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1. 发明授权

US5688354A Method for adhering masking film 失效
标题翻译：粘附掩膜的方法
公开(公告)号：US5688354A
公开(公告)日：1997-11-18
申请号：US445857
申请日：1995-05-22
申请人： Kyoun-hee Ko , Il-ho Kim , Chul-hee Kim , Woung-kwan An
发明人： Kyoun-hee Ko , Il-ho Kim , Chul-hee Kim , Woung-kwan An
IPC分类号： H01L21/677 , B65H35/00 , B65H37/04 , H01L21/00 , H01L21/301 , H01L21/304 , H01L21/308 , B32B31/18
CPC分类号： H01L21/67132 , B65H35/0013 , B65H37/04 , H01L21/6836 , H01L2221/68327 , Y10T156/1052 , Y10T156/108 , Y10T156/12 , Y10T156/1343 , Y10T156/1712 , Y10T156/1734 , Y10T156/1741
摘要： A masking film adhering method for transporting smoothly and accurately a masking film tape to which a wafer is stuck to the cutting location where the masking film is to be cut. The wafer is stuck onto the masking film tape by passing the masking film tape and the wafer through upper and lower adhesive rollers. The separation of the masking film tape is then increased from a cutting table so that the masking film tape having the wafer stuck thereon may not become adhered to the cutting table, by moving the upper adhesive roller upwardly when the wafer completely passes through the adhesive roller. After the masking film is transported to a cutting location, maintaining a predetermined distance between the masking film and the cutting table, the masking film tape is cut along the shape of the wafer. Sagging of the masking film due to the weight of the wafer is prevented to avoid the masking film tape adhesion to the cutting table. The wafer can be accurately placed onto the cutting location of the masking film tape, to prevent the wafer from being damaged by the cutter.
摘要翻译：一种用于平滑且精确地输送将晶片粘附到掩模膜被切割的切割位置的掩模膜带的掩模膜粘附方法。通过使掩蔽胶片带和晶片通过上下粘合辊将晶片粘贴到掩膜胶带上。然后，从切割台上分离掩模胶片带，使得具有粘贴在其上的晶片的掩模胶片带可能通过在晶片完全通过粘合辊时向上移动上粘合辊而不会附着到切割台上。在将掩模膜输送到切割位置之后，保持掩模膜和切割台之间的预定距离，沿着晶片的形状切割掩模胶片带。防止由于晶片的重量而导致的掩模膜的凹陷，避免了掩模膜带与切割台的粘合。可以将晶片准确地放置在掩模胶片带的切割位置上，以防止晶片被切割器损坏。

2. 发明授权

US5472554A Apparatus for adhering masking film 失效
标题翻译：用于粘附掩膜的设备
公开(公告)号：US5472554A
公开(公告)日：1995-12-05
申请号：US212896
申请日：1994-03-15
申请人： Kyoun-hee Ko , Il-ho Kim , Chul-hee Kim , Woung-Kwan An
发明人： Kyoun-hee Ko , Il-ho Kim , Chul-hee Kim , Woung-Kwan An
IPC分类号： H01L21/677 , B65H35/00 , B65H37/04 , H01L21/00 , H01L21/301 , H01L21/304 , H01L21/308 , B32B35/00 , B32B31/10 , B32B31/18
CPC分类号： H01L21/67132 , B65H35/0013 , B65H37/04 , H01L21/6836 , H01L2221/68327 , Y10T156/1052 , Y10T156/108 , Y10T156/12 , Y10T156/1343 , Y10T156/1712 , Y10T156/1734 , Y10T156/1741
摘要： A masking film adhering method and apparatus for transporting smoothly and accurately a masking film tape to which a wafer is stuck to the cutting location where the masking film is to be cut. The wafer is stuck onto the masking film tape by passing the masking film tape and the wafer through upper and lower adhesive rollers. The separation of the masking film tape is then increased from a cutting table so that the masking film tape having the wafer stuck thereon may not become adhered to the cutting table, by moving the upper adhesive roller upwardly when the wafer completely passes through the adhesive roller. After the masking film is transported to a cutting location, maintaining a predetermined distance between the masking film and the cutting table, the masking film tape is cut along the shape of the wafer. Sagging of the masking film due to the weight of the wafer is prevented to avoid the masking film tape adhesion to the cutting table. The wafer can be accurately placed onto the cutting location of the masking film tape, to prevent the wafer from being damaged by the cutter.
摘要翻译：一种用于平滑地和准确地传送掩模胶带的掩模膜粘附方法和装置，其中晶片粘附到掩模膜被切割的切割位置。通过使掩蔽胶片带和晶片通过上下粘合辊将晶片粘贴到掩膜胶带上。然后，从切割台上分离掩模胶片带，使得具有粘贴在其上的晶片的掩模胶片带可能通过在晶片完全通过粘合辊时向上移动上粘合辊而不会附着到切割台上。在将掩模膜输送到切割位置之后，保持掩模膜和切割台之间的预定距离，沿着晶片的形状切割掩模胶片带。防止由于晶片的重量而导致的掩模膜的凹陷，避免了掩模膜带与切割台的粘合。可以将晶片准确地放置在掩模胶片带的切割位置上，以防止晶片被切割器损坏。

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