专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06746972B1 Apparatus for and method of heat-treating a wafer 失效
公开(公告)号：US06746972B1
公开(公告)日：2004-06-08
申请号：US09605660
申请日：2000-06-28
申请人： Choung Hyep Kim , Sung Il Jang , Kyung Seo Park , Ki Hyon Chyun , Hee Sun Chab
发明人： Choung Hyep Kim , Sung Il Jang , Kyung Seo Park , Ki Hyon Chyun , Hee Sun Chab
IPC分类号： H01L2126
CPC分类号： H01L21/67109 , Y10S414/135
摘要： An apparatus for and a method of heat-treating a wafer for use in producing a semiconductor device ensures a desired distribution of surface temperatures across the wafer. Spacers are used to space the wafer above a heat transfer plate. The spacers can be used to adjust the spacing and inclination of the wafer relative to the heat transfer plate by predetermined amounts determined in advance to produce the desired distribution of surface temperatures across the wafer during heat-treatment. With the present invention, wafers can be heat-treated during production using a plurality of bake units disposed in parallel because each of the bake units can be precisely adjusted using the spacers to produce surface temperature distributions similar to a standard surface temperature distribution. Accordingly, the productivity of the semiconductor manufacturing process can be markedly enhanced.

2. 发明授权

US5874128A Method and apparatus for uniformly spin-coating a photoresist material 失效
标题翻译：用于均匀旋涂光致抗蚀剂材料的方法和设备
公开(公告)号：US5874128A
公开(公告)日：1999-02-23
申请号：US885793
申请日：1997-06-30
申请人： Choung-hyep Kim
发明人： Choung-hyep Kim
IPC分类号： H01L21/027 , B05C11/08 , G03F7/16 , B05D3/12 , B05C11/02
CPC分类号： G03F7/162 , B05C11/08
摘要： A method and apparatus for uniformly spin-coating photoresist material on wafers before the wafers are subjected to a photoetching process. The spin-coating apparatus comprises a first rotating device for rotating a rotating connector about a first axis and a second rotating device located on the outer portion of the rotating connector. The second rotating device rotates a wafer about a second axis while the rotating connector rotates around the first axis. The first and second axes are parallel to each other but are spaced apart by a designated distance. The designated distance can be adjusted and a plurality of second rotating devices may be connected to outer portions of the rotating connector.
摘要翻译：在对晶片进行光刻处理之前，在晶片上均匀地旋涂光致抗蚀剂材料的方法和装置。旋转涂布装置包括用于围绕第一轴线旋转旋转连接器的第一旋转装置和位于旋转连接器的外部部分上的第二旋转装置。第二旋转装置围绕第二轴旋转晶片，同时旋转连接器围绕第一轴线旋转。第一和第二轴彼此平行，但间隔开指定的距离。可以调整指定距离，并且多个第二旋转装置可以连接到旋转连接器的外部部分。

3. 发明授权

US5872365A UV irradiation apparatus 失效
标题翻译：紫外线照射装置
公开(公告)号：US5872365A
公开(公告)日：1999-02-16
申请号：US679084
申请日：1996-07-12
申请人： Kyoon-hee Goh , Chul-hui Kim , Byung-kwan Lee , Seung-ug Kim , In-hyub Park , Young-chul Jeong , Woung-kwan An , Dong-ho Kim , Hun Cha , Choung-hyep Kim , Guk-hyeong Cho
发明人： Kyoon-hee Goh , Chul-hui Kim , Byung-kwan Lee , Seung-ug Kim , In-hyub Park , Young-chul Jeong , Woung-kwan An , Dong-ho Kim , Hun Cha , Choung-hyep Kim , Guk-hyeong Cho
IPC分类号： B29C71/04 , G03F7/20 , H01L21/00 , H01L21/304 , H01L21/683 , G01J1/00
CPC分类号： H01L21/6838 , G03F7/70691 , H01L21/67115
摘要： A UV irradiation apparatus, which includes a UV lamp installed in a chamber for generating UV rays; a vacuum chuck installed below the UV lamp for supporting and moving a wafer; and, a reflector surrounding the UV lamp for concentrating UV rays on the vacuum chuck. The apparatus further includes heating blocks for controlling the temperature at both sides of the vacuum chuck. Thus, it is possible to maintain an essentially constant temperature around the wafer supported by the vacuum chuck. As a result of the temperature control, when a protection tape attached to the front side of the wafer is irradiated with UV rays, an adhesive of the protective tape can be effectively degraded by a chemically reaction under optimum conditions, to thereby easily detach the protection tape from the wafer.
摘要翻译：一种UV照射装置，其包括安装在用于产生紫外线的室中的UV灯; 安装在UV灯下方的用于支撑和移动晶片的真空卡盘; 以及围绕UV灯的反射器，用于将UV射线聚集在真空吸盘上。该装置还包括用于控制真空吸盘两侧的温度的加热块。因此，可以在由真空卡盘支撑的晶片周围保持基本上恒定的温度。作为温度控制的结果，当用紫外线照射附着在晶片正面的保护带时，在最佳条件下可以通过化学反应有效地降低保护带的粘合剂，从而容易地分离保护胶带从晶圆。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式