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1. 发明专利

JP2014172156A Property measuring device for polishing liquid 有权
标题翻译：用于抛光液体的物性测量装置
公开(公告)号：JP2014172156A
公开(公告)日：2014-09-22
申请号：JP2013049687
申请日：2013-03-12
申请人： Ebara Corp , 株式会社荏原製作所 , Kyushu Institute Of Technology , 国立大学法人九州工業大学
发明人： MATSUO NAONORI , MOCHIZUKI NOBUHIRO , SUZUKI YOSHITOMO , FUKAGAWA HIRONOBU , KIMURA KEIICHI , KHAJORNRUNGRUANG PANART
IPC分类号： B24B37/00 , B24B37/34 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a property measuring device for a polishing liquid capable of stably and directly measuring the property of the polishing liquid existing on an abrasive pad.SOLUTION: A property measuring device for a polishing liquid includes: a polishing liquid storage mechanism 6 for storing a polishing liquid by damming the polishing liquid on an abrasive pad 2; and a sensor 7 for measuring the property of the polishing liquid stored in the polishing liquid storage mechanism 6. The sensor 7 is capable of directly measuring pH or ORP (oxidation reduction potential) of the polishing liquid so as to be used for controlling polishing conditions, such as a condition of supplying the polishing liquid.
摘要翻译：要解决的问题：提供一种能够稳定且直接地测量存在于研磨垫上的抛光液的性质的抛光液性质测量装置。解决方案：一种用于抛光液的性质测量装置，包括：抛光液储存机构 6，用于通过将抛光液体阻挡在研磨垫2上来存储抛光液; 以及用于测量存储在抛光液体存储机构6中的抛光液的性质的传感器7.传感器7能够直接测量抛光液的pH或ORP（氧化还原电位），以用于控制抛光条件，例如提供抛光液的条件。

2. 发明专利

JP2014172154A Apparatus for measurement of surface characteristics of an abrasive pad 有权
标题翻译：用于测量抛光垫表面特性的装置
公开(公告)号：JP2014172154A
公开(公告)日：2014-09-22
申请号：JP2013049685
申请日：2013-03-12
申请人： Ebara Corp , 株式会社荏原製作所 , Kyushu Institute Of Technology , 国立大学法人九州工業大学
发明人： MATSUO NAONORI , KIMURA KEIICHI , SUZUKI YOSHITOMO , KHAJORNRUNGRUANG PANART , KUSHIDA TAKASHI
IPC分类号： B24B37/11 , B24B37/00 , B24B49/12 , B24B49/18 , G01B11/30 , H01L21/304
CPC分类号： G01N21/4738 , B24B37/005 , G01B11/303
摘要： PROBLEM TO BE SOLVED: To provide an apparatus for measurement of surface characteristics of an abrasive pad which allows accurate surface characteristics of an abrasive pad by suppressing effects due to various disturbances and a polishing apparatus provided with the apparatus for the measurement.SOLUTION: An apparatus for measurement of surface characteristics of an abrasive pad 2 for polishing a to-be-polished surface of a substrate W by coming in sliding contact with the substrate W includes a laser source 31 radiating a laser beam and a light-receiving element 35 which receives scattered light reflected and/or scattered by the abrasion pad 2 through the light-receiving element 35 and provides an intensity distribution corresponding to a space wavelength spectrum based on the surface characteristics of the abrasive pad 2 by means of optical Fourier transformation. The laser beam is applied at such an angle as not to reach the bottom part of pores formed in the surface of the abrasive pad 2.
摘要翻译：要解决的问题：提供一种用于测量研磨垫的表面特性的装置，其通过抑制由各种干扰引起的影响和具有测量装置的研磨装置，从而允许研磨垫的精确表面特性。解决方案：一种装置用于通过与基板W滑动接触来抛光衬底W的被抛光表面的研磨垫2的表面特性的测量包括：辐射激光束的激光源31和接收激光束的光接收元件35 通过光接收元件35由磨蚀垫2反射和/或散射的散射光，并且通过光学傅里叶变换提供与基于磨料垫2的表面特性相对应的空间波长谱的强度分布。激光束以不能到达形成在研磨垫2的表面中的孔的底部的角度施加。

3. 发明专利

JP2014172153A Method of measuring surface characteristics of abrasive pad 有权
标题翻译：测量磨料表面特性的方法
公开(公告)号：JP2014172153A
公开(公告)日：2014-09-22
申请号：JP2013049684
申请日：2013-03-12
申请人： Ebara Corp , 株式会社荏原製作所 , Kyushu Institute Of Technology , 国立大学法人九州工業大学
发明人： MATSUO NAONORI , KIMURA KEIICHI , SUZUKI YOSHITOMO , KHAJORNRUNGRUANG PANART , KUSHIDA TAKASHI
IPC分类号： B24B37/34 , B24B37/00 , B24B49/12 , B24B49/18 , G01B11/30 , H01L21/304
CPC分类号： G01N21/4738 , B24B37/20 , B24B49/12 , H01L21/30625 , H01L22/10
摘要： PROBLEM TO BE SOLVED: To provide a method of measuring surface characteristics of an abrasive pad which allows determining whether or not the surface characteristics of an abrasive pad are such as to achieve required polishing performance by measuring surface characteristics of the abrasive pad.SOLUTION: A method of measuring surface characteristics of an abrasive pad 2 for polishing a to-be-polished surface of a substrate by coming in sliding contact with the substrate comprises irradiating the abrasive pad 2 with a laser beam and receiving the scattered light reflected and/or scattered by the abrasive pad 2 through a light-receiving element 32 to obtain an intensity distribution corresponding to a space wavelength spectrum based on the surface characteristics of the abrasive pad 2 by means of optical Fourier transformation and calculating values representing the surface characteristics of the abrasive pad 2 on the basis of the intensity distribution corresponding to two different specified space wavelength ranges.
摘要翻译：要解决的问题：提供一种测量研磨垫的表面特性的方法，其允许确定研磨垫的表面特性是否通过测量研磨垫的表面特性来实现所需的抛光性能。解决方案：A 用于通过与基板滑动接触来抛光待抛光表面的研磨垫2的表面特性的方法包括用研磨垫2照射激光束并接收反射和/或散射的散射光通过研磨垫2通过光接收元件32，以通过光学傅立叶变换获得与基于磨料垫2的表面特性相对应的空间波长谱的强度分布，并计算代表磨料垫的表面特性的值 2基于对应于两个不同特征的强度分布确定的空间波长范围。

4. 发明专利

JP2013049112A Polishing pad and manufacturing method thereof 审中-公开
标题翻译：抛光垫及其制造方法
公开(公告)号：JP2013049112A
公开(公告)日：2013-03-14
申请号：JP2011188471
申请日：2011-08-31
申请人： Kyushu Institute Of Technology , 国立大学法人九州工業大学
发明人： SUZUKI YOSHITOMO , KIMURA KEIICHI , KHAJORNRUNGRUANG PANART , YASUDA KEISUKE , ISONO SHINTARO
IPC分类号： B24B37/26 , B29C59/02 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To improve polishing performance by selectively forming a structure reflecting a frequency component and an amplitude that contribute to the work for the surface unevenness of a polishing pad.SOLUTION: In the polishing pad, a base material layer and a plurality of projections, provided on a surface of the base material layer and having a slope from a surface side of the base material layer to a tip side, are integrally formed with a PEEK (polyetheretherketone) material. The plurality of projections are arranged keeping a prescribed space with each other in length and lateral directions on the surface of the base material layer.
摘要翻译：要解决的问题：通过选择性地形成反映有助于抛光垫的表面凹凸的加工的频率分量和振幅的结构，来提高抛光性能。解决方案：在抛光垫中，在基材层的表面上设置有从基材层的表面侧到顶端侧的斜面的基材层和多个突起，一体形成与PEEK（聚醚醚酮）材料。多个突起被布置成在基材层的表面上沿长度方向和横向彼此保持规定的间隔。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2014215130A 線状体振れ測定装置および方法审中-公开
标题翻译：线性体振动测量装置及方法
公开(公告)号：JP2014215130A
公开(公告)日：2014-11-17
申请号：JP2013091643
申请日：2013-04-24
申请人：国立大学法人九州工業大学 , Kyushu Institute Of Technology , 住友電工ハードメタル株式会社 , Sumitomo Electric Hardmetal Corp
发明人： KHAJORNRUNGRUANG PANART , KIMURA KEIICHI , MATANO YASUHIRO , SHIMAMATSU KATSUYOSHI , YONEKURA HIROKI
IPC分类号： G01B11/16
CPC分类号： G01B11/16
摘要：【課題】微小工具やワイヤなどの線状体の振れを高精度に測定することができる線状体振れ測定装置を提供する。【解決手段】線状体2の測定位置にて線状体2を軸回りに回転可能に支持する支持部6と、測定位置に支持された線状体2との間にスリット7を形成するスリット形成部8と、スリット7に向けて光を投光する投光部1と、投光部1から投光されてスリット7を通過した光を受光する受光部5と、投光部1から投光された光のうち、測定位置に支持された線状体2を挟んでスリット7と反対側を通過する光が受光部5に到達するのを遮蔽する遮蔽部3とを備えている。遮蔽部3におけるスリット7側の端部3aは、測定位置に支持された線状体2を挟んで投光部1と反対側においてスリット7を通過した光を遮蔽しない位置に配置されるとともに、投光方向から見て測定位置に支持された線状体2と重なる位置に配置されている。【選択図】図1
摘要翻译：要解决的问题：提供一种能够高精度地测量诸如小工具和线材的线状体的振动的线状体振动测量装置。解决方案：线状体振动测量装置包括：狭缝形成部分8，用于形成在线状体2的测量位置处的轴线之间可旋转地支撑线状体2的支撑部6与支撑在测量位置的线状体2之间的狭缝7; 用于将光朝向狭缝7突出的光投射部1; 光接收部分5，用于接收从光投影部分1突出并穿过狭缝7的光; 以及屏蔽部分3，用于屏蔽穿过与从光投射部分1投影的光中的在测量位置处的线状体2相对的一侧的光到达光接收部分5.端部屏蔽部分3中的狭缝7侧的3a被布置在不支撑在测量位置处的线状体2上的与光投影部1相反的一侧穿过狭缝7的光的位置，并且布置在与从光投射方向观察时支撑在测量位置处的线状体2重叠的位置。

6. 发明专利

JP2014008692A Method of manufacturing polishing pad molding die, polishing pad molding die manufactured by the same method, and polishing pad manufactured by the same die 有权
标题翻译：制造抛光板模具的方法，由相同方法制造的抛光垫模具和由相同模具制造的抛光垫
公开(公告)号：JP2014008692A
公开(公告)日：2014-01-20
申请号：JP2012147422
申请日：2012-06-29
申请人： Mishima Kosan Co Ltd , 三島光産株式会社 , Kyushu Institute Of Technology , 国立大学法人九州工業大学
发明人： TASHIRO YASUNORI , TAKADA MASATO , NAKA TOSHIAKI , MATSUO MASAAKI , ITO TAKAHIRO , SUZUKI YOSHITOMO , KIMURA KEIICHI , KHAJORNRUNGRUANG PANART
IPC分类号： B29C33/38 , B24B37/26 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a polishing pad molding die in which a polishing pad that performs a flattening work highly accurately and highly efficiently is manufactured, a polishing pad molding die manufactured by the method, and a polishing pad manufactured by the die.SOLUTION: A method of manufacturing a polishing pad molding die 10 for a polishing pad 13 on which a micro pattern A having fine protrusions 12 arranged thereon has: a positive die fabrication process of forming fine reaction protrusions having the same dimensions as the fine protrusions 12 in accordance with arrangement of the fine protrusions 12 on one surface side of a substrate to fabricate a positive die having a micro pattern B on which the fine reaction protrusions are arrayed; a negative die fabrication process of fabricating a negative die on which a micro pattern C, in which fine recesses having the same dimensions as the fine reaction protrusions and an inverted concavo-convex relationship are arrayed, is formed, from the positive die at a position corresponding to the fine reaction protrusions; and an assembly process of closely arranging the negative die 18 on a base 17 while setting the surface on which the micro pattern C is formed to a front side to fabricate the polishing pad molding die 10.
摘要翻译：要解决的问题：提供一种制造抛光垫成型模具的方法，其中制造高精度高效地进行压平加工的抛光垫，通过该方法制造的抛光垫成型模具和由该方法制造的抛光垫，该抛光垫成型模具10用于抛光垫13，在其上具有布置有微细突起12的微图案A具有：正模制造工艺，其形成具有相同尺寸的精细反应突起根据在基板的一个表面侧上的细微突起12的布置的细突起12，以制造具有微细图案B的正模具，精细反应突起排列在其上; 制造负模具的负模制造工艺，在其上排列具有与微细反应突起具有相同尺寸的微细凹槽和倒置凹凸关系的微图案C，其中，从正模具在位置对应于微细反应突起; 以及将负模具18紧密地布置在基座17上，同时将形成有微图案C的表面设置在前侧以制造抛光垫成型模具10的组装过程。

7. 发明专利

JP2012248594A Abrasive 审中-公开
标题翻译：磨料
公开(公告)号：JP2012248594A
公开(公告)日：2012-12-13
申请号：JP2011117617
申请日：2011-05-26
申请人： Kyushu Institute Of Technology , 国立大学法人九州工業大学
发明人： SUZUKI YOSHITOMO , KIMURA KEIICHI , KHAJORNRUNGRUANG PANART , SAITO TAKASHI , KORESAWA TATSUYA
IPC分类号： H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To improve processing rates in wrapping and CMP of hard-to-process materials such as aluminum oxide (sapphire) and silicon carbide, namely SiC.SOLUTION: This abrasive is used to polish materials made of aluminum oxide or silicon carbide. The abrasive is formed by mixing fullerene particles and silica particles with alkaline solution. This alkaline solution is potassium hydroxide water solution, namely KOH water solution, and the fullerene particles of fullerene hydroxide and the silica particles have been mixed in the range from 0.01 wt% to 1 wt% and in the range from 1 to 30 wt%, respectively, with the KOH water solution.
摘要翻译：要解决的问题：提高硬化处理材料如氧化铝（蓝宝石）和碳化硅（即SiC）的包装和CMP的加工速率。
解决方案：该磨料用于抛光由氧化铝或碳化硅制成的材料。研磨剂通过将富勒烯颗粒和二氧化硅颗粒与碱性溶液混合而形成。该碱性溶液是氢氧化钾水溶液，即KOH水溶液，富勒烯氢氧化物的富勒烯颗粒和二氧化硅颗粒在0.01重量％至1重量％的范围内混合，在1至30重量％的范围内，分别用KOH水溶液。版权所有（C）2013，JPO＆INPIT

8. 发明专利

JP2014008693A Method of manufacturing polishing pad molding die, polishing pad molding die manufactured by the same method, and polishing pad manufactured by the same die 有权
标题翻译：制造抛光板模具的方法，由相同方法制造的抛光垫模具和由相同模具制造的抛光垫
公开(公告)号：JP2014008693A
公开(公告)日：2014-01-20
申请号：JP2012147442
申请日：2012-06-29
申请人： Mishima Kosan Co Ltd , 三島光産株式会社 , Kyushu Institute Of Technology , 国立大学法人九州工業大学
发明人： TASHIRO YASUNORI , TAKADA MASATO , NAKA TOSHIAKI , MATSUO MASAAKI , ITO TAKAHIRO , SUZUKI YOSHITOMO , KIMURA KEIICHI , KHAJORNRUNGRUANG PANART
IPC分类号： B29C33/38 , B24B37/26 , C23F1/00 , C25D1/00 , C25D1/10 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a polishing pad molding die in which a polishing pad that performs a flattening work highly accurately and highly efficiently is manufactured, a polishing pad molding die manufactured by the method, and a polishing pad manufactured by the die.SOLUTION: A method of manufacturing a polishing pad molding die 10 for a polishing pad 13 on which a micro pattern α having fine protrusions 12 arranged thereon has: a master die fabrication process of fabricating a master die 26, on which a micro pattern β having an inverted concavo-convex relationship with the micro pattern α is formed, on one side of a substrate 21; a positive slave die fabrication process of fabricating a positive slave die 27, on the surface layer of which a micro pattern γ is formed, by using the master die 26; a negative slave die fabrication process of fabricating a negative slave die 18, on the surface layer of which a micro pattern δ is formed, by using the positive slave die 27; and an assembly process of arraying and fixing the negative slave die 18 on a base 17 while facing the surface layer on which the micro pattern δ is formed upward to constitute the polishing pad molding die 10.
摘要翻译：要解决的问题：提供一种制造抛光垫成型模具的方法，其中制造高精度，高效率地进行压平加工的抛光垫，通过该方法制造的抛光垫成型模具和由该方法制造的抛光垫，该模具制造用于抛光垫13的抛光垫成型模具10，其上具有布置在其上的具有细突起12的微图案α具有：制造主模具26的主模制造工艺，模式＆bgr 在基板21的一侧形成与微图案α具有倒置的凹凸关系; 通过使用主模26，在其形成有微图案γ的表面层上制造正的从模具27的正的从模制造工艺; 通过使用正的从模具27，在其形成微图案δ的表面层上制造负的从属裸片18的负的从属裸片制造工艺; 以及将负型副模具18排列并固定在基座17上同时朝向其上形成微图案δ的表面层构成抛光垫成型模具10的组装工艺。

9. 发明专利

JP2013120175A Method for measuring linear body diameter and slit width dimension 有权
标题翻译：用于测量线性体直径和狭缝宽度尺寸的方法
公开(公告)号：JP2013120175A
公开(公告)日：2013-06-17
申请号：JP2011269621
申请日：2011-12-09
申请人： Kyushu Institute Of Technology , 国立大学法人九州工業大学 , Sumitomo Electric Hardmetal Corp , 住友電工ハードメタル株式会社
发明人： KHAJORNRUNGRUANG PANART , KIMURA KEIICHI , SUZUKI YOSHITOMO , IMAMURA MAKOTO , NAKADA DAISUKE , YONEKURA HIROKI
IPC分类号： G01B11/08 , G01B11/02
CPC分类号： G01B11/08
摘要： PROBLEM TO BE SOLVED: To provide a method for measuring the diameter of a linear body capable of measuring the diameter of a small tool in which a transmission light component is increased when a laser beam is irradiated, with high accuracy.SOLUTION: The method for measuring the diameter of a linear body on the basis of an optical diffraction pattern of a laser beam with which the linear body is irradiated includes: a first process for irradiating a light reception part with a laser beam with the linear body not disposed in a measurement part to acquire a first light intensity distribution in the light reception part; a second process for irradiating the light reception part with a laser beam with the linear body disposed in the measurement part to acquire a second light intensity distribution in the light reception part; a process for acquiring an optical diffraction pattern by subtracting the second light intensity distribution acquired in the second process from the first light intensity distribution acquired in the first process; and a process for calculating the diameter of the linear body on the basis of a primary light peak interval obtained from the acquired optical diffraction pattern.
摘要翻译：要解决的问题：提供一种用于测量当激光束照射时透射光分量增加的小工具的直径的直线体的直径的测量方法，其精度高。解决方案：用于基于照射线状体的激光束的光学衍射图案来测量线状体的直径的方法包括：用激光束照射光接收部分的第一工序，该线状体未设置在测量部分中以获得光接收部分中的第一光强分布; 第二种处理方法，其中所述光接收部分用激光束照射，所述线状体设置在所述测量部分中以获得所述光接收部分中的第二光强度分布; 通过从第一处理中获取的第一光强度分布中减去在第二处理中获取的第二光强度分布来获取光学衍射图案的处理; 以及基于从所获取的光学衍射图形获得的初级光峰值间隔来计算线状体的直径的处理。版权所有（C）2013，JPO＆INPIT

10. 发明专利

JP2008304292A Rotating body measuring method and system using pulsed laser light 审中-公开
标题翻译：旋转体测量方法和使用脉冲激光的系统
公开(公告)号：JP2008304292A
公开(公告)日：2008-12-18
申请号：JP2007151208
申请日：2007-06-07
申请人： Kyushu Institute Of Technology , 国立大学法人九州工業大学
发明人： KHAJORNRUNGRUANG PANART , KIMURA KEIICHI
IPC分类号： G01B11/24
摘要： PROBLEM TO BE SOLVED: To accurately measure a profile of a tool by using a method for targeting a rotating body rotated at a high speed and using a laser diffraction light.
SOLUTION: The invention comprises: a laser irradiation apparatus for generating a flat-sheet-like pulsed laser light, and irradiating a space between the to-be-measured rotating body and a reference knife edge oppositely disposed with the pulsed laser light; and a line sensor for detecting the diffraction light diffracted by the space. The pulsed laser light has one oscillation pulse period during which the rotating body to be measured is rotated once or integer times at a high speed, and is irradiated in the same angle range of the rotating body during an oscillation pulse ON period. The line sensor receives the irradiated pulsed laser light during predetermined periods, detects an accumulated diffraction light pattern during the periods, and measures the shape of the rotating body.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：通过使用用于靶向以高速旋转的旋转体并使用激光衍射光的方法来精确地测量工具的轮廓。解决方案：本发明包括：激光照射装置，用于产生平板状脉冲激光，并且照射被测量的旋转体与与脉冲激光相反地设置的参考刀刃之间的空间 ; 以及用于检测由该空间衍射的衍射光的线传感器。脉冲激光具有一个振荡脉冲周期，在此期间，待测量的旋转体以高速旋转一次或整数倍，并且在振荡脉冲接通期间内在旋转体的相同角度范围内照射。线传感器在预定时段期间接收照射的脉冲激光，在该期间检测累积的衍射光图案，并测量旋转体的形状。版权所有（C）2009，JPO＆INPIT

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