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    • 9. 发明授权
    • Circuit arrangement for measuring a mechanical deformation, in
particular under the influence of a pressure
    • 用于测量机械变形的电路布置,特别是在压力的影响下
    • US5134885A
    • 1992-08-04
    • US579939
    • 1990-09-07
    • Hans HechtWinfried Kuhnt
    • Hans HechtWinfried Kuhnt
    • G01L1/00G01B7/16G01L1/22G01L9/04G01L19/04
    • G01L1/2281G01L9/065
    • A circuit arrangement for measuring a mechanical deformation includes a pressure sensor with compression-deformable resistors for generating an analog deformation-dependent signal and a circuit for evaluating the analog deformation-dependent signal. The evaluating circuit includes a summing amplifier and a temperature-dependent coupling resistor connected between the input of the summing amplifier and the pressure sensor. The coupling resistor has a temperature coefficient adjusted to compensate for the temperature characteristic of the measuring sensitivity of the analog deformation-dependent signal. A temperature sensor generates a temperature-dependent signal corresponding to a static temperature characteristic of the evaluating circuit. There is provided a circuit for applying the temperature-dependent signal to the input of the summing amplifier to combine it with the analog deformation-dependent signal. The summing amplifier generates at its output a temperature-compensated, deformation-dependent output signal.
    • 用于测量机械变形的电路装置包括具有用于产生模拟变形相关信号的可压缩可变形电阻器的压力传感器和用于评估模拟变形相关信号的电路。 评估电路包括加法放大器和连接在求和放大器的输入端与压力传感器之间的温度依赖耦合电阻。 耦合电阻具有调整温度系数,以补偿模拟变形相关信号的测量灵敏度的温度特性。 温度传感器产生对应于评估电路的静态温度特性的温度相关信号。 提供了一种用于将温度依赖信号施加到加法放大器的输入端以将其与模拟变形相关信号组合的电路。 加法放大器在其输出端产生温度补偿,与变形相关的输出信号。