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    • 4. 发明专利
    • Semiconductor device, manufacturing method of semiconductor device and display device
    • 半导体器件,半导体器件和显示器件的制造方法
    • JP2009252962A
    • 2009-10-29
    • JP2008098346
    • 2008-04-04
    • Fujifilm Corp富士フイルム株式会社
    • TANAKA ATSUSHIUMEDA KENICHIAZUMA KOHEINANGU MAKI
    • H01L21/336H01L29/786
    • H01L27/1225H01L27/124H01L27/1292H01L29/7869H01L51/0004H01L51/0558
    • PROBLEM TO BE SOLVED: To provide a semiconductor device capable of suppressing variations in characteristics of a drain current value which are caused by low dimension precision in manufacturing by a printing technology, and to provide a manufacturing method of the semiconductor device and a display device. SOLUTION: The semiconductor device includes a substrate and a channel region which is formed on the substrate by a printing process wherein a relationship L≥2a is satisfied where L is a channel length of the channel region and (a) is a minimum dimension among pattern dimensions and inter-pattern dimensions in the same layer as a pattern that defines the channel length L; and a relationship W≥2b is satisfied where W is a channel width of the channel region and (b) is a minimum dimension among pattern dimensions and inter-pattern dimensions in the same layer as a pattern that defines the channel width W. COPYRIGHT: (C)2010,JPO&INPIT
    • 解决的问题:提供能够抑制由印刷技术制造的低尺寸精度引起的漏极电流值的特性变化的半导体器件,并且提供半导体器件的制造方法和 显示设备。 解决方案:半导体器件包括衬底和通过印刷工艺在衬底上形成的沟道区,其中满足L≥2a的关系,其中L是沟道区的沟道长度,(a)是最小的 在图案尺寸和图案间尺寸之间的尺寸在与定义通道长度L的图案相同的层中; 并且满足W≥2b的关系,其中W是沟道区的沟道宽度,(b)是与定义沟道宽度W的图案在同一层中的图案尺寸和图案间尺寸中的最小尺寸。

      版权所有(C)2010,JPO&INPIT

    • 5. 发明专利
    • Inorganic film manufacturing method
    • 无机薄膜制造方法
    • JP2014017490A
    • 2014-01-30
    • JP2013149144
    • 2013-07-18
    • Fujifilm Corp富士フイルム株式会社
    • NOMOTO MAKIUMEDA KENICHITANAKA ATSUSHIAZUMA KOHEI
    • H01L21/368C01G23/00C01G39/00C01G41/00H01L21/336H01L29/26H01L29/786
    • PROBLEM TO BE SOLVED: To provide a good-quality inorganic film having specific resistance appropriate for transistor drive.SOLUTION: An inorganic film represented by a general formula NMQO(where N represents Zn or Mg, M represents Ti, W or Mo, Q represents In or Fe, and a, b, c, d are positive real numbers) is deposited by coating of a raw material liquid containing at least one of oxide, alkoxide and organic metallic compound of N, at least one of oxide, alkoxide and organic metallic compound of M, oxide, alkoxide and organic metallic compound of Q and an organic solvent, and a semiconductor film 4 is formed by a heat treatment. A heat source of the heat treatment is an excimer laser which is a pulse laser having a pulse width of 100 ns and under.
    • 要解决的问题:提供具有适合于晶体管驱动的电阻率的优质无机膜。溶液:由通式NMQO表示的无机膜(其中N表示Zn或Mg,M表示Ti,W或Mo,Q表示 In或Fe,以及a,b,c,d为正实数)通过涂覆含有氧化物,醇盐和有机金属化合物N,至少一种氧化物,醇盐和有机物的原料液体而沉积 M,氧化物,醇盐和有机金属化合物的金属化合物和有机溶剂,并且通过热处理形成半导体膜4。 热处理的热源是作为脉冲宽度为100ns以下的脉冲激光的准分子激光器。
    • 9. 发明专利
    • Metal oxide film, its manufacturing method, and semiconductor device
    • 金属氧化物膜,其制造方法和半导体器件
    • JP2010018479A
    • 2010-01-28
    • JP2008180042
    • 2008-07-10
    • Fujifilm Corp富士フイルム株式会社
    • NANGU MAKIUMEDA KENICHITANAKA ATSUSHIAZUMA KOHEI
    • C01G9/02C04B35/00C04B35/453H01L21/336H01L21/368H01L29/786
    • PROBLEM TO BE SOLVED: To provide a metal oxide film of In-Zn-O system which can be manufactured by a comparatively low temperature liquid phase method, and has excellent characteristics as a semiconductor active layer such as TFT or the like. SOLUTION: The metal oxide film 40 is a metal oxide film which has an amorphous structure, is deposited on a substrate 10, and the main component metal element of which is In and Zn. The metal oxide film 40 has a hydroxy group in the film, and the metal oxide film has a composition distribution that satisfies the following formula (1): C Zn (T)/C In (T)≥4.0×C Zn (B)/C In (B) (1) (wherein, C Zn (B)/C In (B) exhibits a Zn/In mole ratio in the film surface of the substrate side, and C Zn (T)/C In (T) exhibits a Zn/In mole ratio in the film surface of the opposite side of the substrate). COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供可以通过相对低温液相法制造的In-Zn-O体系的金属氧化物膜,并且作为诸如TFT等的半导体有源层具有优异的特性。 解决方案:金属氧化物膜40是具有非晶结构的金属氧化物膜,沉积在基板10上,其主要成分金属元素是In和Zn。 金属氧化物膜40在膜中具有羟基,金属氧化物膜的组成分布满足下式(1):C Zn (T)/℃< /SB>(T)≥4.0×CZn(B)/CIn(B)(1)(其中,C Zn B)/ C (B)在基材侧的膜表面中表现出Zn / In摩尔比,并且C(SB)/ C In (T)在衬底的相对侧的膜表面中表现出Zn / In摩尔比)。 版权所有(C)2010,JPO&INPIT