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1. 发明授权

US08067696B2 Printed circuit board and method for manufacturing same 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US08067696B2
公开(公告)日：2011-11-29
申请号：US12389521
申请日：2009-02-20
申请人： Chung-Jen Tsai , Chia-Cheng Chen , Hung-Yi Chang , Tung-Yao Kuo , Cheng-Hsien Lin
发明人： Chung-Jen Tsai , Chia-Cheng Chen , Hung-Yi Chang , Tung-Yao Kuo , Cheng-Hsien Lin
IPC分类号： H05K1/00
CPC分类号： H05K1/0271 , H05K3/243 , H05K2201/09136 , H05K2201/09736 , H05K2201/09781 , H05K2201/09827 , H05K2201/09845 , H05K2201/2009
摘要： A printed circuit board includes an insulating layer, a copper layer formed on the insulating layer and a reinforcing layer formed on the copper layer at opposite sides of the given portion. The copper layer includes a plurality of electrical traces at a given portion thereof. A thickness of the reinforcing layer increases in a direction away from the given portion. A method for manufacturing the printed circuit board is also provided in this disclosure.
摘要翻译：印刷电路板包括绝缘层，形成在绝缘层上的铜层和在给定部分的相对侧的铜层上形成的增强层。铜层在其给定部分包括多个电迹线。加强层的厚度在远离给定部分的方向上增加。在本公开中还提供了制造印刷电路板的方法。

2. 发明申请

US20110284162A1 APPARATUS FOR WET PROCESSING SUBSTRATE 审中-公开
标题翻译：湿处理基板装置
公开(公告)号：US20110284162A1
公开(公告)日：2011-11-24
申请号：US12913789
申请日：2010-10-28
申请人： ZONG-QING CAI , TUNG-YAO KUO
发明人： ZONG-QING CAI , TUNG-YAO KUO
IPC分类号： H01L21/306
CPC分类号： C23F1/08 , B05B12/122 , B05B13/0221 , H05K3/0085 , H05K2203/075 , H05K2203/1509 , H05K2203/1545
摘要： An exemplary apparatus for wet processing a substrate includes a conveyor configured for conveying the substrate along a conveying direction and parallel spray pipes. The spray pipes are substantially parallel with the conveyor and substantially perpendicular to the conveying direction. Each spray pipe consisting of at least one spray nozzle faces the conveyor, and the number of the at least one nozzle of each spray pipe increases along the conveying direction.
摘要翻译：用于湿处理基材的示例性装置包括：输送器，其构造成沿输送方向和平行的喷射管输送基板。喷射管基本上平行于输送机并且基本上垂直于输送方向。由至少一个喷嘴组成的每个喷管面向输送机，并且每个喷射管的至少一个喷嘴的数量沿输送方向增加。

3. 发明申请

US20090056624A1 FLUID CIRCULATING SYSTEM FOR MANUFACTURING PRINTED CIRCUIT BOARD 审中-公开
标题翻译：用于制造印刷电路板的流体循环系统
公开(公告)号：US20090056624A1
公开(公告)日：2009-03-05
申请号：US12045150
申请日：2008-03-10
申请人： CHIH-KANG YANG , HUNG-YI CHANG , CHIH-LUNG HSIAO , TUNG-YAO KUO
发明人： CHIH-KANG YANG , HUNG-YI CHANG , CHIH-LUNG HSIAO , TUNG-YAO KUO
IPC分类号： B05C3/04
CPC分类号： G03F7/16
摘要： An exemplary fluid circulating system includes a return pipe, a reservoir, a suction pipe, a supply pipe, a circulating pump, and a processing device. The reservoir is configured for containing a work fluid. The processing device is configured for processing a semi-finished printed circuit board using the work fluid. The circulating pump is configured for transferring the work fluid from the reservoir to the processing device. The suction pipe and the supply pipe are respectively coupled to an inlet and the outlet of the circulating pump. An inner diameter of the suction pipe is larger than that of the supply pipe. The return pipe is coupled to the processing device for delivering the work fluid from the processing device to the reservoir. The fluid circulating system can improve quality of the circulated work fluid.
摘要翻译：示例性的流体循环系统包括回流管，储存器，吸入管，供给管，循环泵和处理装置。储存器构造成容纳工作流体。处理装置构造成用于使用工作流体处理半成品印刷电路板。循环泵构造成用于将工作流体从储存器传送到处理装置。吸入管和供给管分别连接到循环泵的入口和出口。吸入管的内径大于供给管的内径。返回管连接到处理装置，用于将工作流体从处理装置输送到储存器。流体循环系统可以提高循环工作流体的质量。

4. 发明申请

US20100038116A1 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20100038116A1
公开(公告)日：2010-02-18
申请号：US12389521
申请日：2009-02-20
申请人： CHUNG-JEN TSAI , CHIA-CHENG CHEN , HUNG-YI CHANG , TUNG-YAO KUO , CHENG-HSIEN LIN
发明人： CHUNG-JEN TSAI , CHIA-CHENG CHEN , HUNG-YI CHANG , TUNG-YAO KUO , CHENG-HSIEN LIN
IPC分类号： H05K1/00 , H05K1/09 , H05K3/46 , C25D5/16
CPC分类号： H05K1/0271 , H05K3/243 , H05K2201/09136 , H05K2201/09736 , H05K2201/09781 , H05K2201/09827 , H05K2201/09845 , H05K2201/2009
摘要： A printed circuit board includes an insulating layer, a copper layer formed on the insulating layer and a reinforcing layer formed on the copper layer at opposite sides of the given portion. The copper layer includes a plurality of electrical traces at a given portion thereof. A thickness of the reinforcing layer increases in a direction away from the given portion. A method for manufacturing the printed circuit board is also provided in this disclosure.
摘要翻译：印刷电路板包括绝缘层，形成在绝缘层上的铜层和在给定部分的相对侧的铜层上形成的增强层。铜层在其给定部分包括多个电迹线。加强层的厚度在远离给定部分的方向上增加。在本公开中还提供了制造印刷电路板的方法。

5. 发明申请

US20100003784A1 METHOD FOR MOUNTING ELECTRONIC COMPONENT ON PRINTED CIRCUIT BOARD 有权
标题翻译：打印电路板上电子元件安装方法
公开(公告)号：US20100003784A1
公开(公告)日：2010-01-07
申请号：US12466361
申请日：2009-05-14
申请人： CHUNG-JEN TSAI , CHIA-CHENG CHEN , HUNG-YI CHANG , TUNG-YAO KUO , CHENG-HSIEN LIN
发明人： CHUNG-JEN TSAI , CHIA-CHENG CHEN , HUNG-YI CHANG , TUNG-YAO KUO , CHENG-HSIEN LIN
IPC分类号： H01L21/52
CPC分类号： H05K1/0271 , H05K3/0052 , H05K3/303 , H05K3/341 , H05K2201/09127 , H05K2201/09136 , H05K2201/09681 , H05K2201/09781 , H05K2201/10674 , H05K2201/2009
摘要： A method for assembling an electronic component on a printed circuit board includes following steps. Firstly, a printed circuit board substrate including a central main portion and a peripheral unwanted portion is provided. Secondly, electrically conductive patterns and reinforcing patterns are formed on the main portion and the unwanted portion respectively. Thirdly, an electronic component is mounted on the main portion and electrically connected with the electrically conductive patterns. Fifthly, the unwanted portion is removed.
摘要翻译：一种用于在印刷电路板上组装电子部件的方法包括以下步骤。首先，提供包括中央主要部分和外围不想要的部分的印刷电路板基板。其次，分别在主要部分和不想要的部分上形成导电图案和加强图案。第三，电子部件安装在主体部分上并与导电图形电连接。第五，去除不想要的部分。

6. 发明授权

US07799603B2 Method for mounting electronic component on printed circuit board 有权
标题翻译：将电子元件安装在印刷电路板上的方法
公开(公告)号：US07799603B2
公开(公告)日：2010-09-21
申请号：US12466361
申请日：2009-05-14
申请人： Chung-Jen Tsai , Chia-Cheng Chen , Hung-Yi Chang , Tung-Yao Kuo , Cheng-Hsien Lin
发明人： Chung-Jen Tsai , Chia-Cheng Chen , Hung-Yi Chang , Tung-Yao Kuo , Cheng-Hsien Lin
IPC分类号： H01L21/52
CPC分类号： H05K1/0271 , H05K3/0052 , H05K3/303 , H05K3/341 , H05K2201/09127 , H05K2201/09136 , H05K2201/09681 , H05K2201/09781 , H05K2201/10674 , H05K2201/2009
摘要： A method for assembling an electronic component on a printed circuit board includes following steps. Firstly, a printed circuit board substrate including a central main portion and a peripheral unwanted portion is provided. Secondly, electrically conductive patterns and reinforcing patterns are formed on the main portion and the unwanted portion respectively. Thirdly, an electronic component is mounted on the main portion and electrically connected with the electrically conductive patterns. Fifthly, the unwanted portion is removed.
摘要翻译：一种用于在印刷电路板上组装电子部件的方法包括以下步骤。首先，提供包括中央主要部分和外围不想要的部分的印刷电路板基板。其次，分别在主要部分和不想要的部分上形成导电图案和加强图案。第三，电子部件安装在主体部分上并与导电图形电连接。第五，去除不想要的部分。

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