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1. 发明授权

US08499613B2 Integrated chemical sensor for detecting odorous matters 有权
标题翻译：用于检测气味物质的集成化学传感器
公开(公告)号：US08499613B2
公开(公告)日：2013-08-06
申请号：US13016086
申请日：2011-01-28
申请人： Federico Giovanni Ziglioli , Amedeo Maierna , Flavio Francesco Villa , Ubaldo Mastromatteo , Gabriele Barlocchi
发明人： Federico Giovanni Ziglioli , Amedeo Maierna , Flavio Francesco Villa , Ubaldo Mastromatteo , Gabriele Barlocchi
IPC分类号： G01N7/04
CPC分类号： G01N33/0009
摘要： A cartridge-like chemical sensor is formed by a housing having a base and a cover fixed to the base and provided with an input opening, an output hole and a channel for a gas to be analyzed. The channel extends in the cover between the input opening and the output hole and faces a printed circuit board carrying an integrated circuit having a sensitive region open toward the channel and of a material capable to bind with target chemicals in the gas to be analyzed. A fan is arranged in the housing, downstream of the integrated device, for sucking the gas after being analyzed, and is part of a thermal control system for the integrated circuit.
摘要翻译：盒式化学传感器由壳体形成，壳体具有固定到基座的基部和盖，并且设置有用于待分析气体的输入开口，输出孔和通道。通道在输入开口和输出孔之间的盖中延伸，并且面向承载具有朝向通道开口的敏感区域的集成电路的印刷电路板和能够与要分析的气体中的目标化学物质结合的材料。在集成装置的下游的壳体内设置风扇，用于在分析后吸入气体，并且是集成电路的热控制系统的一部分。

2. 发明授权

US08466599B2 Electrostatic micromotor with stator and rotor in contact, in particular for probe-storage systems 有权
标题翻译：静电微电机与定子和转子接触，特别是探针存储系统
公开(公告)号：US08466599B2
公开(公告)日：2013-06-18
申请号：US12533850
申请日：2009-07-31
申请人： Ubaldo Mastromatteo , Bruno Murari , Giulio Ricotti , Marco Marchesi
发明人： Ubaldo Mastromatteo , Bruno Murari , Giulio Ricotti , Marco Marchesi
IPC分类号： H02N1/00
CPC分类号： H02N1/004
摘要： In an electrostatic micromotor, a mobile substrate faces a fixed substrate and is suspended over the fixed substrate at a given distance of separation in an operative resting condition; an actuation unit is configured so as to give rise to a relative movement of the mobile substrate with respect to the fixed substrate in a direction of movement during an operative condition of actuation. The actuation unit is also configured so as to bring the mobile substrate and the fixed substrate substantially into contact and to keep them in contact during the operative condition of actuation. The electrostatic micromotor is provided with an electronic unit for reducing friction, configured so as to reduce a friction generated by the contact between the rotor substrate and the stator substrate during the relative movement.
摘要翻译：在静电微电机中，移动基板面向固定的基板并且在操作的静止状态下以给定的分离距离悬挂在固定的基板上; 致动单元被构造成在致动的操作状态期间在移动方向上相对于固定基板产生相对移动。致动单元还构造成使得移动基板和固定基板在操作的操作状态下基本接触并保持它们接触。静电微电机设置有用于减少摩擦的电子单元，其被配置为在相对运动期间减小由转子基板和定子基板之间的接触产生的摩擦。

3. 发明授权

US07687301B2 Integrated device manufacturing process 有权
标题翻译：集成器件制造工艺
公开(公告)号：US07687301B2
公开(公告)日：2010-03-30
申请号：US12015271
申请日：2008-01-16
申请人： Francesco Martini , Maurizio Lenzi , Ubaldo Mastromatteo
发明人： Francesco Martini , Maurizio Lenzi , Ubaldo Mastromatteo
IPC分类号： H01L21/00
CPC分类号： G02B6/4214 , G02B6/136 , G02B6/4202
摘要： A process for manufacturing an integrated device includes the steps of: providing a silicon substrate on which a silicon dioxide structure is arranged and forming a trench having first and second essentially vertical walls relative to the substrate in the structure by means of anisotropic-type etching. A concavity having a sloped wall relative to the substrate is formed by isotropic-type etching which removes the second wall so that the concavity is open to the trench and the sloped wall faces the first wall.
摘要翻译：一种用于制造集成器件的工艺包括以下步骤：提供硅衬底，在衬底上布置二氧化硅结构，并通过各向异性蚀刻形成具有相对于衬底的第一和第二基本上垂直的壁的沟槽。通过各向同性型蚀刻形成具有相对于基板的倾斜壁的凹面，其移除第二壁，使得凹部对沟槽开放，并且倾斜壁面向第一壁。

4. 发明申请

US20100026138A1 ELECTROSTATIC MICROMOTOR WITH STATOR AND ROTOR IN CONTACT, IN PARTICULAR FOR PROBE-STORAGE SYSTEMS 有权
标题翻译：具有定子和转子接触的静电微型电动机，特别是探针存储系统
公开(公告)号：US20100026138A1
公开(公告)日：2010-02-04
申请号：US12533850
申请日：2009-07-31
申请人： Ubaldo Mastromatteo , Bruno Murari , Giulio Ricotti , Marco Marchesi
发明人： Ubaldo Mastromatteo , Bruno Murari , Giulio Ricotti , Marco Marchesi
IPC分类号： H02N11/00
CPC分类号： H02N1/004
摘要： In an electrostatic micromotor, a mobile substrate faces a fixed substrate and is suspended over the fixed substrate at a given distance of separation in an operative resting condition; an actuation unit is configured so as to give rise to a relative movement of the mobile substrate with respect to the fixed substrate in a direction of movement during an operative condition of actuation. The actuation unit is also configured so as to bring the mobile substrate and the fixed substrate substantially into contact and to keep them in contact during the operative condition of actuation. The electrostatic micromotor is provided with an electronic unit for reducing friction, configured so as to reduce a friction generated by the contact between the rotor substrate and the stator substrate during the relative movement.
摘要翻译：在静电微电机中，移动基板面向固定的基板并且在操作的静止状态下以给定的分离距离悬挂在固定的基板上; 致动单元被构造成在致动的操作状态期间在移动方向上相对于固定基板产生相对移动。致动单元还构造成使得移动基板和固定基板在操作的操作状态下基本接触并保持它们接触。静电微电机设置有用于减少摩擦的电子单元，其被配置为在相对运动期间减小由转子基板和定子基板之间的接触产生的摩擦。

5. 发明申请

US20100026137A1 SILICON ELECTROSTATIC MICROMOTOR WITH INDENTATIONS, IN PARTICULAR FOR PROBE-STORAGE SYSTEMS 有权
标题翻译：具有指示性，特别是探针存储系统的硅电极微型电机
公开(公告)号：US20100026137A1
公开(公告)日：2010-02-04
申请号：US12533835
申请日：2009-07-31
申请人： Bruno Murari , Ubaldo Mastromatteo , Giulio Ricotti
发明人： Bruno Murari , Ubaldo Mastromatteo , Giulio Ricotti
IPC分类号： H02N11/00
CPC分类号： H02N1/004
摘要： In an electrostatic micromotor, a mobile substrate faces a fixed substrate, and electrostatic-interaction elements are provided to allow a relative movement of the mobile substrate with respect to the fixed substrate in a direction of movement. The electrostatic-interaction elements include electrodes arranged on a facing surface of the fixed substrate (2) facing the mobile substrate. The mobile substrate has indentations, which extend within the mobile substrate starting from a respective facing surface that faces the fixed substrate and define between them projections staggered with respect to the electrodes in the direction of movement. Side walls of the indentations have a first distance of separation at the respective facing surface, and a second distance of separation, greater than the first distance of separation, at an internal region of the indentations.
摘要翻译：在静电微电机中，移动衬底面向固定衬底，并且提供静电相互作用元件以允许移动衬底相对于固定衬底在移动方向上的相对移动。静电相互作用元件包括布置在面向移动基板的固定基板（2）的面对表面上的电极。移动基板具有凹槽，其从移动基板的相对面朝向固定基板开始并且在它们之间限定在移动方向上相对于电极交错的凸起之间延伸的移动基板。凹陷的侧壁在相应的相对表面处具有第一分离距离，并且在凹陷的内部区域处具有大于分离距离的第二距离。

6. 发明授权

US07432587B2 Integrated device including connections on a separate wafer 有权
标题翻译：集成设备，包括单独晶片上的连接
公开(公告)号：US07432587B2
公开(公告)日：2008-10-07
申请号：US11005832
申请日：2004-12-07
申请人： Ubaldo Mastromatteo
发明人： Ubaldo Mastromatteo
IPC分类号： H01L23/02 , H01L23/48
CPC分类号： B81C1/00238 , B81C2201/019 , H01L24/81 , H01L25/50 , H01L2224/05568 , H01L2224/05573 , H01L2224/13144 , H01L2224/45144 , H01L2224/81801 , H01L2224/81894 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/14 , H01L2924/00 , H01L2224/05655 , H01L2924/00014 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/05684
摘要： An integrated semiconductor device includes semiconductor regions and isolation regions in a first wafer of semiconductor material, and, on a second wafer of semiconductor material, interconnection structures. Plug elements provide electrical and mechanical coupling between the first and second wafers. Each plug element includes a first region coupled to the first wafer and a second region formed of a selected metal bonded with the semiconductor regions of the first wafer, forming a metal silicide.
摘要翻译：集成半导体器件包括半导体材料的第一晶片中的半导体区域和隔离区域，以及在第二半导体材料晶片上的互连结构。插头元件提供第一和第二晶片之间的电气和机械耦合。每个插头元件包括耦合到第一晶片的第一区域和由与第一晶片的半导体区域接合的选定金属形成的第二区域，形成金属硅化物。

7. 发明申请

US20070254454A1 PROCESS FOR BONDING AND ELECTRICALLY CONNECTING MICROSYSTEMS INTEGRATED IN SEVERAL DISTINCT SUBSTRATES 有权
标题翻译：用于结合和电连接集成在几个不同基板中的微结构的方法
公开(公告)号：US20070254454A1
公开(公告)日：2007-11-01
申请号：US11766654
申请日：2007-06-21
申请人： Ubaldo Mastromatteo , Mauro Bombonati , Daniela Morin , Marta Mottura , Mauro Marchi
发明人： Ubaldo Mastromatteo , Mauro Bombonati , Daniela Morin , Marta Mottura , Mauro Marchi
IPC分类号： H01L21/46
CPC分类号： B81C1/00269 , H01L21/185 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/81 , H01L24/94 , H01L2224/0231 , H01L2224/02313 , H01L2224/0401 , H01L2224/05124 , H01L2224/05181 , H01L2224/05624 , H01L2224/10126 , H01L2224/10135 , H01L2224/13021 , H01L2224/1308 , H01L2224/13082 , H01L2224/13124 , H01L2224/13164 , H01L2224/81136 , H01L2224/81139 , H01L2224/812 , H01L2224/81201 , H01L2224/81385 , H01L2224/81801 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01073 , H01L2924/01078 , H01L2924/01322 , H01L2924/14 , H01L2924/00014 , H01L2224/13099 , H01L2224/29099 , H01L2924/013
摘要： A process for bonding two distinct substrates that integrate microsystems, including the steps of forming micro-integrated devices in at least one of two substrates using micro-electronic processing techniques and bonding the substrates. Bonding is performed by forming on a first substrate bonding regions of deformable material and pressing the substrates one against another so as to deform the bonding regions and to cause them to react chemically with the second substrate. The bonding regions are preferably formed by a thick layer of a material chosen from among aluminum, copper and nickel, covered by a thin layer of a material chosen from between palladium and platinum. Spacing regions ensure exact spacing between the two wafers.
摘要翻译：一种用于结合集成微系统的两个不同基板的方法，包括使用微电子处理技术和粘合基板在两个基板中的至少一个中形成微集成器件的步骤。通过在第一基板上形成接合可变形材料的区域并将基板压在另一个上以使接合区域变形并使其与第二基板发生化学反应来进行接合。接合区域优选由选自铝，铜和镍的材料的厚层形成，被选自钯和铂之间的材料的薄层覆盖。间隔区确保两个晶片之间的精确间距。

8. 发明申请

US20070252224A1 Integrated Chemical Microreactor With Large Area Channels and Manufacturing Process Thereof 有权
标题翻译：具有大面积通道的综合化学微反应器及其制造工艺
公开(公告)号：US20070252224A1
公开(公告)日：2007-11-01
申请号：US11743062
申请日：2007-05-01
申请人： Gabriele Barlocchi , Ubaldo Mastromatteo , Flavio Villa
发明人： Gabriele Barlocchi , Ubaldo Mastromatteo , Flavio Villa
IPC分类号： H01L29/00 , H01L21/00
CPC分类号： B01J19/0093 , B01J2219/00783 , B01J2219/00828 , Y10T436/114998
摘要： The microreactor has a body of semiconductor material; a large area buried channel extending in the body and having walls; a coating layer of insulating material coating the walls of the channel; a diaphragm extending on top of the body and upwardly closing the channel. The diaphragm is formed by a semiconductor layer completely encircling mask portions of insulating material.
摘要翻译：微反应器具有半导体材料体; 一个大面积的埋藏通道延伸到身体并具有墙壁; 覆盖通道壁的绝缘材料的涂层; 一个在主体顶部延伸并向上封闭通道的隔膜。隔膜由完全环绕绝缘材料的掩模部分的半导体层形成。

9. 发明授权

US07009154B2 Process for manufacturing integrated chemical microreactors of semiconductor material 有权
公开(公告)号：US07009154B2
公开(公告)日：2006-03-07
申请号：US10784509
申请日：2004-02-23
申请人： Flavio Villa , Ubaldo Mastromatteo , Gabriele Barlocchi , Mauro Cattaneo
发明人： Flavio Villa , Ubaldo Mastromatteo , Gabriele Barlocchi , Mauro Cattaneo
IPC分类号： C12M1/34 , G01N33/487 , H05B3/02
CPC分类号： B81C1/00119 , B01J19/0093 , B01L3/5027 , B01L3/502707 , B01L7/52 , B01L7/525 , B01L2200/12 , B01L2300/0645 , B01L2300/1827 , B01L2300/185 , B01L2300/1883 , B81B2201/0214 , B81B2201/051 , B81B2203/0315 , B81B2203/0338 , B81C2201/053
摘要： The microreactor is completely integrated and is formed by a semiconductor body having a surface and housing at least one buried channel accessible from the surface of the semiconductor body through two trenches. A heating element extends above the surface over the channel and a resist region extends above the heating element and defines an inlet reservoir and an outlet reservoir. The reservoirs are connected to the trenches and have, in cross-section, a larger area than the trenches. The outlet reservoir has a larger area than the inlet reservoir. A sensing electrode extends above the surface and inside the outlet reservoir.

10. 发明申请

US20050009300A1 Electronic semiconductor device having a thermal spreader 有权
公开(公告)号：US20050009300A1
公开(公告)日：2005-01-13
申请号：US10893021
申请日：2004-07-16
申请人： Bruno Murari , Ubaldo Mastromatteo , Benedetto Vigna
发明人： Bruno Murari , Ubaldo Mastromatteo , Benedetto Vigna
IPC分类号： H01L23/31 , H01L23/36 , H01L23/373 , H01L23/482 , H01L21/44
CPC分类号： H01L24/01 , H01L23/3157 , H01L23/36 , H01L23/3735 , H01L23/4827 , H01L2224/274 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082
摘要： The electronic device is formed in a die including a body of semiconductor material having a first face covered by a covering structure and a second face. An integral thermal spreader of metal is grown galvanically on the second face during the manufacture of a wafer, prior to cutting into dice. The covering structure comprises a passivation region and a protective region of opaque polyimide; the protective region and the passivation region are opened above the contact pads for the passage of leads.

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