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1. 发明专利

JP2014008692A Method of manufacturing polishing pad molding die, polishing pad molding die manufactured by the same method, and polishing pad manufactured by the same die 有权
标题翻译：制造抛光板模具的方法，由相同方法制造的抛光垫模具和由相同模具制造的抛光垫
公开(公告)号：JP2014008692A
公开(公告)日：2014-01-20
申请号：JP2012147422
申请日：2012-06-29
申请人： Mishima Kosan Co Ltd , 三島光産株式会社 , Kyushu Institute Of Technology , 国立大学法人九州工業大学
发明人： TASHIRO YASUNORI , TAKADA MASATO , NAKA TOSHIAKI , MATSUO MASAAKI , ITO TAKAHIRO , SUZUKI YOSHITOMO , KIMURA KEIICHI , KHAJORNRUNGRUANG PANART
IPC分类号： B29C33/38 , B24B37/26 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a polishing pad molding die in which a polishing pad that performs a flattening work highly accurately and highly efficiently is manufactured, a polishing pad molding die manufactured by the method, and a polishing pad manufactured by the die.SOLUTION: A method of manufacturing a polishing pad molding die 10 for a polishing pad 13 on which a micro pattern A having fine protrusions 12 arranged thereon has: a positive die fabrication process of forming fine reaction protrusions having the same dimensions as the fine protrusions 12 in accordance with arrangement of the fine protrusions 12 on one surface side of a substrate to fabricate a positive die having a micro pattern B on which the fine reaction protrusions are arrayed; a negative die fabrication process of fabricating a negative die on which a micro pattern C, in which fine recesses having the same dimensions as the fine reaction protrusions and an inverted concavo-convex relationship are arrayed, is formed, from the positive die at a position corresponding to the fine reaction protrusions; and an assembly process of closely arranging the negative die 18 on a base 17 while setting the surface on which the micro pattern C is formed to a front side to fabricate the polishing pad molding die 10.
摘要翻译：要解决的问题：提供一种制造抛光垫成型模具的方法，其中制造高精度高效地进行压平加工的抛光垫，通过该方法制造的抛光垫成型模具和由该方法制造的抛光垫，该抛光垫成型模具10用于抛光垫13，在其上具有布置有微细突起12的微图案A具有：正模制造工艺，其形成具有相同尺寸的精细反应突起根据在基板的一个表面侧上的细微突起12的布置的细突起12，以制造具有微细图案B的正模具，精细反应突起排列在其上; 制造负模具的负模制造工艺，在其上排列具有与微细反应突起具有相同尺寸的微细凹槽和倒置凹凸关系的微图案C，其中，从正模具在位置对应于微细反应突起; 以及将负模具18紧密地布置在基座17上，同时将形成有微图案C的表面设置在前侧以制造抛光垫成型模具10的组装过程。

2. 发明专利

JP2015013325A 精密研磨方法有权
标题翻译：精密抛光方法
公开(公告)号：JP2015013325A
公开(公告)日：2015-01-22
申请号：JP2013139863
申请日：2013-07-03
申请人：三島光産株式会社 , Mishima Kosan Co Ltd , 国立大学法人九州工業大学 , Kyushu Institute Of Technology
发明人： NAKA TOSHIAKI , TASHIRO YASUNORI , ONIKI TAKAHIRO , TAKADA MASATO , SUZUKI YOSHITOMO , ITO TAKAHIRO , KHAJORNRUNGRUANG PANART
IPC分类号： B24B37/24 , B24B37/00 , H01L21/304
CPC分类号： B24B37/26 , C09G1/00
摘要：【課題】半導体基板等の平坦性が高度に要求される部材の平坦加工を安定して、かつ高効率に行うことが可能な精密研磨方法及び研磨機を提供する。【解決手段】研磨パッド10を上面に取付けた研磨定盤11を回転させ、研磨パッド10の表面に水酸化フラーレン又は水酸化フラーレン会合体が分散した研磨スラリー12を滴下しながら、被加工物14の被研磨面を研磨パッド10の表面に押圧して被研磨面の研磨を行う精密研磨方法において、研磨パッド10の表面に、高さHが0.1〜20μmの微細突起15が、隣り合う微細突起15の頂部の間隔Dを1.1〜60μm、隣り合う微細突起15の底部間の間隔Gを1〜50μmとして分散配置されたマイクロパターンを形成する。【選択図】図1
摘要翻译：要解决的问题：为了提供精密抛光方法和抛光机，能够使需要平坦度的半导体基板等构件能够进行稳定高效的平坦化处理。解决方案：在精密抛光方法中，具有抛光的研磨面板11 旋转安装在上表面的垫10，在抛光垫10的表面上滴下羟基化富勒烯或羟基化富勒烯缔合物的分散在其上的研磨浆料12，将工件14的被研磨面按压抛光垫10的表面以抛光待抛光的表面。在抛光垫10的表面上形成微型图案，其中高度H为0.1-20μm的微型突起15被分散和布置，间隔D为1.1-60μm，相邻的微型突起15的顶部被定义为相邻的微型突起15的底部之间的间隔G定义为1-50μm。

3. 发明专利

JP2014008693A Method of manufacturing polishing pad molding die, polishing pad molding die manufactured by the same method, and polishing pad manufactured by the same die 有权
标题翻译：制造抛光板模具的方法，由相同方法制造的抛光垫模具和由相同模具制造的抛光垫
公开(公告)号：JP2014008693A
公开(公告)日：2014-01-20
申请号：JP2012147442
申请日：2012-06-29
申请人： Mishima Kosan Co Ltd , 三島光産株式会社 , Kyushu Institute Of Technology , 国立大学法人九州工業大学
发明人： TASHIRO YASUNORI , TAKADA MASATO , NAKA TOSHIAKI , MATSUO MASAAKI , ITO TAKAHIRO , SUZUKI YOSHITOMO , KIMURA KEIICHI , KHAJORNRUNGRUANG PANART
IPC分类号： B29C33/38 , B24B37/26 , C23F1/00 , C25D1/00 , C25D1/10 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a polishing pad molding die in which a polishing pad that performs a flattening work highly accurately and highly efficiently is manufactured, a polishing pad molding die manufactured by the method, and a polishing pad manufactured by the die.SOLUTION: A method of manufacturing a polishing pad molding die 10 for a polishing pad 13 on which a micro pattern α having fine protrusions 12 arranged thereon has: a master die fabrication process of fabricating a master die 26, on which a micro pattern β having an inverted concavo-convex relationship with the micro pattern α is formed, on one side of a substrate 21; a positive slave die fabrication process of fabricating a positive slave die 27, on the surface layer of which a micro pattern γ is formed, by using the master die 26; a negative slave die fabrication process of fabricating a negative slave die 18, on the surface layer of which a micro pattern δ is formed, by using the positive slave die 27; and an assembly process of arraying and fixing the negative slave die 18 on a base 17 while facing the surface layer on which the micro pattern δ is formed upward to constitute the polishing pad molding die 10.
摘要翻译：要解决的问题：提供一种制造抛光垫成型模具的方法，其中制造高精度，高效率地进行压平加工的抛光垫，通过该方法制造的抛光垫成型模具和由该方法制造的抛光垫，该模具制造用于抛光垫13的抛光垫成型模具10，其上具有布置在其上的具有细突起12的微图案α具有：制造主模具26的主模制造工艺，模式＆bgr 在基板21的一侧形成与微图案α具有倒置的凹凸关系; 通过使用主模26，在其形成有微图案γ的表面层上制造正的从模具27的正的从模制造工艺; 通过使用正的从模具27，在其形成微图案δ的表面层上制造负的从属裸片18的负的从属裸片制造工艺; 以及将负型副模具18排列并固定在基座17上同时朝向其上形成微图案δ的表面层构成抛光垫成型模具10的组装工艺。

4. 发明专利

JP2014172156A Property measuring device for polishing liquid 有权
标题翻译：用于抛光液体的物性测量装置
公开(公告)号：JP2014172156A
公开(公告)日：2014-09-22
申请号：JP2013049687
申请日：2013-03-12
申请人： Ebara Corp , 株式会社荏原製作所 , Kyushu Institute Of Technology , 国立大学法人九州工業大学
发明人： MATSUO NAONORI , MOCHIZUKI NOBUHIRO , SUZUKI YOSHITOMO , FUKAGAWA HIRONOBU , KIMURA KEIICHI , KHAJORNRUNGRUANG PANART
IPC分类号： B24B37/00 , B24B37/34 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a property measuring device for a polishing liquid capable of stably and directly measuring the property of the polishing liquid existing on an abrasive pad.SOLUTION: A property measuring device for a polishing liquid includes: a polishing liquid storage mechanism 6 for storing a polishing liquid by damming the polishing liquid on an abrasive pad 2; and a sensor 7 for measuring the property of the polishing liquid stored in the polishing liquid storage mechanism 6. The sensor 7 is capable of directly measuring pH or ORP (oxidation reduction potential) of the polishing liquid so as to be used for controlling polishing conditions, such as a condition of supplying the polishing liquid.
摘要翻译：要解决的问题：提供一种能够稳定且直接地测量存在于研磨垫上的抛光液的性质的抛光液性质测量装置。解决方案：一种用于抛光液的性质测量装置，包括：抛光液储存机构 6，用于通过将抛光液体阻挡在研磨垫2上来存储抛光液; 以及用于测量存储在抛光液体存储机构6中的抛光液的性质的传感器7.传感器7能够直接测量抛光液的pH或ORP（氧化还原电位），以用于控制抛光条件，例如提供抛光液的条件。

5. 发明专利

JP2012248594A Abrasive 审中-公开
标题翻译：磨料
公开(公告)号：JP2012248594A
公开(公告)日：2012-12-13
申请号：JP2011117617
申请日：2011-05-26
申请人： Kyushu Institute Of Technology , 国立大学法人九州工業大学
发明人： SUZUKI YOSHITOMO , KIMURA KEIICHI , KHAJORNRUNGRUANG PANART , SAITO TAKASHI , KORESAWA TATSUYA
IPC分类号： H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To improve processing rates in wrapping and CMP of hard-to-process materials such as aluminum oxide (sapphire) and silicon carbide, namely SiC.SOLUTION: This abrasive is used to polish materials made of aluminum oxide or silicon carbide. The abrasive is formed by mixing fullerene particles and silica particles with alkaline solution. This alkaline solution is potassium hydroxide water solution, namely KOH water solution, and the fullerene particles of fullerene hydroxide and the silica particles have been mixed in the range from 0.01 wt% to 1 wt% and in the range from 1 to 30 wt%, respectively, with the KOH water solution.
摘要翻译：要解决的问题：提高硬化处理材料如氧化铝（蓝宝石）和碳化硅（即SiC）的包装和CMP的加工速率。
解决方案：该磨料用于抛光由氧化铝或碳化硅制成的材料。研磨剂通过将富勒烯颗粒和二氧化硅颗粒与碱性溶液混合而形成。该碱性溶液是氢氧化钾水溶液，即KOH水溶液，富勒烯氢氧化物的富勒烯颗粒和二氧化硅颗粒在0.01重量％至1重量％的范围内混合，在1至30重量％的范围内，分别用KOH水溶液。版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP2013049112A Polishing pad and manufacturing method thereof 审中-公开
标题翻译：抛光垫及其制造方法
公开(公告)号：JP2013049112A
公开(公告)日：2013-03-14
申请号：JP2011188471
申请日：2011-08-31
申请人： Kyushu Institute Of Technology , 国立大学法人九州工業大学
发明人： SUZUKI YOSHITOMO , KIMURA KEIICHI , KHAJORNRUNGRUANG PANART , YASUDA KEISUKE , ISONO SHINTARO
IPC分类号： B24B37/26 , B29C59/02 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To improve polishing performance by selectively forming a structure reflecting a frequency component and an amplitude that contribute to the work for the surface unevenness of a polishing pad.SOLUTION: In the polishing pad, a base material layer and a plurality of projections, provided on a surface of the base material layer and having a slope from a surface side of the base material layer to a tip side, are integrally formed with a PEEK (polyetheretherketone) material. The plurality of projections are arranged keeping a prescribed space with each other in length and lateral directions on the surface of the base material layer.
摘要翻译：要解决的问题：通过选择性地形成反映有助于抛光垫的表面凹凸的加工的频率分量和振幅的结构，来提高抛光性能。解决方案：在抛光垫中，在基材层的表面上设置有从基材层的表面侧到顶端侧的斜面的基材层和多个突起，一体形成与PEEK（聚醚醚酮）材料。多个突起被布置成在基材层的表面上沿长度方向和横向彼此保持规定的间隔。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2014172154A Apparatus for measurement of surface characteristics of an abrasive pad 有权
标题翻译：用于测量抛光垫表面特性的装置
公开(公告)号：JP2014172154A
公开(公告)日：2014-09-22
申请号：JP2013049685
申请日：2013-03-12
申请人： Ebara Corp , 株式会社荏原製作所 , Kyushu Institute Of Technology , 国立大学法人九州工業大学
发明人： MATSUO NAONORI , KIMURA KEIICHI , SUZUKI YOSHITOMO , KHAJORNRUNGRUANG PANART , KUSHIDA TAKASHI
IPC分类号： B24B37/11 , B24B37/00 , B24B49/12 , B24B49/18 , G01B11/30 , H01L21/304
CPC分类号： G01N21/4738 , B24B37/005 , G01B11/303
摘要： PROBLEM TO BE SOLVED: To provide an apparatus for measurement of surface characteristics of an abrasive pad which allows accurate surface characteristics of an abrasive pad by suppressing effects due to various disturbances and a polishing apparatus provided with the apparatus for the measurement.SOLUTION: An apparatus for measurement of surface characteristics of an abrasive pad 2 for polishing a to-be-polished surface of a substrate W by coming in sliding contact with the substrate W includes a laser source 31 radiating a laser beam and a light-receiving element 35 which receives scattered light reflected and/or scattered by the abrasion pad 2 through the light-receiving element 35 and provides an intensity distribution corresponding to a space wavelength spectrum based on the surface characteristics of the abrasive pad 2 by means of optical Fourier transformation. The laser beam is applied at such an angle as not to reach the bottom part of pores formed in the surface of the abrasive pad 2.
摘要翻译：要解决的问题：提供一种用于测量研磨垫的表面特性的装置，其通过抑制由各种干扰引起的影响和具有测量装置的研磨装置，从而允许研磨垫的精确表面特性。解决方案：一种装置用于通过与基板W滑动接触来抛光衬底W的被抛光表面的研磨垫2的表面特性的测量包括：辐射激光束的激光源31和接收激光束的光接收元件35 通过光接收元件35由磨蚀垫2反射和/或散射的散射光，并且通过光学傅里叶变换提供与基于磨料垫2的表面特性相对应的空间波长谱的强度分布。激光束以不能到达形成在研磨垫2的表面中的孔的底部的角度施加。

8. 发明专利

JP2012137484A Measurement device and method of three-dimensional surface 有权
标题翻译：测量装置和三维表面的方法
公开(公告)号：JP2012137484A
公开(公告)日：2012-07-19
申请号：JP2011266969
申请日：2011-12-06
申请人： Kyushu Institute Of Technology , 国立大学法人九州工業大学
发明人： KHAJORNRUNGRUANG PANART , KIMURA KEIICHI , SUZUKI YOSHITOMO
IPC分类号： G01B11/30 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To allow a complicated surface shape of an abrasive pad for CMP to be quantitatively evaluated as it is in real time by using an optical Fourier transformation.SOLUTION: A solution layer regularizing base plate is mounted on a three-dimensional micro irregular face to be evaluated via a solution. A laser irradiation part irradiates the micro irregular face with a laser beam of single wavelength light through the solution layer regularizing base plate. A Fourier-transformed image formed by optically Fourier-transforming light diffused and diffracted from the micro irregular face is acquired by a Fourier-transformed image acquisition part. The Fourier-transformed image is photoelectrically converted into an electrical signal as a light intensity distribution by a signal converter. The waveform of the acquired light intensity distribution is analyzed into a fundamental wavenumber and at least one higher harmonic wavenumber, and respective wavelengths and amplitudes are extracted as spectral information to evaluate the shape of the three-dimensional micro irregular face.
摘要翻译：要解决的问题：通过使用光学傅立叶变换，实时地对CMP的研磨垫的复杂表面形状进行实时定量评价。解决方案：将解决方案层正规化的基板安装在三维微不平面上，以通过溶液进行评估。激光照射部分通过溶液层正则化基板用单波长光的激光束照射微观不规则面。通过傅里叶变换图像获取部分获得通过光学傅立叶变换由微观不规则面扩散和衍射的光形成的傅里叶变换图像。傅里叶变换图像通过信号转换器光电转换成电信号作为光强度分布。所获取的光强度分布的波形被分析为基本波数和至少一个较高谐波波数，并且提取相应的波长和幅度作为光谱信息以评估三维微观不规则面的形状。版权所有（C）2012，JPO＆INPIT

9. 发明专利

JP2006303286A Laser irradiation microworking method and semiconductor wafer constituted by using the same 有权
标题翻译：使用相同的激光辐射微波法和半导体波长
公开(公告)号：JP2006303286A
公开(公告)日：2006-11-02
申请号：JP2005124734
申请日：2005-04-22
申请人： Kyushu Institute Of Technology , Osaka Univ , 国立大学法人九州工業大学 , 国立大学法人大阪大学
发明人： KIMURA KEIICHI , TAKATANI YASUHIRO , MIYOSHI TAKASHI , SUZUKI YOSHITOMO
IPC分类号： H01L21/306 , B23K26/00 , B23K26/06 , B23K26/12 , B23K26/36 , B23K101/40 , H01L21/3213
摘要： PROBLEM TO BE SOLVED: To carry out a removal working of copper and to carry out a flattening working by non-contacting by carrying out a laser irradiation to a Cu remaining film in chemical solution (working liquid). SOLUTION: A laser irradiation microworking method comprises the steps of placing a metal material in the chemical solution, forming a passivity film on this metal front surface in the chemical solution, removing the passivity film by means of a laser ablation by selectively irradiating a laser beam, and removing a material by performing an etching action by the chemical solution with respect to only a part where the passivity film is removed. Consequently, it is possible to selectively carry out the removal working of a copper film formed on a semiconductor wafer. The semiconductor wafer is soaked into the working liquid, and a focusing laser beam is selectively irradiated to a place where copper should be removed, and the removal working of the copper film is selectively carried out. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：通过对化学溶液（工作液体）中的Cu残留膜进行激光照射，进行铜的去除加工并进行非接触的平坦化加工。解决方案：激光照射微加工方法包括以下步骤：将金属材料放置在化学溶液中，在化学溶液的该金属表面上形成被动膜，通过激光烧蚀去除被动膜，通过选择性地照射激光束，并且通过仅通过除去被动膜的部分进行化学溶液的蚀刻作用来除去材料。因此，可以选择性地进行形成在半导体晶片上的铜膜的去除加工。将半导体晶片浸入工作液中，并且将聚焦激光束选择性地照射到应去除铜的位置，并且选择性地进行铜膜的去除加工。版权所有（C）2007，JPO＆INPIT

10. 发明专利

JP2014172153A Method of measuring surface characteristics of abrasive pad 有权
标题翻译：测量磨料表面特性的方法
公开(公告)号：JP2014172153A
公开(公告)日：2014-09-22
申请号：JP2013049684
申请日：2013-03-12
申请人： Ebara Corp , 株式会社荏原製作所 , Kyushu Institute Of Technology , 国立大学法人九州工業大学
发明人： MATSUO NAONORI , KIMURA KEIICHI , SUZUKI YOSHITOMO , KHAJORNRUNGRUANG PANART , KUSHIDA TAKASHI
IPC分类号： B24B37/34 , B24B37/00 , B24B49/12 , B24B49/18 , G01B11/30 , H01L21/304
CPC分类号： G01N21/4738 , B24B37/20 , B24B49/12 , H01L21/30625 , H01L22/10
摘要： PROBLEM TO BE SOLVED: To provide a method of measuring surface characteristics of an abrasive pad which allows determining whether or not the surface characteristics of an abrasive pad are such as to achieve required polishing performance by measuring surface characteristics of the abrasive pad.SOLUTION: A method of measuring surface characteristics of an abrasive pad 2 for polishing a to-be-polished surface of a substrate by coming in sliding contact with the substrate comprises irradiating the abrasive pad 2 with a laser beam and receiving the scattered light reflected and/or scattered by the abrasive pad 2 through a light-receiving element 32 to obtain an intensity distribution corresponding to a space wavelength spectrum based on the surface characteristics of the abrasive pad 2 by means of optical Fourier transformation and calculating values representing the surface characteristics of the abrasive pad 2 on the basis of the intensity distribution corresponding to two different specified space wavelength ranges.
摘要翻译：要解决的问题：提供一种测量研磨垫的表面特性的方法，其允许确定研磨垫的表面特性是否通过测量研磨垫的表面特性来实现所需的抛光性能。解决方案：A 用于通过与基板滑动接触来抛光待抛光表面的研磨垫2的表面特性的方法包括用研磨垫2照射激光束并接收反射和/或散射的散射光通过研磨垫2通过光接收元件32，以通过光学傅立叶变换获得与基于磨料垫2的表面特性相对应的空间波长谱的强度分布，并计算代表磨料垫的表面特性的值 2基于对应于两个不同特征的强度分布确定的空间波长范围。

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