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1. 发明授权

US07088926B2 Electro-optical connector module 失效
标题翻译：电光连接器模块
公开(公告)号：US07088926B2
公开(公告)日：2006-08-08
申请号：US09777315
申请日：2001-02-05
申请人： Albertus Van Zanten , Winnie Heyvaert
发明人： Albertus Van Zanten , Winnie Heyvaert
IPC分类号： H04B10/00
CPC分类号： G02B6/4277 , G02B6/4246 , G02B6/4249 , G02B6/4292 , H05K1/189
摘要： The invention pertains to an electro-optical connector module comprising a connection part, at least one optical transmitter circuit and/or optical receiver circuit and at least one electro-optical converter for respectively converting electrical signals into optical signals or vice versa. The module further comprises at least two substantially flat and substantially parallel electrically insulating sheets on which the transmitter circuit and/or receiver circuit and the converter are mounted. It is preferred that the connector module according, comprises at least one optical transmitter circuit, at least one optical receiver circuit and at least two electro-optical converters for respectively converting electrical signals into optical signals and vice versa, wherein the optical transmitter circuit and a first converter are mounted on a first sheet and the optical receiver circuit and a second converter are mounted on a second sheet.
摘要翻译：本发明涉及一种电光连接器模块，其包括连接部分，至少一个光发射器电路和/或光接收器电路以及用于将电信号分别转换为光信号或反之亦然的至少一个电光转换器。模块还包括至少两个基本上平坦且基本上平行的电绝缘片，发射器电路和/或接收器电路和转换器在其上安装。优选地，所述连接器模块包括至少一个光发射器电路，至少一个光接收器电路和用于将电信号分别转换成光信号的反射镜和至少两个电光转换器，其中光发送器电路和第一转换器安装在第一片上，光接收器电路和第二转换器安装在第二片上。

2. 发明授权

US09190774B2 Contact pin, header connector and connector assembly 有权
标题翻译：接触销，插头连接器和连接器组件
公开(公告)号：US09190774B2
公开(公告)日：2015-11-17
申请号：US13994163
申请日：2011-12-15
申请人： Jeroen De Bruijn , Gert Droesbeke , Winnie Heyvaert , Ludwig Lange , Stefaan Hendrik Jozef Sercu
发明人： Jeroen De Bruijn , Gert Droesbeke , Winnie Heyvaert , Ludwig Lange , Stefaan Hendrik Jozef Sercu
IPC分类号： H01R13/04 , H01R13/627 , H01R13/6471 , H01R43/00 , H01R43/16
CPC分类号： H01R13/6278 , H01R13/04 , H01R13/6471 , H01R43/00 , H01R43/16 , Y10T29/49204
摘要： The invention relates to a contact pin having longitudinal surfaces bulged to define opposite contact lines extending in longitudinal direction of the contact pin, wherein in cross section of the contact pin the plane through the two opposite contact lines is offset from the cross sectional center of the contact pin.
摘要翻译：本发明涉及一种具有膨胀的纵向表面的接触销，以限定沿接触销的纵向方向延伸的相对的接触线，其中在接触销的横截面中，穿过两个相对的接触线的平面偏离了接触销的横截面中心接触针。

3. 发明申请

US20130344743A1 Contact Pin, Header Connector and Connector Assembly 有权
标题翻译：触针，头连接器和连接器组件
公开(公告)号：US20130344743A1
公开(公告)日：2013-12-26
申请号：US13994163
申请日：2011-12-15
申请人： Jeroen De Bruijn , Gert Droesbeke , Winnie Heyvaert , Ludwig Lange , Stefaan Hendrik Jozef Sercu
发明人： Jeroen De Bruijn , Gert Droesbeke , Winnie Heyvaert , Ludwig Lange , Stefaan Hendrik Jozef Sercu
IPC分类号： H01R13/627 , H01R43/00
CPC分类号： H01R13/6278 , H01R13/04 , H01R13/6471 , H01R43/00 , H01R43/16 , Y10T29/49204
摘要： The invention relates to a contact pin having longitudinal surfaces bulged to define opposite contact lines extending in longitudinal direction of the contact pin, wherein in cross section of the contact pin the plane through the two opposite contact lines is offset from the cross sectional centre of the contact pin.
摘要翻译：本发明涉及一种具有膨胀的纵向表面的接触销，以限定沿接触销的纵向方向延伸的相对的接触线，其中在接触销的横截面中，穿过两个相对的接触线的平面偏离了接触销的横截面中心接触针。

4. 发明申请

US20120135643A1 Low-Cross-Talk Electrical Connector 有权
标题翻译：低交叉电气连接器
公开(公告)号：US20120135643A1
公开(公告)日：2012-05-31
申请号：US13376027
申请日：2010-06-03
申请人： Ludwig Lange , Paul Potters , Winnie Heyvaert
发明人： Ludwig Lange , Paul Potters , Winnie Heyvaert
IPC分类号： H01R24/28
CPC分类号： H01R13/6471 , H01R13/6477 , H01R13/6586 , H01R13/6587
摘要： An electrical connector includes a first contact module and a second contact module adjacent the first contact module. Each contact module has a plurality of ground and signal contacts. Each ground contact and signal contact includes a mating portion, a mounting portion, and an intermediate portion extending between the mating portion and the mounting portion. In each contact module, the intermediate portions of the ground contacts are disposed in a first common plane and the intermediate portions of the signal contacts are disposed in a second common plane that is spaced from the first common plane. The first contact modules and the second contact modules are arranged such that two adjacent signal contacts of the first and second contact modules, respectively, define a differential signal pair such that the intermediate portions of the adjacent signal contacts are spaced more closely than the intermediate portions of two adjacent ground contacts of the first and second contact modules, respectively.
摘要翻译：电连接器包括与第一接触模块相邻的第一接触模块和第二接触模块。每个触点模块具有多个接地和信号触点。每个接地触点和信号触点包括配合部分，安装部分和在配合部分和安装部分之间延伸的中间部分。在每个接触模块中，接地触头的中间部分设置在第一公共平面中，并且信号触头的中间部分设置在与第一公共平面间隔开的第二公共平面内。第一接触模块和第二接触模块被布置成使得第一和第二接触模块的两个相邻的信号触点分别限定差分信号对，使得相邻信号触头的中间部分比中间部分更紧密地间隔开分别是第一和第二接触模块的两个相邻接地触点。

5. 发明申请

US20100048043A1 Matched-Impedance Connector Footprints 有权
公开(公告)号：US20100048043A1
公开(公告)日：2010-02-25
申请号：US12604529
申请日：2009-10-23
申请人： Danny L.C. Morlion , Stefaan Sercu , Winnie Heyvaert , Jan DeGeest
发明人： Danny L.C. Morlion , Stefaan Sercu , Winnie Heyvaert , Jan DeGeest
IPC分类号： H01R12/04
CPC分类号： H05K1/114 , H05K1/0219 , H05K1/0237 , H05K2201/09227 , H05K2201/09236 , H05K2201/10189 , H05K2201/10734
摘要： Disclosed are methodologies for defining matched-impedance footprints on a substrate such as a printed circuit board, for example, that is adapted to receive an electrical component having an arrangement of terminal leads. Such a footprint may include an arrangement of electrically-conductive pads and an arrangement of electrically-conductive vias. The via arrangement may differ from the pad arrangement. The vias may be arranged to increase routing density, while limiting cross-talk and providing for matched impedance between the component and the substrate. The via arrangement may be altered to achieve a desired routing density on a layer of the board. Increasing the routing density may decrease the number of board layers, which tends to decrease capacitance and thereby increase impedance. Ground vias and signal vias may be arranged with respect to one another in such a manner as to affect impedance. Thus, the via arrangement may be altered to achieve an impedance that matches the impedance of the component. The via arrangement may be also be altered to limit cross-talk among neighboring signal conductors. Thus, the via arrangement may be defined to balance the impedance, cross-talk, and routing density requirements of the system.

6. 发明申请

US20060232301A1 Matched-impedance surface-mount technology footprints 有权
标题翻译：匹配阻抗表面贴装技术的脚印
公开(公告)号：US20060232301A1
公开(公告)日：2006-10-19
申请号：US11287926
申请日：2005-11-28
申请人： Danny Morlion , Stefaan Sercu , Winnie Heyvaert , Jan De Geest
发明人： Danny Morlion , Stefaan Sercu , Winnie Heyvaert , Jan De Geest
IPC分类号： H03K19/086 , H03K19/20
CPC分类号： H05K1/114 , H05K1/0219 , H05K1/0237 , H05K2201/09227 , H05K2201/09236 , H05K2201/10189 , H05K2201/10734
摘要： Disclosed are methodologies for defining matched-impedance surface-mount technology footprints on a substrate such as a printed circuit board, for example, that is adapted to receive an electrical component having an arrangement of terminal leads. Such a footprint may include an arrangement of electrically-conductive pads and an arrangement of electrically-conductive vias. The via arrangement may differ from the pad arrangement. The vias may be arranged to increase routing density, while limiting cross-talk and providing for matched impedance between the component and the substrate. The via arrangement may be altered to achieve a desired routing density on a layer of the board. Increasing the routing density may decrease the number of board layers, which tends to decrease capacitance and thereby increase impedance. Ground vias and signal vias may be arranged with respect to one another in such a manner as to affect impedance. Thus, the via arrangement may be altered to achieve an impedance that matches the impedance of the component. The via arrangement may be also be altered to limit cross-talk among neighboring signal conductors. Thus, the via arrangement may be defined to balance the impedance, cross-talk, and routing density requirements of the system.
摘要翻译：公开了用于在诸如印刷电路板的基板上定义匹配阻抗表面贴装技术足迹的方法，例如适于接收具有端子引线布置的电气部件。这种覆盖区可以包括导电焊盘的布置和导电通孔的布置。通孔布置可以不同于衬垫布置。通孔可以被布置成增加布线密度，同时限制串扰并且提供组件和基板之间的匹配阻抗。可以改变通孔布置以在板的层上实现期望的布线密度。增加布线密度可能会减少电路板层数，这往往会降低电容，从而增加阻抗。接地通路和信号通孔可以以影响阻抗的方式相对于彼此布置。因此，可以改变通孔布置以实现与部件的阻抗匹配的阻抗。也可以改变通孔装置以限制相邻信号导体之间的串扰。因此，可以定义通孔布置以平衡系统的阻抗，串扰和布线密度要求。

7. 发明授权

US09368916B2 Cross talk reduction for electrical connectors 有权
标题翻译：电连接器的串扰减少
公开(公告)号：US09368916B2
公开(公告)日：2016-06-14
申请号：US14122705
申请日：2012-05-25
申请人： Winnie Heyvaert , Ludwig Lange , Thierry Goossens , Jeroen De Bruijn
发明人： Winnie Heyvaert , Ludwig Lange , Thierry Goossens , Jeroen De Bruijn
IPC分类号： H01R13/6471 , H01R13/6461 , H01R13/7197 , H01R12/50 , H01R13/66
CPC分类号： H01R13/6471 , H01R13/6461 , H01R13/6658 , H01R13/7197 , H01R23/6873 , H01R23/688 , H01R23/7073
摘要： An electrical connector module including a housing and an array of electrical contacts within the housing. The electrical contacts include a plurality of signal conductors and a plurality of ground conductors. Ground coupling bars are used with at least two contact portions for contacting ground conductors. The connector includes slots enabling insertion of the ground coupling bar in a longitudinal direction of the ground coupling bar.
摘要翻译：一种电连接器模块，包括壳体和壳体内的电触头阵列。电触点包括多个信号导体和多个接地导体。接地连接杆与至少两个用于接触接地导体的接触部分一起使用。连接器包括能够沿接地连接杆的纵向方向插入接地连接杆的槽。

8. 发明授权

US08834204B2 Connector assembly 有权
标题翻译：连接器组件
公开(公告)号：US08834204B2
公开(公告)日：2014-09-16
申请号：US13376005
申请日：2010-02-01
申请人： Jeroen De Bruijn , Paul Johannes Marinus Potters , Ludwig Lange , Winnie Heyvaert
发明人： Jeroen De Bruijn , Paul Johannes Marinus Potters , Ludwig Lange , Winnie Heyvaert
IPC分类号： H01R13/658
CPC分类号： H01R13/65807 , H01R13/514 , H01R13/6474 , H01R13/6586
摘要： A connector assembly is provided which includes a housing and at least one conductor module. The conductor module comprises at least a first sub-module and a second sub-module attached together to form the conductor module. The conductor module is at least partially received in the housing. The housing and the first sub-module include cooperating positioning structures for positioning the at least one conductor module into the housing such that the position of the second sub-module with respect to the housing is determined by the position of the first sub-module with respect to the housing in at least a first direction (X; Z). A connector assembly is also provided in which at least one contact includes at least one contact beam of which a part is resiliently displaceable substantially parallel to a side wall of the housing from a preload position to a second position for receiving a mating contact. The housing includes a stand-off structure configured to cooperate with at least a portion of the contact to provide and maintain a separation between at least the contact portion and the first side wall in and between the preload position and the second position.
摘要翻译：提供一种连接器组件，其包括壳体和至少一个导体模块。所述导体模块至少包括第一子模块和第二子模块，所述第一子模块和第二子模块连接在一起以形成导体模块。导体模块至少部分地容纳在壳体中。壳体和第一子模块包括用于将至少一个导体模块定位到壳体中的协作定位结构，使得第二子模块相对于壳体的位置由第一子模块的位置确定，至少在第一方向（X; Z）上的壳体。还提供了一种连接器组件，其中至少一个触点包括至少一个触点梁，其中，一个部件可弹性移位，其基本上平行于壳体的侧壁从预加载位置到用于接收配合触点的第二位置。壳体包括配置成与接触件的至少一部分配合以提供并保持在预压位置和第二位置之间以及之间的至少接触部分和第一侧壁之间的间隔的支架结构。

9. 发明申请

US20120129399A1 Connector Assembly 有权
标题翻译：连接器组件
公开(公告)号：US20120129399A1
公开(公告)日：2012-05-24
申请号：US13376005
申请日：2010-02-01
申请人： Jeroen De Bruijn , Paul Johannes Marinus Potters , Ludwig Lange , Winnie Heyvaert
发明人： Jeroen De Bruijn , Paul Johannes Marinus Potters , Ludwig Lange , Winnie Heyvaert
IPC分类号： H01R24/28 , B29C45/14
CPC分类号： H01R13/65807 , H01R13/514 , H01R13/6474 , H01R13/6586
摘要： A connector assembly is provided which includes a housing and at least one conductor module. The conductor module comprises at least a first sub-module and a second sub-module attached together to form the conductor module. The conductor module is at least partially received in the housing. The housing and the first sub-module include cooperating positioning structures for positioning the at least one conductor module into the housing such that the position of the second sub-module with respect to the housing is determined by the position of the first sub-module with respect to the housing in at least a first direction (X; Z). A connector assembly is also provided in which at least one contact includes at least one contact beam of which a part is resiliently displaceable substantially parallel to a side wall of the housing from a preload position to a second position for receiving a mating contact. The housing includes a stand-off structure configured to cooperate with at least a portion of the contact to provide and maintain a separation between at least the contact portion and the first side wall in and between the preload position and the second position.
摘要翻译：提供一种连接器组件，其包括壳体和至少一个导体模块。所述导体模块至少包括第一子模块和第二子模块，所述第一子模块和第二子模块连接在一起以形成导体模块。导体模块至少部分地容纳在壳体中。壳体和第一子模块包括用于将至少一个导体模块定位到壳体中的协作定位结构，使得第二子模块相对于壳体的位置由第一子模块的位置确定，至少在第一方向（X; Z）上的壳体。还提供了一种连接器组件，其中至少一个触点包括至少一个触点梁，其中，一个部件可弹性移位，其基本上平行于壳体的侧壁从预加载位置到用于接收配合触点的第二位置。壳体包括配置成与接触件的至少一部分配合以提供并保持在预压位置和第二位置之间以及之间的至少接触部分和第一侧壁之间的间隔的支架结构。

10. 发明授权

US07709747B2 Matched-impedance surface-mount technology footprints 有权
标题翻译：匹配阻抗表面贴装技术的脚印
公开(公告)号：US07709747B2
公开(公告)日：2010-05-04
申请号：US11287926
申请日：2005-11-28
申请人： Danny L. C. Morlion , Stefaan Sercu , Winnie Heyvaert , Jan De Geest
发明人： Danny L. C. Morlion , Stefaan Sercu , Winnie Heyvaert , Jan De Geest
IPC分类号： H01R12/04 , H05K1/11
CPC分类号： H05K1/114 , H05K1/0219 , H05K1/0237 , H05K2201/09227 , H05K2201/09236 , H05K2201/10189 , H05K2201/10734
摘要： Disclosed are methodologies for defining matched-impedance surface-mount technology footprints on a substrate such as a printed circuit board, for example, that is adapted to receive an electrical component having an arrangement of terminal leads. Such a footprint may include an arrangement of electrically-conductive pads and an arrangement of electrically-conductive vias. The via arrangement may differ from the pad arrangement. The vias may be arranged to increase routing density, while limiting cross-talk and providing for matched impedance between the component and the substrate. The via arrangement may be altered to achieve a desired routing density on a layer of the board. Increasing the routing density may decrease the number of board layers, which tends to decrease capacitance and thereby increase impedance. Ground vias and signal vias may be arranged with respect to one another in such a manner as to affect impedance. Thus, the via arrangement may be altered to achieve an impedance that matches the impedance of the component. The via arrangement may be also be altered to limit cross-talk among neighboring signal conductors. Thus, the via arrangement may be defined to balance the impedance, cross-talk, and routing density requirements of the system.
摘要翻译：公开了用于在诸如印刷电路板的基板上定义匹配阻抗表面贴装技术足迹的方法，例如适于接收具有端子引线布置的电气部件。这种覆盖区可以包括导电焊盘的布置和导电通孔的布置。通孔布置可以不同于衬垫布置。通孔可以被布置成增加布线密度，同时限制串扰并且提供组件和基板之间的匹配阻抗。可以改变通孔布置以在板的层上实现期望的布线密度。增加布线密度可能会减少电路板层数，这往往会降低电容，从而增加阻抗。接地通路和信号通孔可以以影响阻抗的方式相对于彼此布置。因此，可以改变通孔布置以实现与部件的阻抗匹配的阻抗。也可以改变通孔装置以限制相邻信号导体之间的串扰。因此，可以定义通孔布置以平衡系统的阻抗，串扰和布线密度要求。

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