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    • 1. 发明授权
    • METHOD AND APPARATUS FOR DETECTING THE ENDPOINT OF A CHAMBER CLEANING
    • 方法和设备,用于确定FINISH点室清洁处理
    • EP1007762B1
    • 2005-06-29
    • EP98937245.3
    • 1998-07-29
    • AKT, Inc.Blonigan, Wendell T.Gardner, James T.
    • BLONIGAN, Wendell, T.GARDNER, James, T.
    • C23C16/44
    • C23C14/564C23C16/4405H01J37/32862H01J37/32963Y10S438/905
    • A method and apparatus for cleaning a CVD chamber including optoelectronic detection of the completion or endpoint of the cleaning procedure once a ratio of emission lines reaches a threshold value. The method comprises the steps of: providing a plasma of a cleaning gas into the chamber and creating a plasma from the cleaning gas. The intensity of emission lines of the cleaning gas and of at least one background gas in the chamber are monitored. A ratio of the intensity of the cleaning gas emission line to the intensity of the background gas emission line is determined and monitored as a function of time. The determined ratio is compared to a preset threshold calibration value. The flow of gas is controlled based on the comparing step. The apparatus includes a cleaning gas supply with a valved inlet providing an entrance to the interior of the chamber for passing cleaning gas to the interior of the chamber. A detector having an optical input is disposed for sensing the electromagnetic radiation. The detector has a first channel for detecting a relative intensity of an emission line corresponding to the cleaning gas and a second channel for detecting a relative intensity of the emission line corresponding to the background gases. Software or circuitry is employed to determine a normalized signal using a signal from the first channel and a signal from the second channel. The value of the normalized signal is substantially invariant with respect to simultaneous corresponding changes in the intensity of the signal measured by the first channel and the intensity of the signal measured by the second channel.
    • 2. 发明公开
    • RF MATCHING NETWORK WITH DISTRIBUTED OUTPUTS
    • 射频匹配网络与分布式输出
    • EP1095395A1
    • 2001-05-02
    • EP99932402.3
    • 1999-07-13
    • APPLIED KOMATSU TECHNOLOGY, INC.Blonigan, Wendell T.
    • BLONIGAN, Wendell, T.SORENSEN, Carl, A.
    • H01J37/32
    • H01J37/32174H01J37/32082
    • An apparatus for distributing RF power outputs to a first electrode in a parallel plate electrode system for generating plasma in depositing films on a substrate. A RF power output is applied to a distributed RF matching network to excite a plasma from a process gas stream to deposit a uniform film onto the substrate. The distributed matching network includes a load capacitor for receiving a radio frequency power input and an inductor having first and second ends with the first end coupled to the load capacitor. The matching network also includes multiple drive capacitors each of which couples the second end of the inductor to a different one of multiple points distributed on the first electrode. The capacitance of each drive capacitor is user-selectable, and the points on the backing plate to which the drive capacitors are coupled are user-selectable.
    • 一种用于将RF功率输出分配给平行板电极系统中的第一电极的装置,用于在衬底上沉积膜时产生等离子体。 RF功率输出被施加到分布式RF匹配网络以从工艺气流激发等离子体以将均匀的膜沉积到基板上。 分布式匹配网络包括用于接收射频功率输入的负载电容器和具有第一和第二端的电感器,其中第一端耦合到负载电容器。 匹配网络还包括多个驱动电容器,每个驱动电容器将电感器的第二端耦合到分布在第一电极上的多个点中的不同的一个。 每个驱动电容器的电容是用户可选择的,并且驱动电容器耦合到的背板上的点是用户可选择的。
    • 4. 发明公开
    • METHOD AND APPARATUS FOR DETECTING THE ENDPOINT OF A CHAMBER CLEANING
    • 方法和设备,用于确定FINISH点室清洁处理
    • EP1007762A1
    • 2000-06-14
    • EP98937245.3
    • 1998-07-29
    • APPLIED KOMATSU TECHNOLOGY, INC.Blonigan, Wendell T.Gardner, James T.
    • BLONIGAN, Wendell, T.GARDNER, James, T.
    • C23C16/44
    • C23C14/564C23C16/4405H01J37/32862H01J37/32963Y10S438/905
    • A method and apparatus for cleaning a CVD chamber including optoelectronic detection of the completion or endpoint of the cleaning procedure once a ratio of emission lines reaches a threshold value. The method comprises the steps of: providing a plasma of a cleaning gas into the chamber and creating a plasma from the cleaning gas. The intensity of emission lines of the cleaning gas and of at least one background gas in the chamber are monitored. A ratio of the intensity of the cleaning gas emission line to the intensity of the background gas emission line is determined and monitored as a function of time. The determined ratio is compared to a preset threshold calibration value. The flow of gas is controlled based on the comparing step. The apparatus includes a cleaning gas supply with a valved inlet providing an entrance to the interior of the chamber for passing cleaning gas to the interior of the chamber. A detector having an optical input is disposed for sensing the electromagnetic radiation. The detector has a first channel for detecting a relative intensity of an emission line corresponding to the cleaning gas and a second channel for detecting a relative intensity of the emission line corresponding to the background gases. Software or circuitry is employed to determine a normalized signal using a signal from the first channel and a signal from the second channel. The value of the normalized signal is substantially invariant with respect to simultaneous corresponding changes in the intensity of the signal measured by the first channel and the intensity of the signal measured by the second channel.
    • 5. 发明专利
    • DE69830730D1
    • 2005-08-04
    • DE69830730
    • 1998-07-29
    • AKT INCBLONIGAN WENDELL TGARDNER JAMES T
    • BLONIGAN TGARDNER T
    • H01L21/205C23C14/56C23C16/44H01J37/32
    • A method and apparatus for cleaning a CVD chamber including optoelectronic detection of the completion or endpoint of the cleaning procedure once a ratio of emission lines reaches a threshold value. The method comprises the steps of: providing a plasma of a cleaning gas into the chamber and creating a plasma from the cleaning gas. The intensity of emission lines of the cleaning gas and of at least one background gas in the chamber are monitored. A ratio of the intensity of the cleaning gas emission line to the intensity of the background gas emission line is determined and monitored as a function of time. The determined ratio is compared to a preset threshold calibration value. The flow of gas is controlled based on the comparing step. The apparatus includes a cleaning gas supply with a valved inlet providing an entrance to the interior of the chamber for passing cleaning gas to the interior of the chamber. A detector having an optical input is disposed for sensing the electromagnetic radiation. The detector has a first channel for detecting a relative intensity of an emission line corresponding to the cleaning gas and a second channel for detecting a relative intensity of the emission line corresponding to the background gases. Software or circuitry is employed to determine a normalized signal using a signal from the first channel and a signal from the second channel. The value of the normalized signal is substantially invariant with respect to simultaneous corresponding changes in the intensity of the signal measured by the first channel and the intensity of the signal measured by the second channel.
    • 6. 发明专利
    • DE69830730T2
    • 2006-05-04
    • DE69830730
    • 1998-07-29
    • AKT INCBLONIGAN WENDELL TGARDNER JAMES T
    • BLONIGAN TGARDNER T
    • C23C16/44H01L21/205C23C14/56H01J37/32
    • A method and apparatus for cleaning a CVD chamber including optoelectronic detection of the completion or endpoint of the cleaning procedure once a ratio of emission lines reaches a threshold value. The method comprises the steps of: providing a plasma of a cleaning gas into the chamber and creating a plasma from the cleaning gas. The intensity of emission lines of the cleaning gas and of at least one background gas in the chamber are monitored. A ratio of the intensity of the cleaning gas emission line to the intensity of the background gas emission line is determined and monitored as a function of time. The determined ratio is compared to a preset threshold calibration value. The flow of gas is controlled based on the comparing step. The apparatus includes a cleaning gas supply with a valved inlet providing an entrance to the interior of the chamber for passing cleaning gas to the interior of the chamber. A detector having an optical input is disposed for sensing the electromagnetic radiation. The detector has a first channel for detecting a relative intensity of an emission line corresponding to the cleaning gas and a second channel for detecting a relative intensity of the emission line corresponding to the background gases. Software or circuitry is employed to determine a normalized signal using a signal from the first channel and a signal from the second channel. The value of the normalized signal is substantially invariant with respect to simultaneous corresponding changes in the intensity of the signal measured by the first channel and the intensity of the signal measured by the second channel.
    • 7. 发明申请
    • LINEAR VACUUM DEPOSITION SYSTEM
    • 线性真空沉积系统
    • WO2006135464B1
    • 2007-02-15
    • PCT/US2006009090
    • 2006-03-14
    • APPLIED MATERIALS INCBLONIGAN WENDELL TWHITE JOHN M
    • BLONIGAN WENDELL TWHITE JOHN M
    • H01L21/677
    • H01L21/67706B65G49/064B65G2249/04B65G2249/045C03C17/002C23C14/56C23C16/54H01L21/67709H01L21/67715H01L21/67736H01L21/6776
    • Embodiments of a vacuum conveyor system are provided herein. In one embodiment a vacuum conveyor system includes a first vacuum sleeve having a plurality of rollers that support and move substrates through the first vacuum sleeve. A port is provided for sealably coupling the first vacuum sleeve to a process chamber. A first substrate handler is disposed proximate the port. Multiple ports may be provided for sealably coupling the first vacuum sleeve to a plurality of process chambers. A dedicated substrate handler is provided for each process chamber. A second vacuum sleeve may be sealably coupled to an opposing side of the process chambers. The vacuum conveyor system may be modular with independent modules linked via load lock chambers. The plurality of rollers may compensate for any sag of the leading edge of a substrate being transported thereupon.
    • 本文提供了真空输送系统的实施例。 在一个实施例中,真空输送系统包括具有支撑并移动基板通过第一真空套筒的多个辊的第一真空套筒。 提供端口用于将第一真空套筒密封地联接到处理室。 第一衬底处理器设置在端口附近。 可以提供多个端口用于将第一真空套管密封地联接到多个处理室。 为每个处理室提供专用的基板处理器。 第二真空套筒可以密封地联接到处理室的相对侧。 真空输送系统可以是模块化的,具有通过负载锁定室连接的独立模块。 多个辊可以补偿在其上运送的基板的前缘的任何下垂。
    • 10. 发明申请
    • LARGE SUBSTRATE TEST SYSTEM
    • 大型基板测试系统
    • WO2006014794A1
    • 2006-02-09
    • PCT/US2005/025999
    • 2005-07-21
    • APPLIED MATERIALS, INC.BRUNNER, MatthiasKURITA, ShinichiBLONIGAN, Wendell, T.KEHRBERG, Edgar
    • BRUNNER, MatthiasKURITA, ShinichiBLONIGAN, Wendell, T.KEHRBERG, Edgar
    • G01R31/305
    • H01J37/185G01R31/2886H01J2237/204
    • A method and system (100) for testing one or more large substrate (350) are provided. In one or more embodiments, the system (100) includes a testing chamber (400) having a substrate table (550) disposed therein. The substrate table (550) is adapted to move a substrate (350) within the testing chamber (400) in various directions. More particularly, the substrate table (550) includes a first stage (555) movable in a first direction, and a second stage (560) movable in a second direction, wherein each of the stages (555, 560) moves in an X-direction, Y-direction or both X and Y directions. The system (100) further includes a load lock chamber (200) at least partially disposed below the testing chamber (400), and a transfer chamber (300) coupled to the load lock chamber (200) and the testing chamber (400). In one or more embodiments, the transfer chamber (300) includes a robot (310) disposed therein which is adapted to transfer substrates (350) between the load lock chamber (200) and the testing chamber (400).
    • 提供了一种用于测试一个或多个大衬底(350)的方法和系统(100)。 在一个或多个实施例中,系统(100)包括具有设置在其中的衬底台(550)的测试室(400)。 衬底台(550)适于沿着各个方向移动测试室(400)内的衬底(350)。 更具体地,衬底台(550)包括可沿第一方向移动的第一级(555)和可沿第二方向移动的第二级(560),其中每个级(555,560) 方向,Y方向,X方向和Y方向。 系统(100)还包括至少部分地设置在测试室(400)下方的负载锁定室(200)和耦合到负载锁定室(200)和测试室(400)的传送室(300)。 在一个或多个实施例中,传送室(300)包括设置在其中的机器人(310),其适于在载荷锁定室(200)和测试室(400)之间传送基板(350)。