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1. 发明授权

US07858273B2 Method of forming a mask design having advanced oriented assist features for integrated circuit hole patterns 有权
标题翻译：形成具有用于集成电路孔图案的先进定向辅助特征的掩模设计的方法
公开(公告)号：US07858273B2
公开(公告)日：2010-12-28
申请号：US12499704
申请日：2009-07-08
申请人： Chin Chen Yang
发明人： Chin Chen Yang
IPC分类号： G03F1/00 , G03F1/14 , G06F17/50
CPC分类号： G03F1/36 , Y10T428/24802
摘要： A method of forming a mask for optically transferring a lithographic pattern having a plurality of isolated elements onto a semiconductor substrate, wherein spacing between these isolated elements is controlled according to a given pitch, the method comprising: disposing a plurality of assist features around each of the plurality of isolated elements, each assist feature near to a corner of one isolated element, each assist feature having a width, a length, a first separation parameter defining a distance between individual assist features, and a second separation parameter defining a distance between each of the plurality of assist features and each corresponding adjacent isolated element in the plurality of isolated elements; determining optimized values of the width, the length, the first separation parameter, and the second separation parameter; and setting an assist feature rule according to the given pitch and the optimized values.
摘要翻译：一种形成用于将具有多个隔离元件的光刻图案光学转移到半导体衬底上的掩模的方法，其中根据给定间距来控制这些隔离元件之间的间隔，该方法包括：多个隔离元件，每个辅助特征靠近一个隔离元件的角部，每个辅助特征具有宽度，长度，限定各个辅助特征之间的距离的第一分离参数，以及限定每个辅助特征之间的距离的第二分离参数所述多个辅助特征和所述多个隔离元件中的每个对应的相邻隔离元件; 确定宽度，长度，第一分离参数和第二分离参数的优化值; 并根据给定的音调和优化的值设置辅助特征规则。

2. 发明授权

US07525139B2 Image sensor with a protection layer 有权
标题翻译：具有保护层的图像传感器
公开(公告)号：US07525139B2
公开(公告)日：2009-04-28
申请号：US11025746
申请日：2004-12-29
申请人： Wen-Kun Yang , Chin-Chen Yang , Wen-Ping Yang , Wen-Bin Sun , Chao-nan Chou , His-Ying Yuan , Jui-Hsien Chang
发明人： Wen-Kun Yang , Chin-Chen Yang , Wen-Ping Yang , Wen-Bin Sun , Chao-nan Chou , His-Ying Yuan , Jui-Hsien Chang
IPC分类号： H01L31/062
CPC分类号： H01L27/14687 , H01L21/561 , H01L24/97 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L27/14632 , H01L27/14685 , H01L31/0203 , H01L31/02325 , H01L2224/04105 , H01L2224/20 , H01L2224/211 , H01L2224/24137 , H01L2224/32145 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/15788 , H05K1/189 , H01L2924/00 , H01L2224/83 , H01L2224/82
摘要： An image sensor die comprises a substrate and an image sensor array formed over the substrate. Micro lens are disposed on the image sensor array. A protection layer is formed on the micro lens to prevent the micro lens from particle containment.
摘要翻译：图像传感器管芯包括衬底和形成在衬底上的图像传感器阵列。微透镜设置在图像传感器阵列上。在微透镜上形成保护层，以防止微透镜受到颗粒的抑制。

3. 发明授权

US07061117B2 Bump layout on silicon chip 有权
公开(公告)号：US07061117B2
公开(公告)日：2006-06-13
申请号：US10708665
申请日：2004-03-18
申请人： Wen-Chih Yang , Feng-Cheng Su , Chin-Chen Yang
发明人： Wen-Chih Yang , Feng-Cheng Su , Chin-Chen Yang
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/17 , H01L23/50 , H01L2224/13099 , H01L2924/01033 , H01L2924/10253 , H01L2924/14 , H01L2924/00
摘要： A bump layout on the active region of a driver IC for increasing overall bump count. The layout fits IC packages that have a narrow and long body profile. Bumps are positioned close to the long side and central regions of the active region so that low marking pressure on the shorter sides of the package during chip-glass bondage is avoided. Dummy bumps may also be positioned close to the shorter sides of the package so that pressure distribution is optimized during chip-glass bondage.

4. 发明申请

US20060073421A1 METHOD OF FORMING A LIGHT GUIDE PLATE INSERT MOLD 审中-公开
标题翻译：形成光导板插件模具的方法
公开(公告)号：US20060073421A1
公开(公告)日：2006-04-06
申请号：US10711793
申请日：2004-10-06
申请人： Irene Chen , Jyh-Huei Lay , Tien-Yu Chou , Yuan-Hung Wang , Chin-Chen Yang , Chuan-Lun Hsu
发明人： Irene Chen , Jyh-Huei Lay , Tien-Yu Chou , Yuan-Hung Wang , Chin-Chen Yang , Chuan-Lun Hsu
IPC分类号： B29C33/38
CPC分类号： G02B6/0065 , G03F7/0005
摘要： A substrate is provided, and a surface treating process is performed on the surface of the substrate. Then, a plurality of photo resist patterns are formed on the substrate, and a flow process is performed so that each photo resist pattern has a microlens surface. Finally, a metal layer is formed on the photo resist patterns so that the bottom surface of the metal layer has a plurality of patterns complementary to the photo resist patterns.
摘要翻译：提供基板，并且在基板的表面上进行表面处理工艺。然后，在基板上形成多个光致抗蚀剂图案，并且进行流程处理，使得每个光刻胶图案具有微透镜表面。最后，在光致抗蚀剂图案上形成金属层，使得金属层的底面具有与光刻胶图形互补的多个图案。

5. 发明申请

US20050242409A1 Imagine sensor with a protection layer 有权
标题翻译：想象一下具有保护层的传感器
公开(公告)号：US20050242409A1
公开(公告)日：2005-11-03
申请号：US11025746
申请日：2004-12-29
申请人： Wen-Kun Yang , Chin-Chen Yang , Wen-Ping Yang , Wen-Bin Sun , Chao-nan Chou , His-Ying Yuan , Jui-Hsien Chang
发明人： Wen-Kun Yang , Chin-Chen Yang , Wen-Ping Yang , Wen-Bin Sun , Chao-nan Chou , His-Ying Yuan , Jui-Hsien Chang
IPC分类号： H01L27/14 , H01L21/00 , H01L21/50 , H01L21/56 , H01L23/12 , H01L23/50 , H01L27/144 , H01L27/146 , H01L29/06 , H01L31/00 , H01L31/0203 , H01L31/0232 , H01L31/10 , H04N5/225 , H05K1/18
CPC分类号： H01L27/14687 , H01L21/561 , H01L24/97 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L27/14632 , H01L27/14685 , H01L31/0203 , H01L31/02325 , H01L2224/04105 , H01L2224/20 , H01L2224/211 , H01L2224/24137 , H01L2224/32145 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/15788 , H05K1/189 , H01L2924/00 , H01L2224/83 , H01L2224/82
摘要： An image sensor die comprises a substrate and an image sensor array formed over the substrate. Micro lens are disposed on the image sensor array. A protection layer is formed on the micro lens to prevent the micro lens from particle containment.
摘要翻译：图像传感器管芯包括衬底和形成在衬底上的图像传感器阵列。微透镜设置在图像传感器阵列上。在微透镜上形成保护层，以防止微透镜受到颗粒的抑制。

6. 发明授权

US5927881A Multiple-shaft pen kit 失效
标题翻译：多轴笔套件
公开(公告)号：US5927881A
公开(公告)日：1999-07-27
申请号：US963079
申请日：1997-11-03
申请人： Chin-Chen Yang
发明人： Chin-Chen Yang
IPC分类号： B43K24/16 , B43K29/00 , B43K27/00
CPC分类号： B43K24/163 , B43K29/00
摘要： A type of multiple-shaft pen kit, comprising a link hook joined to the top of each operating knob in the multiple-shaft pen kit. The link hook pulls an operating unit, and its position can be reset by a reset spring. The operating unit is joined with a pushing piece which is located in a housing to push on the inside of the moving unit and cause the outside of the moving unit to swing. Or it can simultaneously drive an interior moving part to move, so the various figure patterns on the interior moving part will match the through holes on the housing. Such a construction is designed to create different changing effects, adding more fun to the animated effects.
摘要翻译：一种多轴笔组件，包括连接到多轴笔组件中每个操作旋钮顶部的连接钩。连接钩拉动操作单元，其位置可以通过复位弹簧复位。操作单元与位于壳体中的推动件接合，以推动移动单元的内部并使得移动单元的外部摆动。或者可以同时驱动内部移动部件移动，因此内部移动部件上的各种图案将与壳体上的通孔匹配。这样的设计旨在创造不同的变化效果，为动画效果增添更多乐趣。

7. 发明授权

US07686909B2 Reel-type package of flexible printed circuit boards and method for supplying thereof 有权
标题翻译：柔性印刷电路板的卷绕式封装及其供电方法
公开(公告)号：US07686909B2
公开(公告)日：2010-03-30
申请号：US11896498
申请日：2007-09-04
申请人： Ping-Chin Cheng , Sheng-Hsiung Ho , Chin-Chen Yang
发明人： Ping-Chin Cheng , Sheng-Hsiung Ho , Chin-Chen Yang
IPC分类号： B32B38/04
CPC分类号： H05K3/0052 , H05K1/0393 , H05K3/005 , H05K3/0097 , H05K3/361 , H05K2203/1545 , Y10T156/1052 , Y10T156/1067 , Y10T156/1087 , Y10T156/12
摘要： A method for reel-type packaging flexible printed circuit boards (FPCs) is disclosed. Firstly, a flexible plate having a plurality of FPC patterns is cut out to form several bar-like materials, wherein each of the bar-like materials has a plurality of aligned FPCs thereon. Subsequently, the bar-like materials are wound onto a reel one by one to form a reel-type package so as to prevent the FPCs from crumpling, curving and deforming when suffering an external force.
摘要翻译：公开了一种卷绕式包装柔性印刷电路板（FPC）的方法。首先，切割具有多个FPC图案的柔性板以形成几个棒状材料，其中每个棒状材料上具有多个对准的FPC。随后，将棒状材料一个一个地缠绕在卷轴上，以形成卷轴式包装，以防止FPC在受到外力时弄皱，弯曲和变形。

8. 发明申请

US20050208435A1 METHOD FOR FABRICATING METALLIC STRUCTURE 审中-公开
标题翻译：制作金属结构的方法
公开(公告)号：US20050208435A1
公开(公告)日：2005-09-22
申请号：US10708702
申请日：2004-03-19
申请人： Irene Chen , Jyh-Huei Lay , Tien-Yu Chou , Yih-Far Chen , Yuan-Hung Wang , Jo-Wen Wu , Kuo-Hsiung Yen , Chin-Chen Yang , Chuan-Lun Hsu , Wei-Chih Ma , Hung-Lung Chuang
发明人： Irene Chen , Jyh-Huei Lay , Tien-Yu Chou , Yih-Far Chen , Yuan-Hung Wang , Jo-Wen Wu , Kuo-Hsiung Yen , Chin-Chen Yang , Chuan-Lun Hsu , Wei-Chih Ma , Hung-Lung Chuang
IPC分类号： G03F7/00 , G03F7/40
CPC分类号： G03F7/405 , G03F7/00 , G03F7/0015 , G03F7/0017
摘要： First, a substrate is provided and a photoresist layer is coated thereon. Then, a film having a pattern is used as a mask to perform an exposing and developing process for patterning the photoresist layer. Following that, LIGA technology is employed to form a thin film having a pattern corresponding to the pattern of the film.
摘要翻译：首先，提供基板并且在其上涂覆光致抗蚀剂层。然后，将具有图案的膜用作掩模，以进行用于图案化光致抗蚀剂层的曝光和显影处理。接下来，使用LIGA技术来形成具有与膜图案对应的图案的薄膜。

9. 发明申请

US20050083444A1 Liquid crystal display module 有权
标题翻译：液晶显示模块
公开(公告)号：US20050083444A1
公开(公告)日：2005-04-21
申请号：US10889385
申请日：2004-07-12
申请人： Hui-Chang Chen , Chin-Chen Yang
发明人： Hui-Chang Chen , Chin-Chen Yang
IPC分类号： G02F1/13 , G02F1/133 , G02F1/1333
CPC分类号： G02F1/1309 , G02F1/13452
摘要： A liquid crystal display module includes a substrate, one or more first leads, one or more shorting bars. one or more second leads and one or more cutting traces. The first leads and the shorting bars are disposed over the substrate. The shorting bars are adjacent to the first leads and electrically connected to the first leads via one or more connecting lines. The second leads are mounted with the first leads respectively and are electrically connected to the corresponding first leads. The cutting traces are used for electrically disconnecting the first leads from the shorting bars. A laser beam is used to cut off the connecting lines along the cutting trace after the liquid crystal display module has been tested, so that the short bar is electrically disconnected from the first leads, and a disconnecting point is formed on the intersection of the each cutting trace and connecting line.
摘要翻译：液晶显示模块包括基板，一个或多个第一引线，一个或多个短路棒。一个或多个第二引线和一个或多个切割迹线。第一引线和短路棒设置在基板上。短路棒与第一引线相邻，并经由一条或多条连接线与第一引线电连接。第二引线分别安装有第一引线并电连接到相应的第一引线。切割轨迹用于将第一引线与短路棒电断开。在测试液晶显示模块之后，使用激光束切断沿着切割轨迹的连接线，使得短条与第一引线电气断开，并且在每个线圈的交叉点上形成断开点切割跟踪和连接线。

10. 发明授权

US07575852B2 Method of optically transferring a pattern from a mask having advanced oriented assist features for integrated circuit hole patterns 有权
标题翻译：从具有用于集成电路孔图案的高级定向辅助特征的掩模光学转移图案的方法
公开(公告)号：US07575852B2
公开(公告)日：2009-08-18
申请号：US10923462
申请日：2004-08-20
申请人： Chin Chen Yang
发明人： Chin Chen Yang
IPC分类号： G03F7/20 , G03F1/14
CPC分类号： G03F1/36 , Y10T428/24802
摘要： An oriented assist feature is described that permits transferring of a lithographic pattern corresponding to an integrated circuit from a mask onto a semiconductor substrate. The oriented assist feature does not exhibit a forbidden pitch phenomenon, thereby providing a wide photo process window for a hole pattern.
摘要翻译：描述了一种定向辅助特征，其允许将对应于集成电路的光刻图案从掩模转移到半导体衬底上。定向辅助特征不显示禁止间距现象，从而为孔图案提供宽的照相处理窗口。

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