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    • 2. 发明申请
    • CURABLE SOL-GEL COMPOSITION
    • 可固化溶胶凝胶组合物
    • WO2010127693A1
    • 2010-11-11
    • PCT/EP2009/055398
    • 2009-05-05
    • ABB Research LtdTZAVALAS, SpirosSINGH, BandeepKORNMANN, Xavier
    • TZAVALAS, SpirosSINGH, BandeepKORNMANN, Xavier
    • C08K3/34H01B3/40
    • H01B3/40
    • Curable sol-gel composition useful for modifying the surface of a conventional electrical insulation system and providing said surface with an improved tracking and erosion resistance, characterized in that said sol-gel composition comprises: (a) cyclo-aliphatic epoxy resin compound containing at least two 1,2-epoxy groups per molecule [component (a) ]; (b) a glycidoxypropane-tri (Ci-4) alkoxysilane [component (b) ]; (c) a gamma-aminopropyl-tri (C1-4) alkoxysilane [component (c) ]; (d) a mineral filler material [component (d) ]; and (e) a hydrophobic compound [component (e) ] or a mixture of such hydrophobic compounds being selected from the group comprising fluorinated or chlorinated hydrocarbons or organopolysiloxanes; wherein the ratio of the epoxy equivalents of component (a) to the epoxy equivalents of component (b) is from 9:1 to 6:4; the molar ratio of component (c) to the epoxy equivalents of the sum of [component (a) ] and [component (b) ] is from about 0.9 to 1.1; the mineral filler material [component (d) ] is present in a quatity of about 55% by weight to about 85% by weight, calculated to the total weight of the cured composition; the hydrophobic compound [component (e) ] is present in a quantity of about 1.0% by weight to about 10% by weight, calculated to the total weight of the cured composition; whereby the curable sol-gel composition optionally contains further additives; electrical insulation system comprising said cured composition.
    • 可溶性溶胶 - 凝胶组合物可用于改变常规电绝缘系统的表面并提供所述表面具有改善的耐追踪和耐侵蚀性,其特征在于所述溶胶 - 凝胶组合物包含:(a)至少含有至少 每个分子两个1,2-环氧基[组分(a)]; (b)缩水甘油氧基丙烷 - 三(C 1-4)烷氧基硅烷[组分(b)]; (c)γ-氨基丙基三(C 1-4)烷氧基硅烷[组分(c)]; (d)矿物填充材料[组分(d)]; 和(e)疏水化合物[组分(e)]或这些疏水化合物的混合物,其选自氟化或氯化烃或有机聚硅氧烷; 其中组分(a)的环氧当量与组分(b)的环氧当量的比例为9:1至6:4; 组分(c)与[组分(a)]和[组分(b)]之和的环氧当量的摩尔比为约0.9至1.1; 矿物填充材料[组分(d)]以固化组合物的总重量计,为约55重量%至约85重量%的量; 疏水性化合物[组分(e)]以固化组合物的总重量计为约1.0重量%至约10重量%的量存在; 由此可固化溶胶 - 凝胶组合物任选地含有其它添加剂; 电绝缘系统包括所述固化的组合物。
    • 3. 发明申请
    • CURABLE EPOXY RESIN COMPOSITION
    • 可固化环氧树脂组合物
    • WO2011023227A1
    • 2011-03-03
    • PCT/EP2009/061038
    • 2009-08-27
    • ABB RESEARCH LTDSINGH, BandeepSCHAAL, StéphaneKORNMANN, XavierPURI, Prateek
    • SINGH, BandeepSCHAAL, StéphaneKORNMANN, XavierPURI, Prateek
    • C08G59/42C08G59/58
    • C08G59/4284C08G59/58C08L63/00H01B3/40
    • A curable epoxy resin composition comprising at least an epoxy resin component and a hardener component, and optionally further additives, characterized in that: (a) said epoxy resin component is a conventional epoxy resin compound or a mixture of such compounds; (b) said hardener component comprises (b1) an aliphatic and cycloaliphatic or aromatic poly-carbonic acid anhydride, preferably a phthalic acid anhydride; and (b2) a polyether-amine of the general formula (I) : H 2 N-(C n H 2n -O) m -C n H 2n -NH 2 (I) wherein n is an integer from 2 to 8; and m is from about 3 to about 100; wherein (c) the polycarbonic acid anhydride, preferably the phthalic acid anhydride [component (b1) ] is present in the curable epoxy resin composition in a concentration of 0.60 MoI to 0.93 MoI, calculated per one epoxy group weight equivalent present in the epoxy resin component of the composition; and (d) the polyether-amine of the general formula (I) [component (b2) ] is present in the curable epoxy resin composition in a concentration of about 0.02 MoI to about 0.1 MoI, calculated per one epoxy group weight equivalent present in the epoxy resin component of the composition; and electrical articles comprising an insulation material made therefrom.
    • 一种可固化环氧树脂组合物,其至少包含环氧树脂组分和硬化剂组分,以及任选的其它添加剂,其特征在于:(a)所述环氧树脂组分是常规的环氧树脂化合物或这些化合物的混合物; (b)所述固化剂组分包含(b1)脂族和脂环族或芳族聚碳酸酐,优选邻苯二甲酸酐; 和(b2)通式(I)的聚醚 - 胺:H 2 N-(C n H 2n-O)m -C n H 2n-NH 2(I)其中n是2至8的整数; m为约3至约100; 其中(c)聚碳酸酐,优选邻苯二甲酸酐[组分(b1)]以0.60摩尔至0.93摩尔的浓度存在于可固化环氧树脂组合物中,每环氧树脂组合物中存在的环氧基重量当量计算 组分的组分; 和(d)通式(I)[组分(b2)]的聚醚胺存在于可固化环氧树脂组合物中,其浓度约为0.02MoI至约0.1MoI,按每个环氧基重量当量存在 组合物的环氧树脂组分; 以及包括由其制成的绝缘材料的电气制品。