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    • 10. 发明公开
    • 반도체 모듈의 공급 방법 및 반도체 모듈의 공급 장치
    • 提供半导体模块的方法和供应半导体模块的装置
    • KR1020090096881A
    • 2009-09-15
    • KR1020080021957
    • 2008-03-10
    • 삼성전자주식회사
    • 박철준신용수황재웅
    • H01L21/70
    • H01L21/67253H01L21/67721
    • A method of supplying a semiconductor module and an apparatus for supplying a semiconductor module are provided to prevent damage to the semiconductor module input an apparatus by supplying a semiconductor module to a main unit when an inputting direction of the semiconductor is in concord with a set direction. In a method of supplying a semiconductor module and an apparatus for supplying a semiconductor module, a semiconductor module(150) is prepared. The front side and backplane of the semiconductor module are tested by using a slot formed in the semiconductor module. The semiconductor module is transferred to a main processing unit(500) in case that the front side and backplane of the semiconductor module are concord with the set side. The supply of the semiconductor module is stopped in case that the front side and backplane of the semiconductor module does not coincide with the set side.
    • 提供一种提供半导体模块的方法和用于提供半导体模块的装置,以防止当半导体的输入方向与设定方向一致时,通过向主单元提供半导体模块来输入设备的半导体模块的损坏 。 在提供半导体模块的方法和用于提供半导体模块的装置中,准备半导体模块(150)。 通过使用形成在半导体模块中的槽来测试半导体模块的前侧和背板。 在半导体模块的前侧和背板与设定侧一致的情况下,将半导体模块传送到主处理单元(500)。 在半导体模块的前侧和背板与设定侧不一致的情况下,停止半导体模块的供给。