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    • 2. 发明申请
    • POLYMER CONCRETE ELECTRICAL INSULATION SYSTEM
    • 聚合物混凝土电绝缘​​系统
    • WO2009046754A1
    • 2009-04-16
    • PCT/EP2007/060633
    • 2007-10-08
    • ABB Research LtdCLIFFORD, StephenSOYEUX, FaustineKRIVDA, AndrejTILLIETTE, VincentZANT, NikolausSINGH, BandeepGREUTER, FelixRITZER, Leopold
    • CLIFFORD, StephenSOYEUX, FaustineKRIVDA, AndrejTILLIETTE, VincentZANT, NikolausSINGH, BandeepGREUTER, FelixRITZER, Leopold
    • H01B3/40C08L63/00C08K3/36
    • H01B3/40C08K3/36Y10T428/25Y10T428/252Y10T428/256Y10T428/257Y10T428/259Y10T428/269C08L63/00
    • Polymer concrete electrical insulation system comprising a hardened epoxy resin composition filled with an electrically non-conductive inorganic filler composition, wherein said polymer concrete electrical insulation system optionally may contain further additives, and wherein (a) the epoxy resin composition is based on a cycloaliphatic epoxy resin; (b) the inorganic filler composition is present within the range of about 76 % by weight to about 86 % by weight, calculated to the total weight of the polymer concrete electrical insulation system; (c) the inorganic filler composition comprises a uniform mixture of (i) an inorganic filler with an average grain size within the range of 1 micron (µm) to 100 micron (µm) [component c(i)], and (ii) an inorganic filler with an average grain size within the range of 0.1 mm (100 micron) to 2 mm [component c(ii)]; wherein (d) the inorganic filler with an average grain size within the range of 1 micron (µm) to 100 micron (µm) [component c(i)] is present in an amount within the range of 22 % to 42 %, calculated to the total weight of the polymer concrete electrical insulation system; and (e) the inorganic filler with an average grain size within the range of 0.1 mm to 2 mm [component c(ii)] is present within the range of 41 % to 61 % by weight, calculated to the total weight of the polymer concrete electrical insulation system; and method of producing said electrical insulation system.
    • 聚合物混凝土电绝缘​​系统,包括填充有非导电无机填料组合物的硬化环氧树脂组合物,其中所述聚合物混凝土电绝缘​​系统任选地可以含有其它添加剂,并且其中(a)环氧树脂组合物基于脂环族环氧树脂 树脂; (b)按照聚合物混凝土电绝缘​​系统的总重量,无机填料组合物的存在量在约76重量%至约86重量%的范围内; (c)无机填料组合物包含(i)平均粒度在1微米(μm)至100微米(μm)[组分c(i)]范围内的无机填料的均匀混合物,和(ii) 平均粒径在0.1mm(100微米)〜2mm的范围内的无机填料[组分c(ⅱ)]; 其中(d)平均晶粒尺寸在1微米(μm)至100微米(μm)[组分c(i)]范围内的无机填料以22%至42%的量存在,计算 以聚合物混凝土电绝缘​​体系的总重量计; 和(e)平均粒度在0.1mm至2mm范围内的无机填料[组分c(ii)]存在于聚合物总重量的41%至61%的范围内 混凝土电气绝缘系统; 以及制造所述电绝缘系统的方法。
    • 3. 发明申请
    • ELECTRICAL INSULATION SYSTEM
    • 电绝缘系统
    • WO2011095208A1
    • 2011-08-11
    • PCT/EP2010/051298
    • 2010-02-03
    • ABB RESEARCH LTDKORNMANN, XavierSCHMIDT, Lars, E.KRIVDA, AndrejGREUTER, FelixCARLEN, Martin
    • KORNMANN, XavierSCHMIDT, Lars, E.KRIVDA, AndrejGREUTER, FelixCARLEN, Martin
    • H01B3/30H01B3/40C08K9/06
    • C08K3/22B82Y30/00C08K3/36H01B3/40Y10T428/2982
    • Electrical insulation system with improved electrical breakdown strength, said electrical insulation system comprising a hardened polymer component having incorporated therein a conventional filler material and a selected nano-scale sized filler material, wherein (a) said hardened polymer component is selected from epoxy resin compositions, polyesters, polyamides, polybutylene terephthalate, polyurethanes and polydicyclopentadiene, and preferably is a hardened epoxy resin system; (b) said conventional filler material is a known filler material having an average grain size distribution within the range of 1 μm-500 μm, being present in a quantity within the range of 40%-65% by weight, calculated to the total weight of the insulator system; and (c) said selected nano-scale sized silica powder is a pretreated nano-scale sized filler material, having been produced by a sol- gel process; wherein said selected nano-scale sized silica powder is present within the electrical insulation system in an amount of about l%-20% by weight, calculated to the weight of the conventional filler material present in the electrical insulator system; method of preparing said insulations; and electrical insulation system containing the components (a) and (c) only.
    • 具有改善的电击穿强度的电绝缘系统,所述电绝缘系统包括硬化的聚合物组分,其中掺入了常规的填充材料和选定的纳米尺寸的填充材料,其中(a)所述硬化的聚合物组分选自环氧树脂组合物, 聚酯,聚酰胺,聚对苯二甲酸丁二醇酯,聚氨酯和聚二环戊二烯,优选为硬化环氧树脂体系; (b)所述常规填充材料是已知的平均粒度分布在1μm〜500μm范围内的填充材料,其以总重量计算在40重量%-65重量%的范围内 的绝缘子系统; 和(c)所选择的纳米尺寸二氧化硅粉末是经溶胶 - 凝胶法生产的经预处理的纳米级填料; 其中所述选定的纳米尺寸二氧化硅粉末以约1%-20%(重量)的量存在于电绝缘系统内,其量计算为存在于电绝缘体系统中的常规填料材料的重量; 制备所述绝缘体的方法; 和包含组分(a)和(c)的电绝缘体系。
    • 4. 发明申请
    • ELECTRICAL INSULATION SYSTEM WITH IMPROVED ELECTRICAL BREAKDOWN STRENGTH
    • 具有改进的电气断开强度的电气绝缘系统
    • WO2009043376A1
    • 2009-04-09
    • PCT/EP2007/060504
    • 2007-10-03
    • ABB Research LtdCARLEN, MartinKORNMANN, XavierKRIVDA, AndrejGREUTER, Felix
    • CARLEN, MartinKORNMANN, XavierKRIVDA, AndrejGREUTER, Felix
    • H01B3/40C08K3/34C08L63/00
    • H01B3/40H01B3/006H01B3/302H01B3/305H01B3/421H01B3/441
    • Electrical insulation system with improved electrical breakdown strength, said electrical insulation system comprising a hardened polymer component having incorporated therein a conventional filler material and a selected pretreated filler material, wherein (a) the hardened polymer component is selected from epoxy resin systems, polyesters, polyamides, polybutylene terephthalate, polyurethanes and polydicyclopentadiene; (b) the conventional filler material is a known filler material having an average grain size distribution within the range of 1 µm- 500 µm, being present in a quantity within the range of 40 %- 65 % by weight, calculated to the total weight of the insulator system; and (c) the selected pretreated filler material is selected from silica, quartz, or a silicate, or is a mixture of these compounds, having an average grain size distribution within the range of 1 µm-500 µm, wherein said selected filler material has been pretreated with an intercalating compound and wherein said pretreated filler material is present in an amount of 1 %-30 % by weight, calculated to the weight of the conventional filler material present in the insulator system.
    • 所述电绝缘系统包括硬化聚合物组分,其中掺入了常规的填充材料和选择的预处理填料,其中(a)硬化的聚合物组分选自环氧树脂体系,聚酯,聚酰胺 ,聚对苯二甲酸丁二醇酯,聚氨酯和聚二环戊二烯; (b)常规的填充材料是平均粒度分布在1μm〜500μm的范围内的已知填料,按照总重量计算在40〜65重量%的范围内 的绝缘子系统; 和(c)选择的预处理填料材料选自二氧化硅,石英或硅酸盐,或者是这些化合物的混合物,其平均粒度分布在1μm〜500μm的范围内,其中所述选择的填充材料具有 用嵌入化合物进行预处理,其中所述预处理的填充材料以存在于绝缘体体系中的常规填充材料的重量计为1%-30%重量的量存在。