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    • 2. 发明授权
    • 공정장치의 제어방법
    • 공정장치의제어방법
    • KR100375559B1
    • 2003-03-10
    • KR1020010039371
    • 2001-07-03
    • 삼성전자주식회사
    • 전경식박찬훈박일석조봉수강현태제영호
    • H01L21/027
    • G05B13/027
    • The method involves searching previous processing data having a history identical to that of the subject loaded into the processing device. A current bias correction value is predicted from several of the most recent previous correction values out of the searched previous processing data having the identical history. A current random correction value is predicted by a neural network on the basis of several most recent random correction values. The predicted current bias and random correction values are summed as a current correction value of the processing device. The neural network is made to learn for tracking a variation of the random correction value by using the error value. An independent claim is included for a method of controlling a photolithographic device.
    • 该方法涉及搜索具有与加载到处理设备中的主体的历史相同的历史的先前处理数据。 从具有相同历史的搜索的先前处理数据中的几个最近的先前校正值预测当前偏差校正值。 当前的随机校正值由神经网络基于几个最近的随机校正值来预测。 预测的电流偏差和随机校正值被相加为处理装置的当前校正值。 通过使用误差值使神经网络学习用于跟踪随机校正值的变化。 包括用于控制光刻设备的方法的独立权利要求。
    • 3. 发明公开
    • 공정장치의 제어방법
    • 在过程设备中控制的方法
    • KR1020030003803A
    • 2003-01-14
    • KR1020010039371
    • 2001-07-03
    • 삼성전자주식회사
    • 전경식박찬훈박일석조봉수강현태제영호
    • H01L21/027
    • G05B13/027
    • PURPOSE: A method for controlling in process apparatus is provided to remarkably decrease the number of sampling processes by using an adaptive least mean square neural network(ALMS-NN) algorithm which is effectively applied in a process highly depending upon the sampling process without depending upon history data. CONSTITUTION: Previous process data having the same history as a process target material loaded into the process apparatus is searched. A present bias correction value is presumed from a plurality of recent correction values among the previous process data having the same history. A present land correction value is presumed by a neural network based upon a plurality of previous land correction values among the previous process data. The bias correction value and the land correction value are added together by using the present correction value of the process apparatus. The neural network learns to tract a change of the land correction value by using an error value between an input value of the process apparatus and a measurement value of the process apparatus.
    • 目的:提供一种在处理装置中进行控制的方法,通过使用自适应最小均方神经网络(ALMS-NN)算法显着减少采样过程的数量,该算法在高度取决于采样过程的情况下有效地应用,而不依赖于 历史数据 构成:搜索与加载到处理装置中的过程目标材料相同历史的先前过程数据。 从具有相同历史的先前处理数据中的多个最近的校正值推定出当前偏置校正值。 基于先前处理数据中的多个先前的土地修正值,由神经网络推定现有的土地修正值。 通过使用处理装置的当前校正值将偏置校正值和面校正值相加在一起。 神经网络通过使用处理装置的输入值与处理装置的测量值之间的误差值来学习改变土地修正值。
    • 6. 发明授权
    • 오버레이 계측설비를 이용한 패턴의 임계치수 측정방법
    • 使用覆盖测量装置测量图案的关键尺寸的方法
    • KR100834832B1
    • 2008-06-03
    • KR1020060119040
    • 2006-11-29
    • 삼성전자주식회사
    • 조정희강현태김장훈전기현
    • H01L21/02H01L21/027
    • H01L22/12G03F7/70625G03F7/70633
    • A method for measuring a critical dimension of a pattern by using an overlay measuring apparatus is provided to enhance reliability of a semiconductor memory device by measuring accurately an open size of a fuse box. A scanning range of a z-axis of an overlay measuring apparatus is determined by using pattern thickness information(106). A step pitch of the overlay measuring apparatus is inputted and X and Y coordinates of a reticle to the pattern are inputted(108,110). A size of the pattern is inputted into the overlay measuring apparatus and a position of a measuring target pattern of the patterns is inputted(112,114). Thickness information of a passivation layer is inputted(116). The size of the pattern is measured and a high quality condition is inputted(118). A top region size of the pattern is measured and a position of a z-axis focus at a fuse box top region is stored(120,122). A pattern size of a succeeding lot is measured by using stored information(124). The measured pattern size of the succeeding lot is compared with the high quality condition(128).
    • 提供了一种通过使用覆盖测量装置来测量图案的临界尺寸的方法,以通过精确地测量保险丝盒的开口尺寸来增强半导体存储器件的可靠性。 通过使用图案厚度信息(106)确定覆盖测量装置的z轴的扫描范围。 输入覆盖测量装置的步距,并输入掩模版的X和Y坐标(108,110)。 将图案的尺寸输入到重叠测量装置中,并且输入图案的测量对象图案的位置(112,114)。 输入钝化层的厚度信息(116)。 测量图案的尺寸并输入高质量条件(118)。 测量图案的顶部区域尺寸并存储在保险丝盒顶部区域处的z轴焦点的位置(120,122)。 通过使用存储的信息来测量后续批次的图案尺寸(124)。 将后续批次的测量图案尺寸与高质量条件(128)进行比较。
    • 7. 发明公开
    • 반도체 웨이퍼 오버레이 보정방법
    • 校正半导体滤波器的方法
    • KR1020030030427A
    • 2003-04-18
    • KR1020010062565
    • 2001-10-11
    • 삼성전자주식회사
    • 박찬훈조봉수강현태
    • H01L21/027
    • G03F7/70633
    • PURPOSE: A method of correcting the overlay of a semiconductor wafer is provided to enhance the productivity of the semiconductor wafer by reducing the degree of overlay scattering and the number of sample recommends. CONSTITUTION: The overlay error correction value for the semiconductor wafer exposed to light by way of a stepper equipment is measured(103). The measured overlay error correction value, the variation of the stepper equipment due to the learning of input variation, and the weighted value of the pre-established plural numbers of rots are summed up to thereby produce an overlay error correction value(104). The resulting overlay error correction value is fed to the stepper, and the light exposing with respect to the next rot is subsequently made(105).
    • 目的:提供一种校正半导体晶片的覆盖层的方法,以通过降低重叠散射的程度和推荐的样品数量来提高半导体晶片的生产率。 结论:测量通过步进设备暴露于光的半导体晶片的覆盖误差校正值(103)。 将所测量的重叠误差校正值,由于输入变化学习引起的步进设备的变化以及预先确定的多个数的加权值相加,从而产生叠加误差校正值(104)。 所得到的覆盖误差校正值被馈送到步进器,并且随后对相对于下一个腐烂进行曝光的光(105)。
    • 10. 发明公开
    • 반도체 소자의 오버레이 마크 및 그 오버레이 마크를포함한 반도체 소자
    • 半导体器件的覆盖标记和包含相同标记的半导体器件
    • KR1020080085543A
    • 2008-09-24
    • KR1020070027224
    • 2007-03-20
    • 삼성전자주식회사
    • 신장호박찬훈이중현이석주강현태조정희송영훈
    • H01L21/027
    • H01L23/544H01L22/34H01L2924/0002G03F7/70633H01L2223/54453H01L2924/00
    • An overlay mark of a semiconductor device and a semiconductor device comprising the same overlay mark are provided which have three or more layers can be aligned with providing efficient space utilization, mis-registration(MR) can be measured with accuracy based on the influence of the aberrations. An overlay mark(100) comprises at least one reference mark(110,120, 130,140) in rectangular shape, in which fine pattern is formed on each side of the rectangle; and a comparative mark(115,125,135,145), provided in the same number as the reference mark and in a rectangular shape smaller than the reference mark, in which fine patterns are formed on all sides, wherein the reference mark and the comparative mark are formed on different thin layers on a semiconductor substrate to allow inspection of the alignment between respective thin layers on the semiconductor substrate, and influence due to aberrations of the patterns within a memory cell can be taken into account during mis-registration(MR) computation based on the fine patterns formed on the reference and comparative marks.
    • 提供半导体器件的覆盖标记和包括相同覆盖标记的半导体器件,其具有三层或更多层可以与提供有效的空间利用相对准,可以基于以下因素的影响来精确地测量误配准(MR) 像差。 覆盖标记(100)包括矩形形状的至少一个参考标记(110,120,130,140),其中在矩形的每一侧上形成精细图案; 和比较标记(115,125,135,145),其与参考标记相同的数字,并且小于参考标记的矩形,其中在所有侧面上形成精细图案,其中参考标记和比较标记形成在不同的 在半导体衬底上的薄层可以考虑半导体衬底上的各个薄层之间的对准以及由于存储单元内的图案的像差引起的影响,可以基于精细的错误对准(MR)计算来考虑 图案形成在参考和比较标记上。