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    • 7. 发明授权
    • Sensor device
    • 传感器装置
    • US07036380B2
    • 2006-05-02
    • US10525944
    • 2004-06-18
    • Thomas FesseleMasoud HabibiChristian RoesserMarkus LedermannJan Gebauer
    • Thomas FesseleMasoud HabibiChristian RoesserMarkus LedermannJan Gebauer
    • G01L7/00
    • G01L19/148G01L19/0645G01L19/147H01L2224/73265
    • A sensor, in particular a pressure sensor, having a housing 1; a housing interior 12 that contains a sensor element 9; electrical connecting elements 7 that are routed from the outside, through a housing part 2, and into the housing interior 19 and have connecting segments 17, which protrude into the housing interior on an inside 14 of the housing part 2 at respective entry points 15 and are electrically connected to the sensor element; and having a protective covering 21 that covers the connecting segments and the sensor element. To prevent air bubbles from getting into the protective covering, a sealing material 20 is applied onto the connecting segments 17, at least in the region of the entry point 15 of the respective connecting segments 17 into the housing interior 19 and the part 13 of the inside 14 of the housing part 2 encompassing the entry point 15, and the covering 21 is applied onto the sealing material 20 and the connecting segments 17.
    • 具有壳体1的传感器,特别是压力传感器; 包含传感器元件9的壳体内部12; 电连接元件7从外部通过壳体部分2引导到壳体内部19中,并且具有连接段17,其在相应的入口点15处突出到壳体部分2的内部14中的壳体内部,并且 电连接到传感器元件; 并且具有覆盖连接段和传感器元件的保护盖21。 为了防止气泡进入保护罩,密封材料20至少在相应的连接段17的进入点15的区域中被施加到连接段17上,进入壳体内部19,并且将第二部分13 围绕入口点15的壳体部分2的内部14,并且将覆盖物21施加到密封材料20和连接段17上。
    • 8. 发明授权
    • Pressure sensor having a silicon chip on a steel diaphragm
    • 压力传感器在钢隔膜上具有硅芯片
    • US07093493B2
    • 2006-08-22
    • US11055473
    • 2005-02-09
    • Hubert BenzelMasoud HabibiGilbert MoerschRoland GuenschelJan Gebauer
    • Hubert BenzelMasoud HabibiGilbert MoerschRoland GuenschelJan Gebauer
    • E03B1/00
    • G01L19/146G01L9/0048G01L9/0055
    • A micromechanical device for measuring a pressure variable and a method for manufacturing a micromechanical pressure sensor. The sensor includes, two components; a first component featuring a diaphragm made of a first material, and a second component of a second material. This second component is designed to have a thin first region and a thick second region. The first and second components are permanently joined together via the first diaphragm and at least a portion of the first region. The materials are selected such that the temperature expansion coefficient of the first material is higher than that of the second material. The first and second components are joined in such a manner that a lateral expansion of the first diaphragm caused by temperature changes is transferred to the first region of the second component as a lateral expansion as well.
    • 用于测量压力变量的微机械装置和用于制造微机械压力传感器的方法。 传感器包括两个部件; 具有由第一材料制成的隔膜的第一部件和第二材料的第二部件。 该第二部件被设计成具有薄的第一区域和厚的第二区域。 第一和第二部件通过第一隔膜和第一区域的至少一部分永久地连接在一起。 选择材料使得第一材料的温度膨胀系数高于第二材料的温度膨胀系数。 第一和第二部件以这样的方式接合,使得由温度变化引起的第一隔膜的横向膨胀也作为横向膨胀传递到第二部件的第一区域。
    • 9. 发明申请
    • Sensor Module
    • 传感器模块
    • US20080034877A1
    • 2008-02-14
    • US10592631
    • 2004-11-17
    • Thomas FesseleMasoud HabibiChristian RoesserMarkus LedermannJan GebauerDaniel Toews
    • Thomas FesseleMasoud HabibiChristian RoesserMarkus LedermannJan GebauerDaniel Toews
    • G01L9/00
    • G01L19/069G01L19/143G01L19/148
    • A pressure sensor module having a sensor housing which includes a housing part in which electrical conductors are partially embedded, the sensor housing being provided with a first cavity, in which a sensor system is situated, and a second cavity which is sealed against the first cavity and in which is provided at least one capacitor, and the first cavity being provided with a receptacle part having a receptacle formed by a peripheral wall, the sensor system being inserted into this receptacle and covered by a protective covering filled into the receptacle. The sensor system is contacted with connecting elements provided on the receptacle part, these connecting elements being directly connected to connecting sections of the electrical conductors; and the at least one capacitor provided in the second cavity is connected to at least one of the electrical conductors via an electrically conductive material.
    • 一种压力传感器模块,其具有传感器壳体,该传感器壳体包括壳体部分,电气导体部分地嵌入该壳体部分中,传感器壳体设置有第一空腔,传感器系统位于该第一空腔中,第二腔体与第一空腔密封 并且其中设置有至少一个电容器,并且所述第一空腔设置有具有由周壁形成的容座的容器部分,所述传感器系统插入到所述容器中并被填充到所述容器中的保护性覆盖物覆盖。 传感器系统与设置在容器部分上的连接元件接触,这些连接元件直接连接到电导体的连接部分; 并且设置在第二腔中的至少一个电容器经由导电材料连接到至少一个电导体。
    • 10. 发明申请
    • Sensor device
    • 传感器装置
    • US20050247133A1
    • 2005-11-10
    • US10525944
    • 2004-06-18
    • Thomas FesseleMasoud HabibiChristian RoesserMarkus LedermannJan Gebauer
    • Thomas FesseleMasoud HabibiChristian RoesserMarkus LedermannJan Gebauer
    • G01L9/00
    • G01L19/148G01L19/0645G01L19/147H01L2224/73265
    • A sensor, in particular a pressure sensor, having a housing 1; a housing interior 12 that contains a sensor element 9; electrical connecting elements 7 that are routed from the outside, through a housing part 2, and into the housing interior 19 and have connecting segments 17, which protrude into the housing interior on an inside 14 of the housing part 2 at respective entry points 15 and are electrically connected to the sensor element; and having a protective covering 21 that covers the connecting segments and the sensor element. To prevent air bubbles from getting into the protective covering, a sealing material 20 is applied onto the connecting segments 17, at least in the region of the entry point 15 of the respective connecting segments 17 into the housing interior 19 and the part 13 of the inside 14 of the housing part 2 encompassing the entry point 15, and the covering 21 is applied onto the sealing material 20 and the connecting segments 17.
    • 具有壳体1的传感器,特别是压力传感器; 包含传感器元件9的壳体内部12; 电连接元件7从外部通过壳体部分2引导到壳体内部19中,并且具有连接段17,其在相应的入口点15处突出到壳体部分2的内部14中的壳体内部,并且 电连接到传感器元件; 并且具有覆盖连接段和传感器元件的保护盖21。 为了防止气泡进入保护罩,密封材料20至少在相应的连接段17的进入点15的区域中被施加到连接段17上,进入壳体内部19,并且将第二部分13 围绕入口点15的壳体部分2的内部14,并且将覆盖物21施加到密封材料20和连接段17上。