEARCH LTDSINGH, BandeepGHOUL, CherifSCHAAL, StéphanePURI, Prateek
    • SINGH, BandeepGHOUL, CherifSCHAAL, StéphanePURI, Prateek
    • C08G59/42
    • C08G59/4276
    • Curable epoxy resin composition comprising at least an epoxy resin component and a hardener component, and optionally further additives, wherein (a) at least a part of the hardener component is a chemically modified polycarbonic acid anhydride, said chemically modified polycarbonic acid anhydride being the reaction product of a polycarbonic acid anhydride and a glycol (diol) or a polyglycol, or the reaction product of a polycarbonic acid anhydride and a compound containing two carboxylic groups; (b) said glycol or polyglycol being selected from the group comprising compounds of formula (I) : HO-(C n H 2n -O) m -H (I) wherein n is an integer from 2 to 8; and m is an integer from 1 to 10; (c) said compound containing two carboxylic groups being selected from the group comprising compounds of formula (II) : HOOC- (C p H 2p ) -COOH (II) wherein p an integer from 2 to 18; and (d) the chemically modified acid anhydride hardener is present in an amount comprising at least 10 % of the reactive hardening groups calculated to all the reactive hardening groups contained in the total amount of hardener component present in the epoxy resin composition; and electrical insulators made therefrom.
    • 包含至少一种环氧树脂组分和一种硬化剂组分的可固化环氧树脂组合物,以及任选的其它添加剂,其中(a)至少一部分所述硬化剂组分是化学改性的聚碳酸酐,所述化学改性的聚碳酸酐是反应 聚碳酸酐和二醇(二醇)或聚乙二醇的产物,或聚碳酸酐与含有两个羧基的化合物的反应产物; (b)所述二醇或聚二醇选自式(I)化合物:HO-(C n H 2n-O)m -H(I)其中n是2至8的整数; m为1〜10的整数。 (c)所述含有两个羧基的化合物选自式(II)化合物:HOOC-(CpH 2 p)-COOH(II),其中p为2至18的整数; 和(d)化学改性的酸酐固化剂的存在量为包含至少10%的反应性硬化基团,其计算为环氧树脂组合物中存在的固化剂组分总量中包含的所有反应性硬化基团; 和由此制成的电绝缘体。
    • 4. 发明申请
    • CURABLE SOL-GEL COMPOSITION
    • 可固化溶胶凝胶组合物
    • WO2010127693A1
    • 2010-11-11
    • PCT/EP2009/055398
    • 2009-05-05
    • ABB Research LtdTZAVALAS, SpirosSINGH, BandeepKORNMANN, Xavier
    • TZAVALAS, SpirosSINGH, BandeepKORNMANN, Xavier
    • C08K3/34H01B3/40
    • H01B3/40
    • Curable sol-gel composition useful for modifying the surface of a conventional electrical insulation system and providing said surface with an improved tracking and erosion resistance, characterized in that said sol-gel composition comprises: (a) cyclo-aliphatic epoxy resin compound containing at least two 1,2-epoxy groups per molecule [component (a) ]; (b) a glycidoxypropane-tri (Ci-4) alkoxysilane [component (b) ]; (c) a gamma-aminopropyl-tri (C1-4) alkoxysilane [component (c) ]; (d) a mineral filler material [component (d) ]; and (e) a hydrophobic compound [component (e) ] or a mixture of such hydrophobic compounds being selected from the group comprising fluorinated or chlorinated hydrocarbons or organopolysiloxanes; wherein the ratio of the epoxy equivalents of component (a) to the epoxy equivalents of component (b) is from 9:1 to 6:4; the molar ratio of component (c) to the epoxy equivalents of the sum of [component (a) ] and [component (b) ] is from about 0.9 to 1.1; the mineral filler material [component (d) ] is present in a quatity of about 55% by weight to about 85% by weight, calculated to the total weight of the cured composition; the hydrophobic compound [component (e) ] is present in a quantity of about 1.0% by weight to about 10% by weight, calculated to the total weight of the cured composition; whereby the curable sol-gel composition optionally contains further additives; electrical insulation system comprising said cured composition.
    • 可溶性溶胶 - 凝胶组合物可用于改变常规电绝缘系统的表面并提供所述表面具有改善的耐追踪和耐侵蚀性,其特征在于所述溶胶 - 凝胶组合物包含:(a)至少含有至少 每个分子两个1,2-环氧基[组分(a)]; (b)缩水甘油氧基丙烷 - 三(C 1-4)烷氧基硅烷[组分(b)]; (c)γ-氨基丙基三(C 1-4)烷氧基硅烷[组分(c)]; (d)矿物填充材料[组分(d)]; 和(e)疏水化合物[组分(e)]或这些疏水化合物的混合物,其选自氟化或氯化烃或有机聚硅氧烷; 其中组分(a)的环氧当量与组分(b)的环氧当量的比例为9:1至6:4; 组分(c)与[组分(a)]和[组分(b)]之和的环氧当量的摩尔比为约0.9至1.1; 矿物填充材料[组分(d)]以固化组合物的总重量计,为约55重量%至约85重量%的量; 疏水性化合物[组分(e)]以固化组合物的总重量计为约1.0重量%至约10重量%的量存在; 由此可固化溶胶 - 凝胶组合物任选地含有其它添加剂; 电绝缘系统包括所述固化的组合物。
    • 7. 发明申请
    • POLYMER CONCRETE ELECTRICAL INSULATION SYSTEM
    • 聚合物混凝土电绝缘​​系统
    • WO2009046754A1
    • 2009-04-16
    • PCT/EP2007/060633
    • 2007-10-08
    • ABB Research LtdCLIFFORD, StephenSOYEUX, FaustineKRIVDA, AndrejTILLIETTE, VincentZANT, NikolausSINGH, BandeepGREUTER, FelixRITZER, Leopold
    • CLIFFORD, StephenSOYEUX, FaustineKRIVDA, AndrejTILLIETTE, VincentZANT, NikolausSINGH, BandeepGREUTER, FelixRITZER, Leopold
    • H01B3/40C08L63/00C08K3/36
    • H01B3/40C08K3/36Y10T428/25Y10T428/252Y10T428/256Y10T428/257Y10T428/259Y10T428/269C08L63/00
    • Polymer concrete electrical insulation system comprising a hardened epoxy resin composition filled with an electrically non-conductive inorganic filler composition, wherein said polymer concrete electrical insulation system optionally may contain further additives, and wherein (a) the epoxy resin composition is based on a cycloaliphatic epoxy resin; (b) the inorganic filler composition is present within the range of about 76 % by weight to about 86 % by weight, calculated to the total weight of the polymer concrete electrical insulation system; (c) the inorganic filler composition comprises a uniform mixture of (i) an inorganic filler with an average grain size within the range of 1 micron (µm) to 100 micron (µm) [component c(i)], and (ii) an inorganic filler with an average grain size within the range of 0.1 mm (100 micron) to 2 mm [component c(ii)]; wherein (d) the inorganic filler with an average grain size within the range of 1 micron (µm) to 100 micron (µm) [component c(i)] is present in an amount within the range of 22 % to 42 %, calculated to the total weight of the polymer concrete electrical insulation system; and (e) the inorganic filler with an average grain size within the range of 0.1 mm to 2 mm [component c(ii)] is present within the range of 41 % to 61 % by weight, calculated to the total weight of the polymer concrete electrical insulation system; and method of producing said electrical insulation system.
    • 聚合物混凝土电绝缘​​系统,包括填充有非导电无机填料组合物的硬化环氧树脂组合物,其中所述聚合物混凝土电绝缘​​系统任选地可以含有其它添加剂,并且其中(a)环氧树脂组合物基于脂环族环氧树脂 树脂; (b)按照聚合物混凝土电绝缘​​系统的总重量,无机填料组合物的存在量在约76重量%至约86重量%的范围内; (c)无机填料组合物包含(i)平均粒度在1微米(μm)至100微米(μm)[组分c(i)]范围内的无机填料的均匀混合物,和(ii) 平均粒径在0.1mm(100微米)〜2mm的范围内的无机填料[组分c(ⅱ)]; 其中(d)平均晶粒尺寸在1微米(μm)至100微米(μm)[组分c(i)]范围内的无机填料以22%至42%的量存在,计算 以聚合物混凝土电绝缘​​体系的总重量计; 和(e)平均粒度在0.1mm至2mm范围内的无机填料[组分c(ii)]存在于聚合物总重量的41%至61%的范围内 混凝土电气绝缘系统; 以及制造所述电绝缘系统的方法。