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1. 发明申请

WO2006079083A3 LASER MATERIAL MICROMACHINING WITH GREEN FEMTOSECOND PULSES 审中-公开
标题翻译：激光材料MICROMACHINING与绿色FEMTOSECOND脉冲
公开(公告)号：WO2006079083A3
公开(公告)日：2007-11-01
申请号：PCT/US2006002531
申请日：2006-01-23
申请人： IMRA AMERICA INC , BOVATSEK JAMES , ARAI ALAN Y , SHAH LAWRENCE , YOSHINO FUMIYO
发明人： BOVATSEK JAMES , ARAI ALAN Y , SHAH LAWRENCE , YOSHINO FUMIYO
IPC分类号： B23K26/36
CPC分类号： B23K26/0624 , B23K26/0006 , B23K26/364 , B23K26/40 , B23K2203/172 , B23K2203/30 , B23K2203/42 , B23K2203/50 , C03B33/0222 , H01S3/0057
摘要： Various embodiments of a system described herein relate to micromachining materials using ultrashort visible laser pulses. The ultrashort laser pulses may be green and have a wavelength between about 500 to 550 nanometers in some embodiments. Additionally, the pulses may have a pulse duration of less than one picosecond in certain embodiments.
摘要翻译：本文所述的系统的各种实施例涉及使用超短可见激光脉冲的微加工材料。在一些实施例中，超短激光脉冲可以是绿色的并且具有在约500至550纳米之间的波长。另外，在某些实施例中，脉冲可以具有小于1皮秒的脉冲持续时间。

2. 发明申请

WO2006079083A9 LASER MATERIAL MICROMACHINING WITH GREEN FEMTOSECOND PULSES 审中-公开
标题翻译：激光材料MICROMACHINING与绿色FEMTOSECOND脉冲
公开(公告)号：WO2006079083A9
公开(公告)日：2006-09-28
申请号：PCT/US2006002531
申请日：2006-01-23
申请人： IMRA AMERICA INC , BOVATSEK JAMES , ARAI ALAN Y , SHAH LAWRENCE , YOSHINO FUMIYO
发明人： BOVATSEK JAMES , ARAI ALAN Y , SHAH LAWRENCE , YOSHINO FUMIYO
IPC分类号： H01S3/10
CPC分类号： B23K26/0624 , B23K26/0006 , B23K26/364 , B23K26/40 , B23K2203/172 , B23K2203/30 , B23K2203/42 , B23K2203/50 , C03B33/0222 , H01S3/0057
摘要： Various embodiments of a system described herein relate to micromachining materials using ultrashort visible laser pulses. The ultrashort laser pulses may be green and have a wavelength between about 500 to 550 nanometers in some embodiments. Additionally, the pulses may have a pulse duration of less than one picosecond in certain embodiments.
摘要翻译：本文所述的系统的各种实施例涉及使用超短可见激光脉冲的微加工材料。在一些实施例中，超短激光脉冲可以是绿色的并且具有在约500至550纳米之间的波长。另外，在某些实施例中，脉冲可以具有小于1皮秒的脉冲持续时间。

3. 发明申请

WO2011079006A1 LASER PATTERNING USING A STRUCTURED OPTICAL ELEMENT AND FOCUSED BEAM 审中-公开
标题翻译：使用结构化光学元件和聚焦光束的激光图案
公开(公告)号：WO2011079006A1
公开(公告)日：2011-06-30
申请号：PCT/US2010/060670
申请日：2010-12-16
申请人： IMRA AMERICA, INC. , ARAI, Alan Y. , YOSHINO, Fumiyo
发明人： ARAI, Alan Y. , YOSHINO, Fumiyo
IPC分类号： G01B11/00
CPC分类号： B23K26/066 , B23K26/082
摘要： Various embodiments provide for laser patterning using a structured optical element and a focused beam. In some embodiments a structured optical element may be integrally formed on a single substrate. In some embodiments, multiple optical components may be combined in an optical path to provide a desired pattern. In at least one embodiment, a projection mask is utilized to control exposure of an object to a laser output, in combination with the controlled motion of the projection mask, the controlled motion of the object and the controlled motion of the laser beam. In some embodiments, a projection mask is utilized to control exposure of an object, and the projection mask may absorb, scatter, reflect, or attenuate a laser output. In some embodiments, the projection mask may include optical elements that vary the optical power and polarization of the transmitted laser beam over regions of the projection mask.
摘要翻译：各种实施例提供使用结构化光学元件和聚焦光束的激光图案化。在一些实施例中，结构化光学元件可以一体地形成在单个基板上。在一些实施例中，多个光学部件可以组合在光路中以提供期望的图案。在至少一个实施例中，投影掩模用于控制物体对激光输出的曝光，结合投影掩模的受控运动，物体的受控运动和激光束的受控运动。在一些实施例中，使用投影掩模来控制物体的曝光，并且投影掩模可以吸收，散射，反射或衰减激光输出。在一些实施例中，投影掩模可以包括在投影掩模的区域上改变透射的激光束的光学功率和偏振的光学元件。

4. 发明申请

WO2009114375A3 TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER 审中-公开
公开(公告)号：WO2009114375A3
公开(公告)日：2009-09-17
申请号：PCT/US2009/036126
申请日：2009-03-05
申请人： IMRA AMERICA, INC. , ARAI, Alan, Y. , CHO, Gyu, C. , XU, Jingzhou , YOSHINO, Fumiyo , ZHANG, Haibin , BOVATSEK, James
发明人： ARAI, Alan, Y. , CHO, Gyu, C. , XU, Jingzhou , YOSHINO, Fumiyo , ZHANG, Haibin , BOVATSEK, James
IPC分类号： B23K26/00
摘要： Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are disclosed, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination. Reflective marks may also be formed with control of laser parameters. A transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. In some embodiments of transparent material processing, a multifocus beam generator simultaneously forms multiple beam waists spaced depthwise relative to the transparent material, thereby increasing processing speed.

5. 发明申请

WO2009114375A2 TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER 审中-公开
标题翻译：具有ULTRASH脉冲激光的透明材料加工
公开(公告)号：WO2009114375A2
公开(公告)日：2009-09-17
申请号：PCT/US2009036126
申请日：2009-03-05
申请人： IMRA AMERICA INC , ARAI ALAN Y , CHO GYU C , XU JINGZHOU , YOSHINO FUMIYO , ZHANG HAIBIN , BOVATSEK JAMES
发明人： ARAI ALAN Y , CHO GYU C , XU JINGZHOU , YOSHINO FUMIYO , ZHANG HAIBIN , BOVATSEK JAMES
IPC分类号： H01L21/027
CPC分类号： B23K26/0624 , B23K26/0057 , B23K26/006 , B23K26/0087 , B23K26/0676 , B23K26/083 , B23K26/0869 , B23K26/21 , B23K26/324 , B23K26/359 , B23K26/364 , B23K26/40 , B23K26/402 , B23K26/53 , B23K26/55 , B23K2203/50 , B23K2203/54 , B28D5/00 , B28D5/0011 , B29C65/1606 , B29C65/1612 , B29C65/1619 , B29C65/1629 , B29C65/1635 , B29C65/1638 , B29C65/1654 , B29C65/1658 , B29C65/1687 , B29C65/38 , B29C66/1122 , B29C66/43 , B29C66/71 , B29C66/73161 , B29C66/73366 , B29C66/73921 , B29C66/836 , B29C66/952 , B29K2995/0026 , B41M5/26 , B41M5/262 , B41M5/267 , C03B23/006 , C03B33/102 , C03C23/0025 , H01L21/268 , H01L21/78 , B29K2069/00
摘要： Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are disclosed, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination. Reflective marks may also be formed with control of laser parameters. A transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. In some embodiments of transparent material processing, a multifocus beam generator simultaneously forms multiple beam waists spaced depthwise relative to the transparent material, thereby increasing processing speed.
摘要翻译：公开了用于光学透明材料的超短脉冲激光加工的方法，装置和系统，例如在划线，标记，焊接和接合中的应用。例如，超短激光脉冲通过激光束穿过材料产生一次划线特征，其中至少一个划线特征形成在材料表面下方。稍微修改超短脉冲激光加工条件会产生次表面痕迹。正确布置时，这些标记在正确对齐的照明下清晰可见。还可以通过激光参数的控制来形成反射标记。可以使用玻璃以外的透明材料。用于焊接透明材料的方法使用超短激光脉冲通过局部加热产生粘结。在透明材料处理的一些实施例中，多焦点光束发生器同时形成相对于透明材料沿深度方向间隔开的多个光束束，从而提高处理速度。

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