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    • 2. 发明授权
    • Scalable two transistor memory device
    • 可扩展的两个晶体管存储器件
    • US06710465B2
    • 2004-03-23
    • US10345161
    • 2003-01-16
    • Seungheon SongWoosik KimHokyu Kang
    • Seungheon SongWoosik KimHokyu Kang
    • H01L2711
    • G11C16/0433H01L27/115H01L27/11521H01L29/788Y10S257/904
    • A Scalable Two-Transistor Memory (STTM) cell array having a 4F2 unit cell area, where F is the minimum feature size. The data lines and the bit lines alternate and are adjacent to each other along the Y-axis direction, and the word lines are laid out along the X-axis direction. Each STTM cell consists of a floating gate MOS sensing transistor at the surface of a semiconductor substrate, with a vertical double sidewall gate multiple tunnel junction barrier programming MOS transistor on top of the sensing transistor. A data line connects all source regions of the programming transistors and a bit line connects all the source/drain regions of the sensing transistors in a column direction. A word line connects all double sidewall gate regions of programming transistors in a row direction. This invention also deals with a column addressing circuit as well as the driving method for the circuit.
    • 具有4F 2单位单元面积的可扩展双晶体管存储器(STTM)单元阵列,其中F是最小特征尺寸。 数据线和位线沿着Y轴方向交替并彼此相邻,并且字线沿着X轴方向布置。 每个STTM单元由在半导体衬底的表面处的浮置栅极MOS感测晶体管组成,在感测晶体管顶部具有垂直双侧壁栅极多隧道结屏障编程MOS晶体管。 数据线连接编程晶体管的所有源极区域,并且位线沿列方向连接感测晶体管的所有源极/漏极区域。 字线将编程晶体管的所有双侧壁栅极区域沿行方向连接。 本发明还涉及列寻址电路以及该电路的驱动方法。
    • 4. 发明授权
    • Method of making a scalable two transistor memory device
    • 制造可伸缩双晶体管存储器件的方法
    • US06475857B1
    • 2002-11-05
    • US09884912
    • 2001-06-21
    • Woosik KimSeungheon SongHokyu Kang
    • Woosik KimSeungheon SongHokyu Kang
    • H01L2100
    • H01L27/11526H01L27/105H01L27/115H01L27/11521H01L27/11546
    • A method of fabricating a multiple tunnel junction Scalable Two-Transistor Memory (STTM) cell array with a unit cell area as low as 4F2, F representing the minimum feature dimension, which usually is the width and also the spacing of the data lines or the write (or word or control gate) lines, wherein process sequence and conditions are designed to offer wide flexibility in material choices and layer thickness at different regions of the STTM cell with surface planarity maintained at several stages of the manufacturing sequence. The processing of memory cell devices is made compatible with peripheral CMOS devices so that the devices in both areas can be made simultaneously, thereby decreasing the total number of processing steps. Insulator filled trenches around the device regions, source/drain and the gate regions of the peripheral devices are formed simultaneously with the corresponding regions of the memory cell devices.
    • 一种制造具有低至4F2的单元单元面积的多隧道结可伸缩双晶体管存储器(STTM)单元阵列的方法,F表示最小特征尺寸,其通常是数据线的宽度和间距 写(或字或控制门)线,其中工艺顺序和条件被设计为在STTM单元的不同区域处提供在材料选择和层厚度方面的广泛的灵活性,并且在制造顺序的几个阶段保持表面平面度。 存储单元设备的处理与外围CMOS器件兼容,使得两个区域中的器件可以同时进行,从而减少处理步骤的总数。 绝缘体在器件区域周围填充沟槽,外围器件的源极/漏极和栅极区域与存储器单元器件的相应区域同时形成。
    • 6. 发明申请
    • Method of forming dual interconnects in manufacturing MRAM cells
    • 在制造MRAM单元中形成双互连的方法
    • US20070123023A1
    • 2007-05-31
    • US11289787
    • 2005-11-30
    • Woosik KimChanro Park
    • Woosik KimChanro Park
    • H01L21/4763
    • H01L43/12
    • A method of forming dual interconnects in a magnetoresistive memory cell includes: providing an intermediate product including: a metallization layer including metallic lines; a magnetoresistive junction element conductively connected to a first of the metallic lines by a via through a first non-conductive layer; a metallic hard mask disposed on the magnetoresistive junction element; a second non-conductive layer above the first non-conductive layer in regions over the hard mask and a second of the metallic lines; a third non-conductive layer disposed above the hard mask; and a fourth non-conductive layer disposed on the third non-conductive layer. The method further includes partially opening first and second trenches to uncover the second non-conductive layer above the hard mask and second metallic line, respectively; fully opening the first and second trenches to uncover the hard mask and second metallic line, respectively; and filling the first and second trenches with conductive material.
    • 在磁阻存储单元中形成双互连的方法包括:提供中间产品,包括:包括金属线的金属化层; 通过第一非导电层导电地连接到第一金属线的磁阻结点; 设置在磁阻接合元件上的金属硬掩模; 在所述硬掩模上的区域中的所述第一非导电层上方的第二非导电层和所述金属线中的第二非导电层; 设置在硬掩模上方的第三非导电层; 以及设置在所述第三非导电层上的第四非导电层。 该方法还包括部分地打开第一和第二沟槽以分别露出硬掩模和第二金属线上方的第二非导电层; 分别完全打开第一和第二沟槽以揭开硬掩模和第二金属线; 以及用导电材料填充第一和第二沟槽。
    • 8. 发明授权
    • Scalable two transistor memory device
    • 可扩展的两个晶体管存储器件
    • US06528896B2
    • 2003-03-04
    • US09884911
    • 2001-06-21
    • Seungheon SongWoosik KimHokyu Kang
    • Seungheon SongWoosik KimHokyu Kang
    • H01L2711
    • G11C16/0433H01L27/115H01L27/11521H01L29/788Y10S257/904
    • A Scalable Two-Transistor Memory (STTM) cell array having a 4F2 unit cell area, where F is the minimum feature size. The data lines and the bit lines alternate and are adjacent to each other along the Y-axis direction, and the word lines are laid out along the X-axis direction. Each STTM cell consists of a floating gate MOS sensing transistor at the surface of a semiconductor substrate, with a vertical double sidewall gate multiple tunnel junction barrier programming MOS transistor on top of the sensing transistor. A data line connects all source regions of the programming transistors and a bit line connects all the source/drain regions of the sensing transistors in a column direction. A word line connects all double sidewall gate regions of programming transistors in a row direction. This invention also deals with a column addressing circuit as well as the driving method for the circuit.
    • 具有4F2单位区域的可扩展双晶体管存储器(STTM)单元阵列,其中F是最小特征尺寸。 数据线和位线沿着Y轴方向交替并彼此相邻,并且字线沿着X轴方向布置。 每个STTM单元由在半导体衬底的表面处的浮置栅极MOS感测晶体管组成,在感测晶体管顶部具有垂直双侧壁栅极多隧道结屏障编程MOS晶体管。 数据线连接编程晶体管的所有源极区域,并且位线沿列方向连接感测晶体管的所有源极/漏极区域。 字线将编程晶体管的所有双侧壁栅极区域沿行方向连接。 本发明还涉及列寻址电路以及该电路的驱动方法。
    • 9. 发明授权
    • Method of forming dual interconnects in manufacturing MRAM cells
    • 在制造MRAM单元中形成双互连的方法
    • US07381574B2
    • 2008-06-03
    • US11289787
    • 2005-11-30
    • Woosik KimChanro Park
    • Woosik KimChanro Park
    • H01L21/00
    • H01L43/12
    • A method of forming dual interconnects in a magnetoresistive memory cell includes: providing an intermediate product including: a metallization layer including metallic lines; a magnetoresistive junction element conductively connected to a first of the metallic lines by a via through a first non-conductive layer; a metallic hard mask disposed on the magnetoresistive junction element; a second non-conductive layer above the first non-conductive layer in regions over the hard mask and a second of the metallic lines; a third non-conductive layer disposed above the hard mask; and a fourth non-conductive layer disposed on the third non-conductive layer. The method further includes partially opening first and second trenches to uncover the second non-conductive layer above the hard mask and second metallic line, respectively; fully opening the first and second trenches to uncover the hard mask and second metallic line, respectively; and filling the first and second trenches with conductive material.
    • 在磁阻存储单元中形成双互连的方法包括:提供中间产品,包括:包括金属线的金属化层; 通过第一非导电层导电地连接到第一金属线的磁阻结点; 设置在磁阻接合元件上的金属硬掩模; 在所述硬掩模上的区域中的所述第一非导电层上方的第二非导电层和所述金属线中的第二非导电层; 设置在硬掩模上方的第三非导电层; 以及设置在所述第三非导电层上的第四非导电层。 该方法还包括部分地打开第一和第二沟槽以分别露出硬掩模和第二金属线上方的第二非导电层; 分别完全打开第一和第二沟槽以揭开硬掩模和第二金属线; 以及用导电材料填充第一和第二沟槽。