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1. 发明授权

US6033135A Development system for manufacturing semiconductor devices, including a container equipped with cleaning and ventillation apparatus, and controlling method thereof 有权
标题翻译：用于制造半导体器件的开发系统，包括具有清洁和排气装置的容器及其控制方法
公开(公告)号：US6033135A
公开(公告)日：2000-03-07
申请号：US206232
申请日：1998-12-07
申请人： Woung-kwan An , Dong-ho Kim
发明人： Woung-kwan An , Dong-ho Kim
IPC分类号： H01L21/027 , G03F7/30 , H01L21/00 , G03D5/00
CPC分类号： H01L21/67028 , G03F7/30 , Y10S134/902
摘要： A development system for manufacturing semiconductor devices uses a container to easily remove by-products of development from a wafer by: soaking the wafer in the developer with the pattern face downward; spraying rinse onto the pattern face from below; rotating the wafer at high speed to remove the rinse and by-products; and then cleaning and ventilating the container so that the developer, rinse, cleaning solution and development by-products are removed from the container. No by-products are left in the comers of the pattern of the pattern face, because the development and rinse are performed with the pattern facing downward. No by-products, developer, rinse or cleaning solution contaminate the wafer, because steps of the process are performed in an enclosed container which is cleaned and ventilated between development of each wafer.
摘要翻译：用于制造半导体器件的开发系统使用容器通过以下方式容易地从晶片去除显影的副产物：将晶片浸入显影剂中，图案面朝下; 从下面喷洒到图案面上; 高速旋转晶片以除去漂洗和副产物; 然后对容器进行清洁和通风，使得显影剂，漂洗，清洁溶液和显影副产物从容器中除去。由于在图案面向下的图案中进行显影和冲洗，因此不会在图案面的图案的角落中产生副产物。没有副产品，显影剂，漂洗或清洁溶液会污染晶片，因为该过程的步骤在封闭的容器中进行，该容器在每个晶片的显影之间被清洁和通风。

2. 发明授权

US5930549A Developing device for semiconductor device fabrication and its controlling method 失效
标题翻译：半导体器件制造开发装置及其控制方法
公开(公告)号：US5930549A
公开(公告)日：1999-07-27
申请号：US969578
申请日：1997-11-13
申请人： Dong-ho Kim , Woung-kwan An , Je-eung Park , Byung-kwan Lee
发明人： Dong-ho Kim , Woung-kwan An , Je-eung Park , Byung-kwan Lee
IPC分类号： G03F7/30 , H01L21/027 , G03D5/00
CPC分类号： G03F7/3021
摘要： A developing device for a semiconductor device fabrication accomplishes complete removal of by-products formed during development of a photoresist, by inverting the wafer over a container of developer and dipping the pattern-forming face into the developer. While the wafer is still inverted over the container, the pattern-forming face is sprayed with a rinse and the wafer is spun to remove the rinse and by-products. The device includes the container provided on a table and supplied with developer, a spin chuck using vacuum suctioning the face of the wafer opposite to the pattern-forming face, a driving motor for rotating the spin chuck, a vertical driver for moving the wafer into and out of the container, and an inverting driver for rotating the spin chuck and the vertical driver so as to selectively turn the pattern-forming face of the wafer to look upward or downward.
摘要翻译：用于半导体器件制造的显影装置通过在显影剂容器上翻转晶片并将图案形成面浸入显影剂中来完成去除在光致抗蚀剂显影期间形成的副产物。当晶片仍然在容器上翻转时，用冲洗液喷射图案形成面，并且旋转晶片以除去漂洗和副产物。该装置包括设置在工作台上并提供有显影剂的容器，使用真空吸附与图案形成面相对的晶片表面的旋转卡盘，用于旋转旋转卡盘的驱动电机，用于将晶片移动的垂直驱动器并且离开容器，以及用于旋转旋转卡盘和垂直驱动器的反相驱动器，以便选择性地转动晶片的图案形成面以向上或向下看。

3. 发明授权

US5472554A Apparatus for adhering masking film 失效
标题翻译：用于粘附掩膜的设备
公开(公告)号：US5472554A
公开(公告)日：1995-12-05
申请号：US212896
申请日：1994-03-15
申请人： Kyoun-hee Ko , Il-ho Kim , Chul-hee Kim , Woung-Kwan An
发明人： Kyoun-hee Ko , Il-ho Kim , Chul-hee Kim , Woung-Kwan An
IPC分类号： H01L21/677 , B65H35/00 , B65H37/04 , H01L21/00 , H01L21/301 , H01L21/304 , H01L21/308 , B32B35/00 , B32B31/10 , B32B31/18
CPC分类号： H01L21/67132 , B65H35/0013 , B65H37/04 , H01L21/6836 , H01L2221/68327 , Y10T156/1052 , Y10T156/108 , Y10T156/12 , Y10T156/1343 , Y10T156/1712 , Y10T156/1734 , Y10T156/1741
摘要： A masking film adhering method and apparatus for transporting smoothly and accurately a masking film tape to which a wafer is stuck to the cutting location where the masking film is to be cut. The wafer is stuck onto the masking film tape by passing the masking film tape and the wafer through upper and lower adhesive rollers. The separation of the masking film tape is then increased from a cutting table so that the masking film tape having the wafer stuck thereon may not become adhered to the cutting table, by moving the upper adhesive roller upwardly when the wafer completely passes through the adhesive roller. After the masking film is transported to a cutting location, maintaining a predetermined distance between the masking film and the cutting table, the masking film tape is cut along the shape of the wafer. Sagging of the masking film due to the weight of the wafer is prevented to avoid the masking film tape adhesion to the cutting table. The wafer can be accurately placed onto the cutting location of the masking film tape, to prevent the wafer from being damaged by the cutter.
摘要翻译：一种用于平滑地和准确地传送掩模胶带的掩模膜粘附方法和装置，其中晶片粘附到掩模膜被切割的切割位置。通过使掩蔽胶片带和晶片通过上下粘合辊将晶片粘贴到掩膜胶带上。然后，从切割台上分离掩模胶片带，使得具有粘贴在其上的晶片的掩模胶片带可能通过在晶片完全通过粘合辊时向上移动上粘合辊而不会附着到切割台上。在将掩模膜输送到切割位置之后，保持掩模膜和切割台之间的预定距离，沿着晶片的形状切割掩模胶片带。防止由于晶片的重量而导致的掩模膜的凹陷，避免了掩模膜带与切割台的粘合。可以将晶片准确地放置在掩模胶片带的切割位置上，以防止晶片被切割器损坏。

4. 发明授权

US5899690A Thermal processing apparatus for semiconductor wafer 失效
标题翻译：半导体晶圆热处理装置
公开(公告)号：US5899690A
公开(公告)日：1999-05-04
申请号：US923465
申请日：1997-09-04
申请人： Ki-hum Nam , Byung-kwan Lee , Dong-ho Kim , Woung-kwan An
发明人： Ki-hum Nam , Byung-kwan Lee , Dong-ho Kim , Woung-kwan An
IPC分类号： H01L21/66 , H01L21/02 , H01L21/22 , H01L21/324 , H01L21/677 , F27D3/12
CPC分类号： H01L21/67781
摘要： An apparatus for thermal processing of semiconductor wafers includes a table having in lateral sequence a heating chamber, a holding chamber, and a cassette stage and a boat for holding the wafers being processed. The apparatus further includes a boat transfer part for moving the boat between the holding chamber and the heating chamber, a wafer charging part for transferring the wafers loaded in a cassette on the cassette stage to the boat while it is in the holding chamber, and a wafer discharging part for transferring the wafers loaded in the boat back to the cassette on the cassette stage.
摘要翻译：一种用于半导体晶片的热处理的装置，包括一个具有加热室，一个保持室以及一个盒台的横向顺序的工作台以及用于保持被处理的晶片的舟皿。所述装置还包括用于在所述保持室和所述加热室之间移动所述船的船用传送部件，用于将装载在所述盒台上的盒中的所述晶片转移到所述容器的所述容纳室中的晶片充电部，以及用于将装载在舟皿中的晶片转移回盒式磁带上的盒的晶片排出部分。

5. 发明授权

US5872365A UV irradiation apparatus 失效
标题翻译：紫外线照射装置
公开(公告)号：US5872365A
公开(公告)日：1999-02-16
申请号：US679084
申请日：1996-07-12
申请人： Kyoon-hee Goh , Chul-hui Kim , Byung-kwan Lee , Seung-ug Kim , In-hyub Park , Young-chul Jeong , Woung-kwan An , Dong-ho Kim , Hun Cha , Choung-hyep Kim , Guk-hyeong Cho
发明人： Kyoon-hee Goh , Chul-hui Kim , Byung-kwan Lee , Seung-ug Kim , In-hyub Park , Young-chul Jeong , Woung-kwan An , Dong-ho Kim , Hun Cha , Choung-hyep Kim , Guk-hyeong Cho
IPC分类号： B29C71/04 , G03F7/20 , H01L21/00 , H01L21/304 , H01L21/683 , G01J1/00
CPC分类号： H01L21/6838 , G03F7/70691 , H01L21/67115
摘要： A UV irradiation apparatus, which includes a UV lamp installed in a chamber for generating UV rays; a vacuum chuck installed below the UV lamp for supporting and moving a wafer; and, a reflector surrounding the UV lamp for concentrating UV rays on the vacuum chuck. The apparatus further includes heating blocks for controlling the temperature at both sides of the vacuum chuck. Thus, it is possible to maintain an essentially constant temperature around the wafer supported by the vacuum chuck. As a result of the temperature control, when a protection tape attached to the front side of the wafer is irradiated with UV rays, an adhesive of the protective tape can be effectively degraded by a chemically reaction under optimum conditions, to thereby easily detach the protection tape from the wafer.
摘要翻译：一种UV照射装置，其包括安装在用于产生紫外线的室中的UV灯; 安装在UV灯下方的用于支撑和移动晶片的真空卡盘; 以及围绕UV灯的反射器，用于将UV射线聚集在真空吸盘上。该装置还包括用于控制真空吸盘两侧的温度的加热块。因此，可以在由真空卡盘支撑的晶片周围保持基本上恒定的温度。作为温度控制的结果，当用紫外线照射附着在晶片正面的保护带时，在最佳条件下可以通过化学反应有效地降低保护带的粘合剂，从而容易地分离保护胶带从晶圆。

6. 发明授权

US5688354A Method for adhering masking film 失效
标题翻译：粘附掩膜的方法
公开(公告)号：US5688354A
公开(公告)日：1997-11-18
申请号：US445857
申请日：1995-05-22
申请人： Kyoun-hee Ko , Il-ho Kim , Chul-hee Kim , Woung-kwan An
发明人： Kyoun-hee Ko , Il-ho Kim , Chul-hee Kim , Woung-kwan An
IPC分类号： H01L21/677 , B65H35/00 , B65H37/04 , H01L21/00 , H01L21/301 , H01L21/304 , H01L21/308 , B32B31/18
CPC分类号： H01L21/67132 , B65H35/0013 , B65H37/04 , H01L21/6836 , H01L2221/68327 , Y10T156/1052 , Y10T156/108 , Y10T156/12 , Y10T156/1343 , Y10T156/1712 , Y10T156/1734 , Y10T156/1741
摘要： A masking film adhering method for transporting smoothly and accurately a masking film tape to which a wafer is stuck to the cutting location where the masking film is to be cut. The wafer is stuck onto the masking film tape by passing the masking film tape and the wafer through upper and lower adhesive rollers. The separation of the masking film tape is then increased from a cutting table so that the masking film tape having the wafer stuck thereon may not become adhered to the cutting table, by moving the upper adhesive roller upwardly when the wafer completely passes through the adhesive roller. After the masking film is transported to a cutting location, maintaining a predetermined distance between the masking film and the cutting table, the masking film tape is cut along the shape of the wafer. Sagging of the masking film due to the weight of the wafer is prevented to avoid the masking film tape adhesion to the cutting table. The wafer can be accurately placed onto the cutting location of the masking film tape, to prevent the wafer from being damaged by the cutter.
摘要翻译：一种用于平滑且精确地输送将晶片粘附到掩模膜被切割的切割位置的掩模膜带的掩模膜粘附方法。通过使掩蔽胶片带和晶片通过上下粘合辊将晶片粘贴到掩膜胶带上。然后，从切割台上分离掩模胶片带，使得具有粘贴在其上的晶片的掩模胶片带可能通过在晶片完全通过粘合辊时向上移动上粘合辊而不会附着到切割台上。在将掩模膜输送到切割位置之后，保持掩模膜和切割台之间的预定距离，沿着晶片的形状切割掩模胶片带。防止由于晶片的重量而导致的掩模膜的凹陷，避免了掩模膜带与切割台的粘合。可以将晶片准确地放置在掩模胶片带的切割位置上，以防止晶片被切割器损坏。

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