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1. 发明授权

US08445998B1 Leadframe structures for semiconductor packages 失效
标题翻译：半导体封装的引线框架结构
公开(公告)号：US08445998B1
公开(公告)日：2013-05-21
申请号：US12712170
申请日：2010-02-24
申请人： Young-Gon Kim , Nikhil Vishwanath Kelkar , Louis Elliott Pflughaupt
发明人： Young-Gon Kim , Nikhil Vishwanath Kelkar , Louis Elliott Pflughaupt
IPC分类号： H01L23/495
CPC分类号： H01L23/4951 , H01L23/49503 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/48247 , H01L2224/49171 , H01L2924/00014 , H01L2924/10161 , H01L2924/10253 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package includes a lead structure upon which a semiconductor die is mounted with at least some portion of at least some of the leads extending to, at, or across an axis or axis of the package to militate against thermally induced growth of the package and the reduce or minimize strain within the package and reliability issue associated therewith.
摘要翻译：半导体封装包括引线结构，其上安装半导体管芯，其中至少一些引线的至少一部分延伸到封装的轴线或轴线处，或跨越封装的轴线或轴线，以阻止封装的热诱导生长，减小或最小化包装内的应变和与之相关的可靠性问题。

2. 发明授权

US08161320B2 Apparatus, memory device controller and method of controlling a memory device 有权
标题翻译：装置，存储装置控制器和控制存储装置的方法
公开(公告)号：US08161320B2
公开(公告)日：2012-04-17
申请号：US11606900
申请日：2006-12-01
申请人： Jin-Hyuk Kim , Yang-Sup Lee , Young-Gon Kim
发明人： Jin-Hyuk Kim , Yang-Sup Lee , Young-Gon Kim
IPC分类号： G06F11/00
CPC分类号： G11C29/76 , G06F12/0246 , G06F2212/1016 , G06F2212/7201 , G06F2212/7204
摘要： An apparatus, memory device controller and method of controlling a memory device are provided. The example apparatus may include a bad block bitmap referencing unit configured to obtain bad block information from a bad block bitmap based on a given memory address, the given memory address being one of a logical memory address and a physical memory address corresponding to the logical memory address, the bad block information indicating whether a given memory block corresponding to the given memory address is a bad block and a memory mapping unit configured to obtain the physical memory address corresponding to the logical memory address, and configured to obtain a reserved physical memory address corresponding to the physical memory address if the bad block information indicates that the given memory block is a bad block. In an example, the apparatus may be embodied as a memory device controller including a flash translation layer (FTL).
摘要翻译：提供了一种设备，存储器件控制器和控制存储器件的方法。该示例设备可以包括坏块位图参考单元，其被配置为基于给定的存储器地址从坏块位图获得坏块信息，给定存储器地址是与逻辑存储器对应的逻辑存储器地址之一和物理存储器地址指示与给定存储器地址相对应的给定存储块是否为坏块的坏块信息和被配置为获得与逻辑存储器地址对应的物理存储器地址的存储器映射单元，并且被配置为获得预留的物理存储器地址对应于物理存储器地址，如果坏块信息指示给定的存储器块是坏块。在一个示例中，该装置可以被实现为包括闪存转换层（FTL）的存储器件控制器。

3. 发明申请

US20110057038A1 ANTENNA, AND RADIO FREQUENCY IDENTIFYING DEVICE AND METHOD 失效
标题翻译：天线和无线电频率识别装置及方法
公开(公告)号：US20110057038A1
公开(公告)日：2011-03-10
申请号：US12688282
申请日：2010-01-15
申请人： Hoon Young KOO , Jae Gwan Song , Young Gon Kim , Hong Suk Hu , Jong Heung Park
发明人： Hoon Young KOO , Jae Gwan Song , Young Gon Kim , Hong Suk Hu , Jong Heung Park
IPC分类号： G06K7/08
CPC分类号： G06K7/10316 , H01Q1/2216 , H01Q3/08
摘要： A radio frequency identifying device minimizes a null point area within a radiation pattern by horizontally or vertically vibrating an antenna plate radiating a radio frequency beam by using at least one vibration motor.
摘要翻译：射频识别装置通过使用至少一个振动马达水平或垂直振动辐射射频波束的天线板来最小化辐射图案内的零点区域。

4. 发明授权

US07714415B2 Leadframe structures for semiconductor packages 失效
标题翻译：半导体封装的引线框结构
公开(公告)号：US07714415B2
公开(公告)日：2010-05-11
申请号：US11453216
申请日：2006-06-15
申请人： Young-Gon Kim , Nikhil Vishwanath Kelkar , Louis Elliott Pflughaupt
发明人： Young-Gon Kim , Nikhil Vishwanath Kelkar , Louis Elliott Pflughaupt
IPC分类号： H01L23/495 , H01L23/02
CPC分类号： H01L23/4951 , H01L23/49503 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/48247 , H01L2224/49171 , H01L2924/00014 , H01L2924/10161 , H01L2924/10253 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package includes a lead structure upon which a semiconductor die is mounted with at least some portion of at least some of the leads extending to, at, or across an axis or axis of the package to militate against thermally induced growth of the package and the reduce or minimize strain within the package and reliability issuse associated therewith.
摘要翻译：半导体封装包括引线结构，其上安装半导体管芯，其中至少一些引线的至少一部分延伸到封装的轴线或轴线处，或跨越封装的轴线或轴线，以阻止封装的热诱导生长，减小或最小化包装内的应变和与之相关联的可靠性。

5. 发明申请

US20090255157A1 Signboard for Vehicle 审中-公开
标题翻译：车辆招牌
公开(公告)号：US20090255157A1
公开(公告)日：2009-10-15
申请号：US11989897
申请日：2006-08-04
申请人： Young Gon Kim
发明人： Young Gon Kim
IPC分类号： G09F21/04 , B60R13/00 , G09F13/00 , G09F13/18
CPC分类号： B60R13/00
摘要： Provided is a signboard for use in a vehicle, which is installed in the rear portion of the inside of the vehicle to thus deliver a message to a driver or passengers in other vehicles which follow. The vehicle signboard includes a support member having a support plate which is adhered on one side of the inner surface of a rear glass window in the vehicle and a support bar supported by the support plate; a display unit connected to the support member; a motor unit which is fixed to the support member and makes the display unit connected with a rotating member rotate; and a power supply unit which supplies electric power to the motor unit. Accordingly, the vehicle signboard provides an effect of conveying the proper expressions such as thanks and sorry to the drivers and passengers in the other vehicles which follow without obstructing the driver's rear field of view during running.
摘要翻译：提供了一种用于车辆的招牌，其安装在车辆内部的后部，从而向随后的其他车辆中的驾驶员或乘客发送消息。车辆招牌包括：支撑构件，其具有粘附在车辆中的后玻璃窗的内表面的一侧上的支撑板和由支撑板支撑的支撑杆; 连接到所述支撑构件的显示单元; 马达单元，其固定到所述支撑构件并使与所述旋转构件连接的所述显示单元旋转; 以及向电动机单元供给电力的电源单元。因此，车辆招牌具有向其他车辆中的驾驶员和乘客传达诸如感谢和不幸的适当表达的效果，而不会在驾驶员的行驶期间阻挡驾驶员的后视场。

6. 发明申请

US20080195828A1 Methods of writing data in a non-volatile memory device to place data in an in-place arrangement 审中-公开
标题翻译：在非易失性存储器件中写入数据以将数据置于就地布置中的方法
公开(公告)号：US20080195828A1
公开(公告)日：2008-08-14
申请号：US12069765
申请日：2008-02-13
申请人： Jin-hyuk Kim , Jae-wook Cheong , Young-gon Kim
发明人： Jin-hyuk Kim , Jae-wook Cheong , Young-gon Kim
IPC分类号： G06F12/16
CPC分类号： G06F12/0246
摘要： Provided is a data writing method of copying data having logical pages prior to logical pages of data to write from a data block used in non-volatile memory device. The data writing method includes copying data having logical pages prior to a logical page of data to write from a second block to a first block, and writing the data to write in a page next to the copied prior logical pages.
摘要翻译：提供了一种数据写入方法，用于在从非易失性存储器件中使用的数据块写入数据的逻辑页面之前复制具有逻辑页面的数据。数据写入方法包括在逻辑页面数据之前复制具有从第二块到第一块写入的逻辑页面的数据，并且写入数据以写入复制的先前逻辑页面旁边的页面。

7. 发明申请

US20080042274A1 Components, methods and assemblies for stacked packages 有权
标题翻译：堆叠包的组件，方法和装配
公开(公告)号：US20080042274A1
公开(公告)日：2008-02-21
申请号：US11975996
申请日：2007-10-23
申请人： Kyong-Mo Bang , David Gibson , Young-Gon Kim , John Riley
发明人： Kyong-Mo Bang , David Gibson , Young-Gon Kim , John Riley
IPC分类号： H01L23/48 , H01L21/00
CPC分类号： H01L23/49816 , H01L23/5387 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/05599 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/50 , H01L2224/73204 , H01L2224/73215 , H01L2224/73265 , H01L2224/85399 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/1532 , H05K1/141 , H05K3/3436 , H05K2201/10674 , H05K2201/10734 , H05K2203/1572 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A bottom unit including a bottom unit semiconductor chip is mounted to a circuit board and one or more top elements such as packaged semiconductor chips are mounted to the bottom unit. Both mounting operations can be performed using the same techniques as commonly employed for mounting components to a circuit board. Ordinary packaged chips can be employed as the top elements, thereby reducing the cost of the assembly and allowing customization of the assembly by selecting packaged chips. The assembly achieves benefits similar to those obtained with a preassembled stacked chip unit, but without the expense of special handling of the bare dies included in the packaged chips.
摘要翻译：包括底部单元半导体芯片的底部单元安装到电路板，并且诸如封装半导体芯片的一个或多个顶部元件安装到底部单元。可以使用与将组件安装到电路板上通常使用的相同的技术来执行两种安装操作。通常的封装芯片可以用作顶部元件，从而降低组装成本，并允许通过选择封装的芯片来定制组件。该组件实现了与使用预组装的堆叠芯片单元获得的效果相似的优点，但是不包含包装在封装芯片中的裸芯片的特殊处理费用。

8. 发明申请

US20070138607A1 Lead assemblies with offset portions and microelectronic assemblies with leads having offset portions 审中-公开
标题翻译：具有偏移部分的引线组件和具有偏移部分的引线的微电子组件
公开(公告)号：US20070138607A1
公开(公告)日：2007-06-21
申请号：US11648052
申请日：2006-12-28
申请人： Ilyas Mohammed , Young-Gon Kim
发明人： Ilyas Mohammed , Young-Gon Kim
IPC分类号： H01L23/495
CPC分类号： H01L23/4985 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , Y10T29/49121 , Y10T29/4913 , Y10T29/49144 , H01L2924/00
摘要： A lead assembly including a connector connecting structure having a plurality of separable portions and a plurality of leads. Each of the leads defined that they have a first end, a second end, a lead axis defined by the first and the second end, and an offset portion disposed between the first end and the second end. The offset portion being offset from the lead axis and adapted to be displaced downwardly with respect to the lead axis and bonded to a contact. The leads are preferably integral with the connecting structure. The connecting structure may be arranged outwardly of the leads, or may include parts interdispersed between groups of leads. The groups of leads may or may not correspond to individual units incorporating a microelectronic element.
摘要翻译：一种引线组件，包括具有多个可分离部分和多个引线的连接器连接结构。引线中的每一个限定为它们具有由第一端和第二端限定的第一端，第二端和引线轴以及设置在第一端和第二端之间的偏移部分。偏移部分从引导轴线偏移并且适于相对于引导轴向下移位并且接合到触点。引线优选与连接结构成一体。连接结构可以布置在引线的外部，或者可以包括在引线组之间分散的部分。引线组可以或可以不对应于结合微电子元件的单个单元。

9. 发明授权

US07167491B2 Eye diagram improving method for laser transmitter 有权
标题翻译：激光发射机眼图改进方法
公开(公告)号：US07167491B2
公开(公告)日：2007-01-23
申请号：US10660405
申请日：2003-09-10
申请人： Young Gon Kim , Jae Joon Chang , Myunghee Lee
发明人： Young Gon Kim , Jae Joon Chang , Myunghee Lee
IPC分类号： H01S3/13
CPC分类号： H04B10/503
摘要： A laser transmitter includes an input stage generating an input signal to a limiting amplifier, the limiting amplifier generating an input signal to a laser driver, and the laser driver generating an input signal to a light source. The limiting amplifier has a control terminal for receiving a control signal that sets an amplitude characteristic of the input signal to the laser driver. The amplitude characteristic may be a common-mode or a peak amplitude of the input signal to the laser driver.
摘要翻译：激光发射器包括输入级，其向限制放大器产生输入信号，限幅放大器产生到激光驱动器的输入信号，激光驱动器产生到光源的输入信号。限幅放大器具有用于接收控制信号的控制端子，该控制信号将输入信号的幅度特性设置到激光驱动器。振幅特性可以是与激光驱动器的输入信号的共模或峰值幅度。

10. 发明授权

US07061122B2 Components, methods and assemblies for multi-chip packages 有权
标题翻译：用于多芯片封装的组件，方法和组件
公开(公告)号：US07061122B2
公开(公告)日：2006-06-13
申请号：US10683097
申请日：2003-10-10
申请人： Young-Gon Kim , David Gibson , Michael Warner , Philip Damberg , Philip Osborn
发明人： Young-Gon Kim , David Gibson , Michael Warner , Philip Damberg , Philip Osborn
IPC分类号： H01L29/40
CPC分类号： H05K1/141 , H01L25/105 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2225/1005 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/01327 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/3511 , H05K3/3436 , H05K2201/10719 , H05K2203/1572 , H01L2924/00 , H01L2224/05644 , H01L2924/00014 , H01L2224/05647
摘要： An ultra thin system-in-a-package (SIP) with independent test and repair capability comprises an interposer having arranged on a top surface and a bottom surface thereof a number of packaged semiconductor chips mounted via solder bumps in accordance with a Land Grid Array (LGA) format and wherein no underfill is used on the SIP.
摘要翻译：具有独立测试和修复功能的超薄系统级封装（SIP）包括：插入器，其布置在其顶表面和底表面上，多个封装的半导体芯片通过焊料凸块安装，根据Land Grid Array （LGA）格式，并且其中在SIP上不使用底部填充物。

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