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1. 发明申请

US20140182891A1 GEOMETRICS FOR IMPROVING PERFORMANCE OF CONNECTOR FOOTPRINTS 有权
标题翻译：提高连接器性能的几何图形
公开(公告)号：US20140182891A1
公开(公告)日：2014-07-03
申请号：US14092039
申请日：2013-11-27
申请人： Madhumitha Rengarajan , Jan De Geest , Stephen B. Smith , Stefaan Hendrik Jozef Sercu
发明人： Madhumitha Rengarajan , Jan De Geest , Stephen B. Smith , Stefaan Hendrik Jozef Sercu
IPC分类号： H05K1/02
CPC分类号： H05K1/116 , H05K1/0222 , H05K1/0251 , H05K2201/09636 , H05K2201/09718 , H05K2203/0207 , H05K2203/0242
摘要： In accordance with the various embodiments disclosed herein, an improved electrical connector footprint, such as on printed circuit boards (PCB), is described. For example, antipads can have a variety of sizes and pairs of differential signal traces can define centerlines that are spaced apart from each other.
摘要翻译：根据本文公开的各种实施例，描述了改进的电连接器占用面积，例如在印刷电路板（PCB）上。例如，反码器可以具有各种尺寸，并且差分信号迹线对可以定义彼此间隔开的中心线。

2. 发明授权

US08734187B2 Electrical connector with ground plates 有权
标题翻译：带接地板的电气连接器
公开(公告)号：US08734187B2
公开(公告)日：2014-05-27
申请号：US13166081
申请日：2011-06-22
申请人： Jan De Geest , Stefaan Hendrik Jozef Sercu , Stephen B. Smith , Douglas M. Johnescu , Jonathan E. Buck
发明人： Jan De Geest , Stefaan Hendrik Jozef Sercu , Stephen B. Smith , Douglas M. Johnescu , Jonathan E. Buck
IPC分类号： H01R24/00
CPC分类号： H01R13/6587 , H01R13/2457
摘要： An electrical connector and leadframe assemblies for use therein are provided. Each leadframe assembly can be constructed with at least one electric contact having a ground plate. A first type of leadframe assembly includes an uppermost electrical contact defining a ground plate. A second type of leadframe assembly includes a lowermost electrical contact defining a ground plate. The ground plates can reduce the level of crosstalk exhibited by the electrical connector.
摘要翻译：提供了一种用于其中的电连接器和引线框架组件。每个引线框架组件可以构造成具有至少一个具有接地板的电触点。引线框组件的第一种类型包括限定接地板的最上面的电触点。第二类引线框架组件包括限定接地板的最下面的电触头。接地板可以降低电连接器所呈现的串扰水平。

3. 发明授权

US08361896B2 Signal transmission for high speed interconnections 有权
标题翻译：用于高速互连的信号传输
公开(公告)号：US08361896B2
公开(公告)日：2013-01-29
申请号：US13166155
申请日：2011-06-22
申请人： Jan De Geest
发明人： Jan De Geest
IPC分类号： H01R13/648
CPC分类号： H05K1/0231 , H01R13/6477 , H01R13/6587 , H05K3/306 , H05K2201/09145 , H05K2201/10189 , H05K2201/10446
摘要： A connector assembly includes a substrate and a connector. The substrate includes a ground layer and a trace layer. The substrate defines a substrate edge, and the ground layer defines a ground edge. The connector is mounted on the substrate such that a portion of the connector overhangs the substrate edge of the substrate. The connector includes a first signal contact that defines a mating portion, a mounting portion, a first transition portion connected to the mating portion, and a second transition portion connected to the first transition portion and the mounting portion. The first transition portion of the signal contact at least partially crosses the ground edge such that a gap is defined between the ground edge and the first transition portion and a substantial portion of the second transition portion extends over the gap when the electrical connector is mounted on the substrate.
摘要翻译：连接器组件包括基板和连接器。衬底包括接地层和迹线层。衬底限定衬底边缘，并且接地层限定接地边缘。连接器安装在基板上，使得连接器的一部分悬垂在基板的基板边缘上。连接器包括限定配合部分的第一信号触点，安装部分，连接到配合部分的第一过渡部分和连接到第一过渡部分和安装部分的第二过渡部分。信号触头的第一过渡部分至少部分地穿过接地边缘，使得在接地边缘和第一过渡部分之间限定间隙，并且当电连接器安装在第一过渡部分上时，第二过渡部分的大部分在间隙上延伸底物。

4. 发明授权

US07713088B2 Broadside-coupled signal pair configurations for electrical connectors 有权
标题翻译：用于电连接器的宽边耦合信号对配置
公开(公告)号：US07713088B2
公开(公告)日：2010-05-11
申请号：US11866061
申请日：2007-10-02
申请人： Stefaan Hendrik Jozef Sercu , Jan De Geest
发明人： Stefaan Hendrik Jozef Sercu , Jan De Geest
IPC分类号： H01R13/648
CPC分类号： H01R13/6586 , H01R12/7082 , H01R13/6471 , H01R13/6477
摘要： An electrical connector having a first electrical contact and a second electrical contact adjacent to the first electrical contact. The first electrical contact may define a first broadside and a second broadside opposite the first broadside. The second electrical contact may define a third broadside and a fourth broadside opposite the third broadside. The electrical connector may further include a non-air dielectric and a commoned ground plate. The non-air dielectric may be disposed between the second broadside of the first electrical contact and the fourth broadside of the second electrical contact. The commoned ground plate and the first electrical contact may be adjacent to one another and may be separated by an air dielectric.
摘要翻译：一种电连接器，具有与第一电触点相邻的第一电接触和第二电接触。第一电触头可以限定与第一宽边相对的第一宽边和第二宽边。第二电触点可以限定与第三宽边相对的第三宽边和第四宽边。电连接器还可以包括非空气电介质和公共接地板。非空气电介质可以设置在第一电触点的第二宽侧和第二电接触的第四宽边之间。公共接地板和第一电接触件可以彼此相邻并且可以由空气电介质分离。

5. 发明申请

US20090221165A1 CROSS TALK REDUCTION FOR HIGH SPEED ELECTRICAL CONNECTORS 有权
标题翻译：用于高速电气连接器的交叉减速
公开(公告)号：US20090221165A1
公开(公告)日：2009-09-03
申请号：US12393794
申请日：2009-02-26
申请人： Jonathan E. Buck , Stefaan Hendrik Jozef Sercu , Jan De Geest , Steven E. Minich , Mark R. Gray , Christopher J. Kolivoski , Douglas M. Johnescu
发明人： Jonathan E. Buck , Stefaan Hendrik Jozef Sercu , Jan De Geest , Steven E. Minich , Mark R. Gray , Christopher J. Kolivoski , Douglas M. Johnescu
IPC分类号： H01R4/66
CPC分类号： H01R23/6873 , H01R12/716 , H01R12/724 , H01R13/514 , H01R13/6471 , H01R13/6587 , H01R31/06
摘要： Example electrical connectors are provided including a plurality of electrical contacts configured to communicate between electrical devices. The plurality of electrical contacts includes a plurality of ground contacts. A ground coupling assembly is configured to electrically connect ground contacts of an electrical connector to adjust a performance characteristic of the electrical connector as desired.
摘要翻译：提供示例性电连接器，其包括构造成在电气装置之间通信的多个电触点。多个电触头包括多个接地触点。接地联接组件被配置为电连接电连接器的接地触点，以根据需要调整电连接器的性能特性。

6. 发明授权

US09084353B2 Structured circuit board and method 有权
标题翻译：结构电路板和方法
公开(公告)号：US09084353B2
公开(公告)日：2015-07-14
申请号：US13807325
申请日：2011-06-28
申请人： Jan De Geest , Stefaan Hendrik Jozef Sercu
发明人： Jan De Geest , Stefaan Hendrik Jozef Sercu
IPC分类号： H05K1/02 , H05K1/11
CPC分类号： H05K1/0251 , H05K1/024 , H05K1/0245 , H05K1/115 , H05K3/429 , H05K2201/0187 , H05K2201/09063 , H05K2201/09618 , H05K2201/09636 , H05K2201/09718 , H05K2201/10189
摘要： A circuit board (1) is provided comprising a plurality of insulating layers, at least one ground layer and at least one layer comprising signal traces. The circuit board comprises at least a first conductive via (17) and a second conductive via (17). The first conductive via and the second conductive via penetrate through at least a first insulating layer of the plurality of insulating layers and are connected to a signal trace. The first conductive via and the second conductive via are arranged adjacent each other. At least in the first insulating layer the first conductive via and the second conductive via are separated in a first direction of separation (R) by a first adjustment portion comprising a dielectric material property different from the first insulating layer.
摘要翻译：提供电路板（1），其包括多个绝缘层，至少一个接地层和至少一个包含信号迹线的层。电路板包括至少第一导电通孔（17）和第二导电通孔（17）。第一导电通孔和第二导电通孔穿透多个绝缘层中的至少第一绝缘层，并连接到信号迹线。第一导电通孔和第二导电通孔彼此相邻布置。至少在第一绝缘层中，通过包括不同于第一绝缘层的介电材料性质的第一调节部分，第一导电通孔和第二导电通孔在第一分离方向（R）分离。

7. 发明授权

US08764464B2 Cross talk reduction for high speed electrical connectors 有权
标题翻译：用于高速电气连接器的串扰减少
公开(公告)号：US08764464B2
公开(公告)日：2014-07-01
申请号：US12393794
申请日：2009-02-26
申请人： Jonathan E. Buck , Stefaan Hendrik Jozef Sercu , Jan De Geest , Steven E. Minich , Mark R. Gray , Christopher J. Kolivoski , Douglas M. Johnescu , Stuart C. Stoner , Alan Raistrick
发明人： Jonathan E. Buck , Stefaan Hendrik Jozef Sercu , Jan De Geest , Steven E. Minich , Mark R. Gray , Christopher J. Kolivoski , Douglas M. Johnescu , Stuart C. Stoner , Alan Raistrick
IPC分类号： H01R4/66 , H01R12/16 , H01R13/6471 , H01R13/514
CPC分类号： H01R23/6873 , H01R12/716 , H01R12/724 , H01R13/514 , H01R13/6471 , H01R13/6587 , H01R31/06
摘要： Example electrical connectors are provided including a plurality of electrical contacts configured to communicate between electrical devices. The plurality of electrical contacts includes a plurality of ground contacts. A ground coupling assembly is configured to electrically connect ground contacts of an electrical connector to adjust a performance characteristic of the electrical connector as desired.
摘要翻译：提供示例性电连接器，其包括构造成在电气装置之间通信的多个电触点。多个电触头包括多个接地触点。接地联接组件被配置为电连接电连接器的接地触点，以根据需要调整电连接器的性能特性。

8. 发明申请

US20140057493A1 HIGH SPEED ELECTRICAL CONNECTOR 有权
标题翻译：高速电气连接器
公开(公告)号：US20140057493A1
公开(公告)日：2014-02-27
申请号：US13972236
申请日：2013-08-21
申请人： Jan De Geest , Stefaan Hendrik Jozef Sercu , Johannes Maria Blasius van Woensel
发明人： Jan De Geest , Stefaan Hendrik Jozef Sercu , Johannes Maria Blasius van Woensel
IPC分类号： H01R24/00
CPC分类号： H01R13/6471 , H01R12/585 , H01R12/724 , H01R12/737 , H01R13/6585 , H01R13/6594 , H01R13/6597 , H01R23/005
摘要： An electrical connector assembly includes a first electrical connector and a second electrical connector. Each electrical connector can include an electrical ground shield that at least partially surrounds respective differential signal pairs.
摘要翻译：电连接器组件包括第一电连接器和第二电连接器。每个电连接器可以包括至少部分地围绕各个差分信号对的电接地屏蔽。

9. 发明申请

US20130199834A1 STRUCTURED CIRCUIT BOARD AND METHOD 有权
标题翻译：结构电路板和方法
公开(公告)号：US20130199834A1
公开(公告)日：2013-08-08
申请号：US13807325
申请日：2011-06-28
申请人： Jan De Geest , Stefaan Hendrik Jozef Sercu
发明人： Jan De Geest , Stefaan Hendrik Jozef Sercu
IPC分类号： H05K1/11
CPC分类号： H05K1/0251 , H05K1/024 , H05K1/0245 , H05K1/115 , H05K3/429 , H05K2201/0187 , H05K2201/09063 , H05K2201/09618 , H05K2201/09636 , H05K2201/09718 , H05K2201/10189
摘要： A circuit board (1) is provided comprising a plurality of insulating layers, at least one ground layer and at least one layer comprising signal traces. The circuit board comprises at least a first conductive via (17) and a second conductive via (17). The first conductive via and the second conductive via penetrate through at least a first insulating layer of the plurality of insulating layers and are connected to a signal trace. The first conductive via and the second conductive via are arranged adjacent each other. At least in the first insulating layer the first conductive via and the second conductive via are separated in a first direction of separation (R) by a first adjustment portion comprising a dielectric material property different from the first insulating layer.
摘要翻译：提供电路板（1），其包括多个绝缘层，至少一个接地层和至少一个包含信号迹线的层。电路板包括至少第一导电通孔（17）和第二导电通孔（17）。第一导电通孔和第二导电通孔穿透多个绝缘层中的至少第一绝缘层，并连接到信号迹线。第一导电通孔和第二导电通孔彼此相邻布置。至少在第一绝缘层中，通过包括不同于第一绝缘层的介电材料性质的第一调节部分，第一导电通孔和第二导电通孔在第一分离方向（R）分离。

10. 发明申请

US20110318945A1 ELECTRICAL CONNECTOR WITH GROUND PLATES 有权
标题翻译：带接地板的电气连接器
公开(公告)号：US20110318945A1
公开(公告)日：2011-12-29
申请号：US13166081
申请日：2011-06-22
申请人： Jan De Geest , Stefaan Hendrik Jozef Sercu , Stephen B. Smith , Douglas M. Johnescu , Jonathan E. Buck
发明人： Jan De Geest , Stefaan Hendrik Jozef Sercu , Stephen B. Smith , Douglas M. Johnescu , Jonathan E. Buck
IPC分类号： H01R13/648
CPC分类号： H01R13/6587 , H01R13/2457
摘要： An electrical connector and leadframe assemblies for use therein are provided. Each leadframe assembly can be constructed with at least one electric contact having a ground plate. A first type of leadframe assembly includes an uppermost electrical contact defining a ground plate. A second type of leadframe assembly includes a lowermost electrical contact defining a ground plate. The ground plates can reduce the level of crosstalk exhibited by the electrical connector.
摘要翻译：提供了一种用于其中的电连接器和引线框架组件。每个引线框架组件可以构造成具有至少一个具有接地板的电触点。引线框组件的第一种类型包括限定接地板的最上面的电触点。第二类引线框架组件包括限定接地板的最下面的电触头。接地板可以降低电连接器所呈现的串扰水平。

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