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    • 9. 发明授权
    • 3차원 구조의 적층 이미지센서 및 그 제조방법
    • 3D结构层压固态图像传感器及其制造方法
    • KR100819746B1
    • 2008-04-08
    • KR1020070013629
    • 2007-02-09
    • 연세대학교 산학협력단
    • 한건희김보경윤일구명재민
    • H01L27/146
    • H01L27/14634H01L27/14607H01L27/1461H01L27/14689H01L27/1469
    • A 3-dimensional structure laminated solid-state image sensor and a method for manufacturing the same are provided to improve the degradation of photosensitive efficiency and charge capacity by increasing transmittance of light being incident into a photodiode. A photodiode(200) includes a semiconductor substrate, an intermediate membrane, a first conductive type single crystal epi layer(203), a second conductive type impurity layer(202), a gate electrode(201), and an SiO2 layer(206). The intermediate membrane is formed on the semiconductor substrate. The first conductive type single crystal epi layer is formed on the intermediate membrane. The second conductive type impurity layer is diffused from a surface of the first conductive type single crystal epi layer downwardly. The gate electrode is adjacent to the first conductive type single crystal epi layer and formed on the surface of the second conductive type impurity layer. The SiO2 layer exposes only a surface of the gate electrode and is applied to the whole surface of the first conductive type single crystal epi layer and the second conductive type impurity layer. A signal detection circuit unit(300) includes a semiconductor substrate(302), one or plural voltage detecting unit(314), an interlayer dielectric(304), and plural metal lines(306). The voltage detecting unit includes a source follower(312) and is formed on the semiconductor substrate. The interlayer dielectric is formed on the semiconductor substrate including the voltage detecting unit. The metal lines are in the interlayer dielectric and for a lamination junction of the photodiode.
    • 提供三维结构层叠固态图像传感器及其制造方法,以通过增加入射到光电二极管中的光的透射率来改善感光效率和充电容量的劣化。 光电二极管(200)包括半导体衬底,中间膜,第一导电型单晶外延层(203),第二导电型杂质层(202),栅电极(201)和SiO2层(206) 。 中间膜形成在半导体衬底上。 第一导电型单晶外延层形成在中间膜上。 第二导电型杂质层从第一导电型单晶外延层的表面向下扩散。 栅电极与第一导电型单晶外延层相邻并形成在第二导电型杂质层的表面上。 SiO 2层仅露出栅电极的表面,并施加到第一导电型单晶外延层和第二导电型杂质层的整个表面。 信号检测电路单元(300)包括半导体衬底(302),一个或多个电压检测单元(314),层间电介质(304)和多个金属线(306)。 电压检测单元包括源极跟随器(312)并形成在半导体衬底上。 在包括电压检测单元的半导体衬底上形成层间电介质。 金属线在层间电介质中并且用于光电二极管的层叠结。
    • 10. 发明授权
    • 3차원 구조의 다결정 화합물 반도체 이미지센서용 포토다이오드 및 그 제조 방법
    • 3D结构聚晶化合物半导体固态图像传感器及其制造方法
    • KR100819743B1
    • 2008-04-08
    • KR1020070013618
    • 2007-02-09
    • 연세대학교 산학협력단
    • 한건희김보경윤일구명재민
    • H01L27/146
    • H01L27/1461H01L27/14607H01L27/14636H01L27/14689H01L27/14692
    • A 3-dimensional structure poly-crystal compound semiconductor solid-state image sensor and a method for manufacturing the same are provided to maximize a light receiving area and to improve photosensitive efficiency by forming a metal electrode on a semiconductor epi layer. A signal transfer region(206) is formed on a first conductive type semiconductor substrate(205) and comprised of a second conductive-type impurity layer. A signal detection region(208) is separated from the signal transfer region and comprised of a second conductive type impurity layer. Plural metal lines(207) are electrically connected to the signal detection region. A transfer gate(204) is formed on the semiconductor substrate of a first conductive type. The transfer gate transmits charges between the signal transfer region and the signal detection region. An interlayer dielectric(210) of a first conductive type is formed on the semiconductor type semiconductor substrate including the signal transfer region, the transfer gate, and the signal detection region. A metal electrode(203) is connected to a photodiode region(209) and comprised of a vertical metal electrode(211) and a horizontal top metal electrode(212). A poly crystal compound semiconductor epi layer(202) is formed on a surface of the interlayer dielectric including the top metal electrode and becomes the photodiode region by implanting P-type and N-type impurities to realize a PN junction.
    • 提供三维结构的多晶体化合物半导体固态图像传感器及其制造方法,以通过在半导体外延层上形成金属电极来最大化光接收面积并提高感光效率。 信号传递区域(206)形成在第一导电类型半导体衬底(205)上,并由第二导电型杂质层构成。 信号检测区域(208)与信号传输区域分离并由第二导电型杂质层构成。 多个金属线(207)电连接到信号检测区域。 在第一导电类型的半导体衬底上形成传输门(204)。 传输门在信号传输区域和信号检测区域之间传输电荷。 在包括信号传输区域,传输门极和信号检测区域的半导体型半导体衬底上形成第一导电类型的层间电介质(210)。 金属电极(203)连接到光电二极管区域(209)并由垂直金属电极(211)和水平顶部金属电极(212)组成。 在包括顶部金属电极的层间电介质的表面上形成多晶硅化合物半导体外延层(202),并通过注入P型和N型杂质形成PN结。