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    • 2. 发明申请
    • METHOD FOR DEPOSITING AN ENCAPSULATING FILM
    • 沉积膜的方法
    • WO2013123431A1
    • 2013-08-22
    • PCT/US2013/026492
    • 2013-02-15
    • APPLIED MATERIALS, INC.CHEN, Jrjyan JerryWON, Tae KyungPARK, Beom SooCHOI, Young JinCHOI, Soo Young
    • CHEN, Jrjyan JerryWON, Tae KyungPARK, Beom SooCHOI, Young JinCHOI, Soo Young
    • H01L51/56H05B33/10H05B33/04
    • H01L51/5256C23C16/26C23C16/345
    • A method and apparatus for depositing a material layer, such as encapsulating film, onto a substrate is described. In one embodiment, an encapsulating film formation method includes delivering a gas mixture into a processing chamber, the gas mixture comprising a silicone-containing gas, a first nitrogen-containing gas, a second nitrogen-containing gas and hydrogen gas; energizing the gas mixture within the processing chamber by applying between about 0.350 watts/cm2 to about 0.903 watts/cm2 to a gas distribution plate assembly spaced about 800 mils to about 1800 mils above a substrate positioned within the processing chamber; maintaining the energized gas mixture within the processing chamber at a pressure of between about 0.5 Torr to about 3.0 Torr; and depositing an inorganic encapsulating film on the substrate in the presence of the energized gas mixture. In other embodiments, an organic dielectric layer is sandwiched between inorganic encapsulating layers.
    • 描述了用于将材料层(例如封装膜)沉积到基底上的方法和装置。 在一个实施方案中,封装膜形成方法包括将气体混合物输送到处理室中,所述气体混合物包含含硅氧烷气体,第一含氮气体,第二含氮气体和氢气; 通过向位于处理室内的基板上方间隔约800密耳至约1800密耳的气体分配板组件施加约0.350瓦特/平方厘米至约0.903瓦特/平方厘米,对处理室内的气体混合物通电; 将加压气体混合物在处理室内保持在约0.5托至约3.0托之间的压力; 以及在通电的气体混合物的存在下在基底上沉积无机封装膜。 在其他实施例中,有机介电层夹在无机封装层之间。
    • 3. 发明申请
    • METHOD TO IMPROVE TRANSMITTANCE OF AN ENCAPSULATING FILM
    • 改进封装膜传输的方法
    • WO2007040798A3
    • 2009-05-07
    • PCT/US2006030304
    • 2006-08-02
    • APPLIED MATERIALS INCWON TAE KYUNGYADAV SANJAY
    • WON TAE KYUNGYADAV SANJAY
    • H01L21/20
    • C23C16/26C23C8/36C23C16/345C23C28/00C23C28/046C23C28/42H01L51/5256
    • A method for depositing a carbon-containing material layer onto a substrate includes delivering a mixture of precursors for the carbon-containing material layer into a process chamber, doping the carbon-containing material layer with silicon, and depositing the carbon-containing material layer at low temperature. In one aspect, improved light transmittance of the carbon-containing material layer at all wavelengths of a visible light spectrum is obtained. In addition, a method for depositing an encapsulating layer is provided for various display applications which require low temperature deposition process due to thermal instability of underlying materials used. The encapsulating layer may include one or more barrier layer material layers and one or more amorphous carbon material layers. The amorphous carbon material can be used to reduce thermal stress and prevent the deposited thin film from peeling off the substrate.
    • 将含碳材料层沉积在基材上的方法包括将含碳材料层的前体的混合物输送到处理室中,用硅掺杂含碳材料层,并将含碳材料层沉积在 低温。 在一个方面,获得了在可见光谱的所有波长处的含碳材料层的改进的透光率。 此外,由于所使用的下层材料的热不稳定性,提供了用于沉积封装层的方法用于需要低温沉积工艺的各种显示应用。 封装层可以包括一个或多个阻挡层材料层和一个或多个无定形碳材料层。 无定形碳材料可用于降低热应力并防止沉积的薄膜从基底上剥离。
    • 5. 发明申请
    • METHOD TO IMPROVE TRANSMITTANCE OF AN ENCAPSULATING FILM
    • 改进封装膜传输的方法
    • WO2007040798A2
    • 2007-04-12
    • PCT/US2006/030304
    • 2006-08-02
    • APPLIED MATERIALS, INC.WON, Tae KyungYADAV, Sanjay
    • WON, Tae KyungYADAV, Sanjay
    • C23C16/00H05H1/24
    • C23C16/26C23C8/36C23C16/345C23C28/00C23C28/046C23C28/42H01L51/5256
    • A method for depositing a carbon-containing material layer onto a substrate includes delivering a mixture of precursors for the carbon-containing material layer into a process chamber, doping the carbon-containing material layer with silicon, and depositing the carbon-containing material layer at low temperature. In one aspect, improved light transmittance of the carbon-containing material layer at all wavelengths of a visible light spectrum is obtained. In addition, a method for depositing an encapsulating layer is provided for various display applications which require low temperature deposition process due to thermal instability of underlying materials used. The encapsulating layer may include one or more barrier layer material layers and one or more amorphous carbon material layers. The amorphous carbon material can be used to reduce thermal stress and prevent the deposited thin film from peeling off the substrate.
    • 将含碳材料层沉积在基材上的方法包括将含碳材料层的前体的混合物输送到处理室中,用硅掺杂含碳材料层,并将含碳材料层沉积在 低温。 在一个方面,获得了在可见光谱的所有波长处的含碳材料层的改进的透光率。 此外,由于所使用的下层材料的热不稳定性,提供了用于沉积封装层的方法用于需要低温沉积工艺的各种显示应用。 封装层可以包括一个或多个阻挡层材料层和一个或多个无定形碳材料层。 无定形碳材料可用于降低热应力并防止沉积的薄膜从基底上剥离。