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1. 发明申请

WO2005099957A3 PULSED LASER PROCESSING WITH CONTROLLED THERMAL AND PHYSICAL ALTERATIONS 审中-公开
公开(公告)号：WO2005099957A3
公开(公告)日：2005-10-27
申请号：PCT/US2005/008623
申请日：2005-03-14
申请人： IMRA AMERICA, INC. , YAMAMOTO, Tadashi , HARTER, Donald, J. , PATEL, Rajesh, S. , ARAI, Alan, Y.
发明人： YAMAMOTO, Tadashi , HARTER, Donald, J. , PATEL, Rajesh, S. , ARAI, Alan, Y.
IPC分类号： B23K26/067
摘要： Laser machining of material using a burst of laser pulses, tailoring the pulse width, pulse separation, wavelength, and polarization to maximize the positive effect of thermal and physical changes achieved by the previous pulse on the laser matter interaction. The first laser pulse (31) width has a duration longer than a second laser pulse (32) width. The first pulse (31) and the second pulse (32) may have the same pulse energy or differing pulse energy.

2. 发明申请

WO2006079083A3 LASER MATERIAL MICROMACHINING WITH GREEN FEMTOSECOND PULSES 审中-公开
标题翻译：激光材料MICROMACHINING与绿色FEMTOSECOND脉冲
公开(公告)号：WO2006079083A3
公开(公告)日：2007-11-01
申请号：PCT/US2006002531
申请日：2006-01-23
申请人： IMRA AMERICA INC , BOVATSEK JAMES , ARAI ALAN Y , SHAH LAWRENCE , YOSHINO FUMIYO
发明人： BOVATSEK JAMES , ARAI ALAN Y , SHAH LAWRENCE , YOSHINO FUMIYO
IPC分类号： B23K26/36
CPC分类号： B23K26/0624 , B23K26/0006 , B23K26/364 , B23K26/40 , B23K2203/172 , B23K2203/30 , B23K2203/42 , B23K2203/50 , C03B33/0222 , H01S3/0057
摘要： Various embodiments of a system described herein relate to micromachining materials using ultrashort visible laser pulses. The ultrashort laser pulses may be green and have a wavelength between about 500 to 550 nanometers in some embodiments. Additionally, the pulses may have a pulse duration of less than one picosecond in certain embodiments.
摘要翻译：本文所述的系统的各种实施例涉及使用超短可见激光脉冲的微加工材料。在一些实施例中，超短激光脉冲可以是绿色的并且具有在约500至550纳米之间的波长。另外，在某些实施例中，脉冲可以具有小于1皮秒的脉冲持续时间。

3. 发明申请

WO2005101592A2 FEMTOSECOND LASER PROCESSING SYSTEM WITH PROCESS PARAMETERS, CONTROLS AND FEEDBACK 审中-公开
标题翻译：具有过程参数，控制和反馈的FEMTOSECOND激光加工系统
公开(公告)号：WO2005101592A2
公开(公告)日：2005-10-27
申请号：PCT/US2005/008622
申请日：2005-03-14
申请人： IMRA AMERICA, INC. , SHAH, Lawrence , BOVATSEK, James, M. , ARAI, Alan, Y. , YAMAMOTO, Tadashi , PATEL, Rajesh, S. , HARTER, Donald, J.
发明人： SHAH, Lawrence , BOVATSEK, James, M. , ARAI, Alan, Y. , YAMAMOTO, Tadashi , PATEL, Rajesh, S. , HARTER, Donald, J.
IPC分类号： H01S3/10
CPC分类号： H01S3/10038 , G01J11/00 , H01S3/0014 , H01S3/005 , H01S3/0057 , H01S3/0064 , H01S3/0078 , H01S3/06754 , H01S3/10023 , H01S3/10061 , H01S3/102 , H01S3/1024 , H01S3/108 , H01S3/109 , H01S3/1305 , H01S3/1618
摘要： A femtosecond laser based laser processing system having a femtosecond laser, frequency conversion optics, beam manipulation optics, target motion control, processing chamber, diagnostic systems and system control modules. The femtosecond laser based laser processing system allows for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities.
摘要翻译：基于飞秒激光器的激光加工系统具有飞秒激光器，变频光学器件，光束操纵光学器件，目标运动控制器，处理室，诊断系统和系统控制模块。基于飞秒激光的激光加工系统允许在微加工中利用独特的热控制，并且该系统具有更大的输出光束稳定性，连续可变的重复率和独特的时间光束整形能力。

4. 发明申请

WO2005099957A2 PULSED LASER PROCESSING WITH CONTROLLED THERMAL AND PHYSICAL ALTERATIONS 审中-公开
标题翻译：具有受控热和物理变化的脉冲激光加工
公开(公告)号：WO2005099957A2
公开(公告)日：2005-10-27
申请号：PCT/US2005008623
申请日：2005-03-14
申请人： IMRA AMERICA INC , YAMAMOTO TADASHI , HARTER DONALD J , PATEL RAJESH S , ARAI ALAN Y
发明人： YAMAMOTO TADASHI , HARTER DONALD J , PATEL RAJESH S , ARAI ALAN Y
IPC分类号： B23K26/00 , B23K26/06
CPC分类号： B23K26/0624 , B23K26/0622
摘要： Laser machining of material using a burst of ultrashort laser pulses, tailoring the pulse width, pulse separation duration, wavelength, and polarization to maximize the positive effect of thermal and physical changes achieved by the previous pulse on the laser-matter interaction. Manipulations of pulse width, pulse separation duration, and pulse energies of pulses within a burst can be used to achieve better processing results. Wavelength and polarization of a laser beam may be varied pulse-to-pulse in a burst in order to produce maximum laser-matter interaction.
摘要翻译：使用超短激光脉冲的脉冲激光加工材料，定制脉冲宽度，脉冲间隔持续时间，波长和极化，以最大化由激光物质相互作用上的先前脉冲实现的热和物理变化的积极影响。可以使用脉冲宽度，脉冲间隔持续时间和突发脉冲的脉冲能量来实现更好的处理结果。激光束的波长和极化可以在脉冲串中脉冲 - 脉冲变化，以产生最大的激光物质相互作用。

5. 发明申请

WO2006079083A9 LASER MATERIAL MICROMACHINING WITH GREEN FEMTOSECOND PULSES 审中-公开
标题翻译：激光材料MICROMACHINING与绿色FEMTOSECOND脉冲
公开(公告)号：WO2006079083A9
公开(公告)日：2006-09-28
申请号：PCT/US2006002531
申请日：2006-01-23
申请人： IMRA AMERICA INC , BOVATSEK JAMES , ARAI ALAN Y , SHAH LAWRENCE , YOSHINO FUMIYO
发明人： BOVATSEK JAMES , ARAI ALAN Y , SHAH LAWRENCE , YOSHINO FUMIYO
IPC分类号： H01S3/10
CPC分类号： B23K26/0624 , B23K26/0006 , B23K26/364 , B23K26/40 , B23K2203/172 , B23K2203/30 , B23K2203/42 , B23K2203/50 , C03B33/0222 , H01S3/0057
摘要： Various embodiments of a system described herein relate to micromachining materials using ultrashort visible laser pulses. The ultrashort laser pulses may be green and have a wavelength between about 500 to 550 nanometers in some embodiments. Additionally, the pulses may have a pulse duration of less than one picosecond in certain embodiments.
摘要翻译：本文所述的系统的各种实施例涉及使用超短可见激光脉冲的微加工材料。在一些实施例中，超短激光脉冲可以是绿色的并且具有在约500至550纳米之间的波长。另外，在某些实施例中，脉冲可以具有小于1皮秒的脉冲持续时间。

6. 发明申请

WO2005101592A3 FEMTOSECOND LASER PROCESSING SYSTEM WITH PROCESS PARAMETERS, CONTROLS AND FEEDBACK 审中-公开
标题翻译：具有过程参数，控制和反馈的FEMTOSECOND激光加工系统
公开(公告)号：WO2005101592A3
公开(公告)日：2005-11-17
申请号：PCT/US2005008622
申请日：2005-03-14
申请人： IMRA AMERICA INC , SHAH LAWRENCE , BOVATSEK JAMES M , ARAI ALAN Y , YAMAMOTO TADASHI , PATEL RAJESH S , HARTER DONALD J
发明人： SHAH LAWRENCE , BOVATSEK JAMES M , ARAI ALAN Y , YAMAMOTO TADASHI , PATEL RAJESH S , HARTER DONALD J
IPC分类号： G01J11/00 , H01S3/00 , H01S3/067 , H01S3/10 , H01S3/102 , H01S3/109 , H01S3/13 , H01S3/16 , H01S3/23
CPC分类号： H01S3/10038 , G01J11/00 , H01S3/0014 , H01S3/005 , H01S3/0057 , H01S3/0064 , H01S3/0078 , H01S3/06754 , H01S3/10023 , H01S3/10061 , H01S3/102 , H01S3/1024 , H01S3/108 , H01S3/109 , H01S3/1305 , H01S3/1618
摘要： A femtosecond laser based laser processing system having a femtosecond laser, frequency conversion optics, beam manipulation optics, target motion control, processing chamber, diagnostic systems and system control modules. The femtosecond laser based laser processing system allows for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities.
摘要翻译：飞秒激光激光处理系统，具有飞秒激光，变频光学，光束操纵光学，目标运动控制，处理室，诊断系统和系统控制模块。基于飞秒激光的激光处理系统允许利用微加工中的独特热控制，并且该系统具有更大的输出光束稳定性，连续可变的重复率和独特的时间光束整形能力。

7. 发明申请

WO2011079006A1 LASER PATTERNING USING A STRUCTURED OPTICAL ELEMENT AND FOCUSED BEAM 审中-公开
标题翻译：使用结构化光学元件和聚焦光束的激光图案
公开(公告)号：WO2011079006A1
公开(公告)日：2011-06-30
申请号：PCT/US2010/060670
申请日：2010-12-16
申请人： IMRA AMERICA, INC. , ARAI, Alan Y. , YOSHINO, Fumiyo
发明人： ARAI, Alan Y. , YOSHINO, Fumiyo
IPC分类号： G01B11/00
CPC分类号： B23K26/066 , B23K26/082
摘要： Various embodiments provide for laser patterning using a structured optical element and a focused beam. In some embodiments a structured optical element may be integrally formed on a single substrate. In some embodiments, multiple optical components may be combined in an optical path to provide a desired pattern. In at least one embodiment, a projection mask is utilized to control exposure of an object to a laser output, in combination with the controlled motion of the projection mask, the controlled motion of the object and the controlled motion of the laser beam. In some embodiments, a projection mask is utilized to control exposure of an object, and the projection mask may absorb, scatter, reflect, or attenuate a laser output. In some embodiments, the projection mask may include optical elements that vary the optical power and polarization of the transmitted laser beam over regions of the projection mask.
摘要翻译：各种实施例提供使用结构化光学元件和聚焦光束的激光图案化。在一些实施例中，结构化光学元件可以一体地形成在单个基板上。在一些实施例中，多个光学部件可以组合在光路中以提供期望的图案。在至少一个实施例中，投影掩模用于控制物体对激光输出的曝光，结合投影掩模的受控运动，物体的受控运动和激光束的受控运动。在一些实施例中，使用投影掩模来控制物体的曝光，并且投影掩模可以吸收，散射，反射或衰减激光输出。在一些实施例中，投影掩模可以包括在投影掩模的区域上改变透射的激光束的光学功率和偏振的光学元件。

8. 发明申请

WO2009114375A3 TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER 审中-公开
公开(公告)号：WO2009114375A3
公开(公告)日：2009-09-17
申请号：PCT/US2009/036126
申请日：2009-03-05
申请人： IMRA AMERICA, INC. , ARAI, Alan, Y. , CHO, Gyu, C. , XU, Jingzhou , YOSHINO, Fumiyo , ZHANG, Haibin , BOVATSEK, James
发明人： ARAI, Alan, Y. , CHO, Gyu, C. , XU, Jingzhou , YOSHINO, Fumiyo , ZHANG, Haibin , BOVATSEK, James
IPC分类号： B23K26/00
摘要： Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are disclosed, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination. Reflective marks may also be formed with control of laser parameters. A transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. In some embodiments of transparent material processing, a multifocus beam generator simultaneously forms multiple beam waists spaced depthwise relative to the transparent material, thereby increasing processing speed.

9. 发明申请

WO2009114375A2 TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER 审中-公开
标题翻译：具有ULTRASH脉冲激光的透明材料加工
公开(公告)号：WO2009114375A2
公开(公告)日：2009-09-17
申请号：PCT/US2009036126
申请日：2009-03-05
申请人： IMRA AMERICA INC , ARAI ALAN Y , CHO GYU C , XU JINGZHOU , YOSHINO FUMIYO , ZHANG HAIBIN , BOVATSEK JAMES
发明人： ARAI ALAN Y , CHO GYU C , XU JINGZHOU , YOSHINO FUMIYO , ZHANG HAIBIN , BOVATSEK JAMES
IPC分类号： H01L21/027
CPC分类号： B23K26/0624 , B23K26/0057 , B23K26/006 , B23K26/0087 , B23K26/0676 , B23K26/083 , B23K26/0869 , B23K26/21 , B23K26/324 , B23K26/359 , B23K26/364 , B23K26/40 , B23K26/402 , B23K26/53 , B23K26/55 , B23K2203/50 , B23K2203/54 , B28D5/00 , B28D5/0011 , B29C65/1606 , B29C65/1612 , B29C65/1619 , B29C65/1629 , B29C65/1635 , B29C65/1638 , B29C65/1654 , B29C65/1658 , B29C65/1687 , B29C65/38 , B29C66/1122 , B29C66/43 , B29C66/71 , B29C66/73161 , B29C66/73366 , B29C66/73921 , B29C66/836 , B29C66/952 , B29K2995/0026 , B41M5/26 , B41M5/262 , B41M5/267 , C03B23/006 , C03B33/102 , C03C23/0025 , H01L21/268 , H01L21/78 , B29K2069/00
摘要： Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are disclosed, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination. Reflective marks may also be formed with control of laser parameters. A transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. In some embodiments of transparent material processing, a multifocus beam generator simultaneously forms multiple beam waists spaced depthwise relative to the transparent material, thereby increasing processing speed.
摘要翻译：公开了用于光学透明材料的超短脉冲激光加工的方法，装置和系统，例如在划线，标记，焊接和接合中的应用。例如，超短激光脉冲通过激光束穿过材料产生一次划线特征，其中至少一个划线特征形成在材料表面下方。稍微修改超短脉冲激光加工条件会产生次表面痕迹。正确布置时，这些标记在正确对齐的照明下清晰可见。还可以通过激光参数的控制来形成反射标记。可以使用玻璃以外的透明材料。用于焊接透明材料的方法使用超短激光脉冲通过局部加热产生粘结。在透明材料处理的一些实施例中，多焦点光束发生器同时形成相对于透明材料沿深度方向间隔开的多个光束束，从而提高处理速度。

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