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1. 发明申请

US20060043422A1 Transistor structure with stress modification and capacitive reduction feature in a width direction and method thereof 有权
标题翻译：具有应力改变和宽度方向的电容减小特性的晶体管结构及其方法
公开(公告)号：US20060043422A1
公开(公告)日：2006-03-02
申请号：US10925084
申请日：2004-08-24
申请人： Jian Chen , Michael Mendicino , Vance Adams , Choh-Fei Yeap , Venkat Kolagunta
发明人： Jian Chen , Michael Mendicino , Vance Adams , Choh-Fei Yeap , Venkat Kolagunta
IPC分类号： H01L29/76 , H01L31/113
CPC分类号： H01L29/7843 , H01L21/823807 , H01L21/823814 , H01L21/823828
摘要： A transistor comprises a source and drain positioned within an active region. A gate overlies a channel area of the active region, wherein the channel region separates the source and drain. The transistor further comprises at least one stress modifier and capacitive reduction feature extending from the source to the drain and underlying the gate for reducing capacitance associated with the gate, source and drain. The at least one stress modifier and capacitive reduction feature comprises dielectric and includes a shape defined at least partially by the active region.
摘要翻译：晶体管包括位于有源区域内的源极和漏极。栅极覆盖有源区的沟道区，其中沟道区分离源极和漏极。晶体管还包括至少一个应力调节器和电容降低特征，其从源极延伸到漏极并且在栅极下方，用于减小与栅极，源极和漏极相关联的电容。所述至少一个应力调节剂和电容还原特征包括电介质并且包括至少部分地由有源区限定的形状。

2. 发明申请

US20050190421A1 Integrated circuit with multiple spacer insulating region widths 有权
标题翻译：具有多个间隔绝缘区域宽度的集成电路
公开(公告)号：US20050190421A1
公开(公告)日：2005-09-01
申请号：US10790420
申请日：2004-03-01
申请人： Jian Chen , Vance Adams , Choh-Fei Yeap
发明人： Jian Chen , Vance Adams , Choh-Fei Yeap
IPC分类号： G02B26/08 , H01L21/84 , H01L27/12
CPC分类号： H01L21/823864 , H01L21/823814 , H01L21/84 , H01L27/1203
摘要： An integrated circuit with both P-channel transistors (823) and N-channel transistors (821) with different spacer insulating region widths. In one example, the outer sidewall spacer (321) of the N-channel transistors is removed while the P-channel regions (115) are masked such that the spacer insulating region widths of the N-channel transistors is less than the spacer insulating region widths of the P-channel transistors. Also, the drain/source silicide regions (805) of the N-channel transistors are located closer to the gates (117) of those transistors than the P-channel source/drain suicide regions (809) are located to the gates (119) of those transistors. Providing the P-channel transistors with greater spacer insulating widths and greater distances between the source/drain silicide regions and gates may increase the relative compressive stress of the channel region of the P-channel transistors relative the stress of the channel region of the N-channel transistors, thereby increasing the performance of the P-channel transistors.
摘要翻译：具有不同间隔绝缘区宽度的具有P沟道晶体管（823）和N沟道晶体管（821）的集成电路。在一个示例中，除去N沟道晶体管的外侧壁间隔物（321），同时P沟道区域（115）被掩蔽，使得N沟道晶体管的间隔绝缘区域宽度小于间隔绝缘区域 P沟道晶体管的宽度。此外，N沟道晶体管的漏极/源极硅化物区域（805）位于比P沟道源极/漏极硅化物区域（809）位于栅极（119）处更靠近那些晶体管的栅极（117）的晶体管。在源/漏硅化物区域和栅极之间提供具有较大间隔绝缘宽度和较大距离的P沟道晶体管可以增加P沟道晶体管的沟道区相对于N沟道晶体管的沟道区的应力的相对压缩应力，通道晶体管，从而增加P沟道晶体管的性能。

3. 发明申请

US20070202651A1 Semiconductor process integrating source/drain stressors and interlevel dielectric layer stressors 失效
标题翻译：集成源极/漏极应力和半导体介电层应力的半导体工艺
公开(公告)号：US20070202651A1
公开(公告)日：2007-08-30
申请号：US11361171
申请日：2006-02-24
申请人： Da Zhang , Vance Adams , Bich-Yen Nguyen , Paul Grudowski
发明人： Da Zhang , Vance Adams , Bich-Yen Nguyen , Paul Grudowski
IPC分类号： H01L21/336
CPC分类号： H01L29/7846 , H01L29/165 , H01L29/66636 , H01L29/66772 , H01L29/7843 , H01L29/7848 , H01L29/78654
摘要： A semiconductor fabrication process includes forming isolation structures on either side of a transistor region, forming a gate structure overlying the transistor region, removing source/drain regions to form source/drain recesses, removing portions of the isolation structures to form recessed isolation structures, and filling the source/drain recesses with a source/drain stressor such as an epitaxially formed semiconductor. A lower surface of the source/drain recess is preferably deeper than an upper surface of the recessed isolation structure by approximately 10 to 30 nm. Filling the source/drain recesses may precede or follow forming the recessed isolation structures. An ILD stressor is then deposited over the transistor region such that the ILD stressor is adjacent to sidewalls of the source/drain structure thereby coupling the ILD stressor to the source/drain stressor. The ILD stressor is preferably compressive or tensile silicon nitride and the source/drain structure is preferably silicon germanium or silicon carbon.
摘要翻译：半导体制造工艺包括在晶体管区域的任一侧上形成隔离结构，形成覆盖晶体管区域的栅极结构，去除源极/漏极区域以形成源极/漏极凹部，去除隔离结构的部分以形成凹入的隔离结构;以及用诸如外延形成的半导体的源极/漏极应力源填充源/漏极凹部。源极/漏极凹部的下表面优选比凹入的隔离结构的上表面深大约10至30nm。填充源极/漏极凹部可以在形成凹入的隔离结构之前或之后。然后将ILD应激源沉积在晶体管区域上，使得ILD应力源与源极/漏极结构的侧壁相邻，从而将ILD应激源耦合到源极/漏极应力源。 ILD应力器优选为压缩或拉伸氮化硅，并且源极/漏极结构优选为硅锗或硅碳。

4. 发明申请

US20060240650A1 Semiconductor device having a plurality of different layers and method therefor 有权
标题翻译：具有多个不同层的半导体器件及其方法
公开(公告)号：US20060240650A1
公开(公告)日：2006-10-26
申请号：US11111451
申请日：2005-04-21
申请人： Marius Orlowski , Vance Adams
发明人： Marius Orlowski , Vance Adams
IPC分类号： H01L21/425 , H01L29/768 , H01L27/148 , H01L29/74
CPC分类号： H01L21/84 , H01L21/823807 , H01L21/823878 , H01L27/1203 , H01L29/165 , H01L29/78 , H01L29/7846 , H01L29/7848
摘要： Mechanical stress control may be achieved using materials having selected elastic moduli. These materials may be selectively formed by implantation, may be provided as a plurality of buried layers interposed between the substrate and the active area, and may be formed by replacing selected portions of one or more buried layers. Any one or more of these methods may be used in combination. Mechanical stress control may be useful in the channel region of a semiconductor device to maximize its performance. In addition, these same techniques and structures may be used for other purposes besides mechanical stress control.
摘要翻译：可以使用具有选定的弹性模量的材料实现机械应力控制。这些材料可以通过注入选择性地形成，可以设置为插入在基板和有源区域之间的多个掩埋层，并且可以通过替换一个或多个掩埋层的选定部分来形成。这些方法中的任何一种或多种可以组合使用。机械应力控制在半导体器件的通道区域中可能是有用的，以使其性能最大化。此外，除了机械应力控制之外，这些相同的技术和结构可以用于其它目的。

5. 发明申请

US20060166492A1 Semiconductor fabrication process employing stress inducing source drain structures with graded impurity concentration 有权
标题翻译：采用具有渐变杂质浓度的应力诱导源极漏极结构的半导体制造工艺
公开(公告)号：US20060166492A1
公开(公告)日：2006-07-27
申请号：US11043577
申请日：2005-01-26
申请人： Marius Orlowski , Vance Adams , Chun-Li Liu , Matthew Stoker
发明人： Marius Orlowski , Vance Adams , Chun-Li Liu , Matthew Stoker
IPC分类号： H01L21/4763
CPC分类号： H01L29/66545 , H01L21/28061 , H01L21/823807 , H01L21/823814 , H01L29/165 , H01L29/665 , H01L29/6656 , H01L29/66636 , H01L29/7833 , H01L29/7834 , H01L29/7848
摘要： A semiconductor fabrication process has recessed stress-inducing source/drain (SISD) structures that are formed using a multiple phase formation process. The SISD structures are semiconductor structures having a lattice constant that differs from a lattice constant of the semiconductor substrate in which the source/drain structures are recessed. The SISD structures preferably include semiconductor compound having a first element (e.g., silicon) and a second element (e.g., germanium or carbon). The SISD structure has a composition gradient wherein the percentage of the second element varies from the upper surface of the source/drain structure to a lower surface of the SISD structure. The SISD structure may include a first layer with a first composition of the semiconductor compound underlying a second layer with a second composition of the semiconductor compound. The second layer may include an impurity and have a higher percentage of the second element that the first layer.
摘要翻译：半导体制造工艺具有使用多相形成工艺形成的凹陷的应力诱导源极/漏极（SISD）结构。 SISD结构是具有不同于源/漏结构凹陷的半导体衬底的晶格常数的晶格常数的半导体结构。 SISD结构优选包括具有第一元素（例如硅）和第二元素（例如锗或碳）的半导体化合物。 SISD结构具有组成梯度，其中第二元素的百分比从源极/漏极结构的上表面到SISD结构的下表面变化。 SISD结构可以包括具有半导体化合物的第一组成的第一层，位于第二层下面，半导体化合物的第二组成。第二层可以包括杂质，并且具有比第一层更高百分比的第二元素。

6. 发明申请

US20060043498A1 Method and apparatus for performance enhancement in an asymmetrical semiconductor device 有权
标题翻译：用于不对称半导体器件中的性能增强的方法和装置
公开(公告)号：US20060043498A1
公开(公告)日：2006-03-02
申请号：US10924650
申请日：2004-08-24
申请人： Marius Orlowski , Vance Adams , Chun-Li Liu , Brian Winstead
发明人： Marius Orlowski , Vance Adams , Chun-Li Liu , Brian Winstead
IPC分类号： H01L29/76
CPC分类号： H01L29/0847 , H01L29/66636 , H01L29/66659 , H01L29/7835
摘要： A method and apparatus is presented that provides performance enhancement in a semiconductor device. In one embodiment, a first current region (64, 76, 23), a channel region and a second current region (75, 33, 66) are adjacent each other. The second current region (75, 33, 66) has a content of a first element of an alloy greater than a content of the first element in the first current region (64, 76, 23), wherein the second current region (75, 33, 66) has a content of the first element greater than a content of the first element in the channel region, the alloy further comprises a second element, the first element has a first valence number, and the second element has a second valence number. Furthermore, the sum of the first valence number and the second valence number is eight.
摘要翻译：提出了一种在半导体器件中提供性能增强的方法和装置。在一个实施例中，第一电流区域（64,76,23），沟道区域和第二电流区域（75,33,66）彼此相邻。第二电流区域（75,33,66）具有比第一电流区域（64,76,23）中的第一元件的含量大的合金的第一元素的含量，其中第二电流区域（75，所述第一元件的含量大于所述沟道区域中的所述第一元素的含量，所述合金还包括第二元素，所述第一元素具有第一价数，并且所述第二元素具有第二价数。此外，第一价数和第二价数之和为八。

7. 发明申请

US20070148894A1 SEMICONDUCTOR DEVICE AND METHOD FOR REGIONAL STRESS CONTROL 审中-公开
标题翻译：用于区域应力控制的半导体器件和方法
公开(公告)号：US20070148894A1
公开(公告)日：2007-06-28
申请号：US11682579
申请日：2007-03-06
申请人： Marius Orlowski , Vance Adams
发明人： Marius Orlowski , Vance Adams
IPC分类号： H01L21/331
CPC分类号： H01L27/1203 , H01L21/84 , H01L21/86 , H01L29/7846
摘要： Mechanical stress control may be achieved using materials having selected elastic moduli. These materials may be selectively formed by implantation, may be provided as a plurality of buried layers interposed between the substrate and the active area, and may be formed by replacing selected portions of one or more buried layers. Any one or more of these methods may be used in combination. Mechanical stress control may be useful in the channel region of a semiconductor device to maximize its performance. In addition, these same techniques and structures may be used for other purposes besides mechanical stress control.
摘要翻译：可以使用具有选定的弹性模量的材料实现机械应力控制。这些材料可以通过注入选择性地形成，可以设置为插入在基板和有源区域之间的多个掩埋层，并且可以通过替换一个或多个掩埋层的选定部分来形成。这些方法中的任何一种或多种可以组合使用。机械应力控制在半导体器件的通道区域中可能是有用的，以使其性能最大化。此外，除了机械应力控制之外，这些相同的技术和结构可以用于其它目的。

8. 发明申请

US20060240609A1 Semiconductor device and method for regional stress control 有权
标题翻译：用于区域应力控制的半导体器件和方法
公开(公告)号：US20060240609A1
公开(公告)日：2006-10-26
申请号：US11111450
申请日：2005-04-21
申请人： Marius Orlowski , Vance Adams
发明人： Marius Orlowski , Vance Adams
IPC分类号： H01L21/8234 , H01L21/336
CPC分类号： H01L27/1203 , H01L21/84 , H01L21/86 , H01L29/7846
摘要： Mechanical stress control may be achieved using materials having selected elastic moduli. These materials may be selectively formed by implantation, may be provided as a plurality of buried layers interposed between the substrate and the active area, and may be formed by replacing selected portions of one or more buried layers. Any one or more of these methods may be used in combination. Mechanical stress control may be useful in the channel region of a semiconductor device to maximize its performance. In addition, these same techniques and structures may be used for other purposes besides mechanical stress control.
摘要翻译：可以使用具有选定的弹性模量的材料实现机械应力控制。这些材料可以通过注入选择性地形成，可以设置为插入在基板和有源区域之间的多个掩埋层，并且可以通过替换一个或多个掩埋层的选定部分来形成。这些方法中的任何一种或多种可以组合使用。机械应力控制在半导体器件的通道区域中可能是有用的，以使其性能最大化。此外，除了机械应力控制之外，这些相同的技术和结构可以用于其它目的。

9. 发明申请

US20060043500A1 Transistor structure with stress modification and capacitive reduction feature in a channel direction and method thereof 审中-公开
标题翻译：具有应力改变和通道方向的电容降低特性的晶体管结构及其方法
公开(公告)号：US20060043500A1
公开(公告)日：2006-03-02
申请号：US10925057
申请日：2004-08-24
申请人： Jian Chen , Michael Mendicino , Vance Adams , Choh-Fei Yeap , Venkat Kolagunta
发明人： Jian Chen , Michael Mendicino , Vance Adams , Choh-Fei Yeap , Venkat Kolagunta
IPC分类号： H01L29/76 , H01L29/94
CPC分类号： H01L29/78 , H01L29/7843
摘要： A transistor comprises an active region having a periphery with opposing sides and a source and a drain positioned within the active region. A gate overlies a channel area of the active region, the channel region separating the source and drain. The transistor further includes at least one stress modifying feature extending from an edge of the active region on at least one of a source side or a drain side and toward the channel area but not entering the channel area. The at least one stress modifying feature includes a dielectric.
摘要翻译：晶体管包括具有相对侧边缘的有源区和位于有源区内的源极和漏极。 A栅极覆盖有源区的沟道区，沟道区分离源极和漏极。晶体管还包括至少一个应力调整特征，其从源极侧或漏极侧中的至少一个上方的有源区域的边缘延伸并且朝向沟道区域而不进入沟道区域。所述至少一个应力改变特征包括电介质。

10. 发明申请

US20070249127A1 Electronic device including a semiconductor layer and a sidewall spacer and a process of forming the same 审中-公开
标题翻译：包括半导体层和侧壁间隔物的电子器件及其制造方法
公开(公告)号：US20070249127A1
公开(公告)日：2007-10-25
申请号：US11409882
申请日：2006-04-24
申请人： Rode Mora , Vance Adams , Venkat Kolagunta , Michael Turner , Toni Van Gompel
发明人： Rode Mora , Vance Adams , Venkat Kolagunta , Michael Turner , Toni Van Gompel
IPC分类号： H01L21/336 , H01L27/12
CPC分类号： H01L21/84 , H01L27/1203
摘要： An electronic device can include a substrate, an insulating layer, and a semiconductor layer overlying the insulating layer, wherein the insulating layer lies between the substrate and the semiconductor layer. In one aspect, a process of forming the electronic device can include patterning the semiconductor layer to define an opening extending to the insulating layer. The semiconductor layer has a sidewall and a surface, the surface is spaced apart from the insulating layer, and the sidewall extends from the surface towards the insulating layer. The process can also include forming a sidewall spacer adjacent to the sidewall, wherein the sidewall spacer lies within the opening and adjacent to the sidewall, and is spaced apart from the surface. In another aspect, the electronic device can include a field isolation region including the sidewall spacer.
摘要翻译：电子器件可以包括衬底，绝缘层和覆盖绝缘层的半导体层，其中绝缘层位于衬底和半导体层之间。一方面，形成电子器件的工艺可以包括图案化半导体层以限定延伸到绝缘层的开口。半导体层具有侧壁和表面，表面与绝缘层间隔开，并且侧壁从表面向绝缘层延伸。该方法还可以包括形成邻近侧壁的侧壁间隔物，其中侧壁间隔物位于开口内且与侧壁相邻并且与表面间隔开。在另一方面，电子设备可以包括包括侧壁间隔物的场隔离区域。

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