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1. 发明申请

US20090056624A1 FLUID CIRCULATING SYSTEM FOR MANUFACTURING PRINTED CIRCUIT BOARD 审中-公开
标题翻译：用于制造印刷电路板的流体循环系统
公开(公告)号：US20090056624A1
公开(公告)日：2009-03-05
申请号：US12045150
申请日：2008-03-10
申请人： CHIH-KANG YANG , HUNG-YI CHANG , CHIH-LUNG HSIAO , TUNG-YAO KUO
发明人： CHIH-KANG YANG , HUNG-YI CHANG , CHIH-LUNG HSIAO , TUNG-YAO KUO
IPC分类号： B05C3/04
CPC分类号： G03F7/16
摘要： An exemplary fluid circulating system includes a return pipe, a reservoir, a suction pipe, a supply pipe, a circulating pump, and a processing device. The reservoir is configured for containing a work fluid. The processing device is configured for processing a semi-finished printed circuit board using the work fluid. The circulating pump is configured for transferring the work fluid from the reservoir to the processing device. The suction pipe and the supply pipe are respectively coupled to an inlet and the outlet of the circulating pump. An inner diameter of the suction pipe is larger than that of the supply pipe. The return pipe is coupled to the processing device for delivering the work fluid from the processing device to the reservoir. The fluid circulating system can improve quality of the circulated work fluid.
摘要翻译：示例性的流体循环系统包括回流管，储存器，吸入管，供给管，循环泵和处理装置。储存器构造成容纳工作流体。处理装置构造成用于使用工作流体处理半成品印刷电路板。循环泵构造成用于将工作流体从储存器传送到处理装置。吸入管和供给管分别连接到循环泵的入口和出口。吸入管的内径大于供给管的内径。返回管连接到处理装置，用于将工作流体从处理装置输送到储存器。流体循环系统可以提高循环工作流体的质量。

2. 发明申请

US20090025582A1 SCREEN PRINTING METHOD FOR PRINTING A PRINTED CIRCUIT BOARD 审中-公开
标题翻译：印刷印刷电路板的印刷方法
公开(公告)号：US20090025582A1
公开(公告)日：2009-01-29
申请号：US11952964
申请日：2007-12-07
申请人： TSO-HUNG YEH , CHIH-KANG YANG , HUNG-YI CHANG , CHIH-LUNG HSIAO
发明人： TSO-HUNG YEH , CHIH-KANG YANG , HUNG-YI CHANG , CHIH-LUNG HSIAO
IPC分类号： B41M1/12
CPC分类号： H05K3/28 , H05K3/1225 , H05K3/1233 , H05K2201/09236 , H05K2203/0139
摘要： An exemplary screen printing method for printing a printed circuit board is provided. The printed circuit board includes a number of parallel electrical traces. In the method, firstly, a screen printing stencil is disposed on a side of the printed circuit board having the electrical traces and a squeegee is disposed on the screen printing stencil. Secondly, the squeegee is drawn across the screen printing stencil in a manner such that an angle between a blade of the squeegee and the electrical traces is in a range from 20 degrees to 70 degrees so as to print an ink on the printed circuit board. The method can improve quality of the printed circuit board.
摘要翻译：提供了用于印刷印刷电路板的示例性丝网印刷方法。印刷电路板包括多个平行的电迹线。在该方法中，首先，在具有电迹线的印刷电路板的一侧设置丝网印刷模版，并且在丝网印刷模版上设置刮板。其次，将刮板沿着丝网印刷模板拉伸，使得刮板的刮刀和电迹线之间的角度在20度至70度的范围内，以便在印刷电路板上印刷油墨。该方法可以提高印刷电路板的质量。

3. 发明申请

US20090013929A1 PLATING APPARATUS 失效
标题翻译：电镀设备
公开(公告)号：US20090013929A1
公开(公告)日：2009-01-15
申请号：US11967005
申请日：2007-12-29
申请人： TSO-HUNG YEH , HUNG-YI CHANG , CHIH-LUNG HSIAO
发明人： TSO-HUNG YEH , HUNG-YI CHANG , CHIH-LUNG HSIAO
IPC分类号： B05C3/00
CPC分类号： H05K3/241 , C25D17/00 , C25D17/008 , H05K1/0393
摘要： A plating apparatus for plating a FPCB base board having a first conveyance region and a second conveyance region includes a shielding apparatus. The shielding apparatus includes a first shielding plate and a second shielding plate. The first shielding plate corresponds to the first conveyance region. A distance between the first shielding plate and the first conveyance region is from 5 millimeters to 20 millimeters. A width of the first shielding is equal to or larger than a width of the first conveyance region. The second shielding plate corresponds to the second conveyance region. A distance between the second shielding plate and the second conveyance region is from 5 millimeters to 20 millimeters. A width of the second shielding is equal to or larger than a width of the second conveyance region. The first and second shielding plates are made of an insulation material.
摘要翻译：用于电镀具有第一输送区域和第二输送区域的FPCB基板的电镀装置包括屏蔽装置。屏蔽装置包括第一屏蔽板和第二屏蔽板。第一遮蔽板对应于第一输送区域。第一屏蔽板与第一输送区之间的距离为5毫米至20毫米。第一屏蔽的宽度等于或大于第一输送区域的宽度。第二屏蔽板对应于第二输送区域。第二遮蔽板与第二输送区之间的距离为5毫米至20毫米。第二屏蔽的宽度等于或大于第二输送区域的宽度。第一和第二屏蔽板由绝缘材料制成。

4. 发明申请

US20120175249A1 APPARATUS FOR PLATING FLEXIBLE PRINTED CIRCUIT BOARD 审中-公开
标题翻译：用于打印柔性印刷电路板的装置
公开(公告)号：US20120175249A1
公开(公告)日：2012-07-12
申请号：US13422166
申请日：2012-03-16
申请人： TSO-HUNG YEH , HUNG-YI CHANG , CHIH-LUNG HSIAO
发明人： TSO-HUNG YEH , HUNG-YI CHANG , CHIH-LUNG HSIAO
IPC分类号： C25D17/00
CPC分类号： H05K3/241 , C25D17/00 , C25D17/008 , H05K1/0393
摘要： A plating apparatus for plating a FPCB base board having a first conveyance region and a second conveyance region includes a shielding apparatus. The shielding apparatus includes a first shielding plate and a second shielding plate. The first shielding plate corresponds to the first conveyance region. A distance between the first shielding plate and the first conveyance region is from 5 millimeters to 20 millimeters. A width of the first shielding is equal to or larger than a width of the first conveyance region. The second shielding plate corresponds to the second conveyance region. A distance between the second shielding plate and the second conveyance region is from 5 millimeters to 20 millimeters. A width of the second shielding is equal to or larger than a width of the second conveyance region. The first and second shielding plates are made of an insulation material.
摘要翻译：用于电镀具有第一输送区域和第二输送区域的FPCB基板的电镀装置包括屏蔽装置。屏蔽装置包括第一屏蔽板和第二屏蔽板。第一遮蔽板对应于第一输送区域。第一屏蔽板与第一输送区之间的距离为5毫米至20毫米。第一屏蔽的宽度等于或大于第一输送区域的宽度。第二屏蔽板对应于第二输送区域。第二遮蔽板与第二输送区之间的距离为5毫米至20毫米。第二屏蔽的宽度等于或大于第二输送区域的宽度。第一和第二屏蔽板由绝缘材料制成。

5. 发明申请

US20090039053A1 METHOD FOR MANUFACTURING ELECTRICAL TRACES OF PRINTED CIRCUIT BOARDS 审中-公开
标题翻译：制造印刷电路板电路的方法
公开(公告)号：US20090039053A1
公开(公告)日：2009-02-12
申请号：US11964583
申请日：2007-12-26
申请人： TSO-HUNG YEH , CHIH-LUNG HSIAO , HUNG-YI CHANG
发明人： TSO-HUNG YEH , CHIH-LUNG HSIAO , HUNG-YI CHANG
IPC分类号： H01B13/00
CPC分类号： H05K3/067 , H05K3/064 , H05K3/388 , H05K2201/0338 , H05K2203/1476
摘要： An exemplary method for manufacturing a printed circuit board is provided. Firstly, a copper clad substrate comprising a base film, a copper layer and intermediate layer interposed between the base film and the copper layer is provided. The intermediate layer is comprised of nickel, chromium, or alloy of nickel and chromium. A patterned photoresist layer is formed on the copper layer with portions of the copper layer are exposed from the photoresist pattern layer. Exposed portions of the copper layer are removed using a copper etchant to form a number of electrical traces, thereby exposing portions of the intermediate layer from the patterned photoresist layer. Exposed portions of the intermediate layer are removed using a chromium-nickel etchant. The method can prevent a bottom of each of electrical traces from enlarging, thereby improving quality of printed circuit board.
摘要翻译：提供了制造印刷电路板的示例性方法。首先，提供包括基膜，铜层和介于基膜和铜层之间的中间层的铜包覆基板。中间层由镍，铬或镍和铬的合金组成。在铜层上形成图案化的光致抗蚀剂层，其中部分铜层从光致抗蚀剂图案层露出。使用铜蚀刻剂去除铜层的暴露部分以形成多个电迹线，从而将中间层的部分暴露于图案化的光致抗蚀剂层。使用铬 - 镍蚀刻剂去除中间层的暴露部分。该方法可以防止每个电迹线的底部放大，从而提高印刷电路板的质量。

6. 发明申请

US20100038116A1 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20100038116A1
公开(公告)日：2010-02-18
申请号：US12389521
申请日：2009-02-20
申请人： CHUNG-JEN TSAI , CHIA-CHENG CHEN , HUNG-YI CHANG , TUNG-YAO KUO , CHENG-HSIEN LIN
发明人： CHUNG-JEN TSAI , CHIA-CHENG CHEN , HUNG-YI CHANG , TUNG-YAO KUO , CHENG-HSIEN LIN
IPC分类号： H05K1/00 , H05K1/09 , H05K3/46 , C25D5/16
CPC分类号： H05K1/0271 , H05K3/243 , H05K2201/09136 , H05K2201/09736 , H05K2201/09781 , H05K2201/09827 , H05K2201/09845 , H05K2201/2009
摘要： A printed circuit board includes an insulating layer, a copper layer formed on the insulating layer and a reinforcing layer formed on the copper layer at opposite sides of the given portion. The copper layer includes a plurality of electrical traces at a given portion thereof. A thickness of the reinforcing layer increases in a direction away from the given portion. A method for manufacturing the printed circuit board is also provided in this disclosure.
摘要翻译：印刷电路板包括绝缘层，形成在绝缘层上的铜层和在给定部分的相对侧的铜层上形成的增强层。铜层在其给定部分包括多个电迹线。加强层的厚度在远离给定部分的方向上增加。在本公开中还提供了制造印刷电路板的方法。

7. 发明申请

US20100003784A1 METHOD FOR MOUNTING ELECTRONIC COMPONENT ON PRINTED CIRCUIT BOARD 有权
标题翻译：打印电路板上电子元件安装方法
公开(公告)号：US20100003784A1
公开(公告)日：2010-01-07
申请号：US12466361
申请日：2009-05-14
申请人： CHUNG-JEN TSAI , CHIA-CHENG CHEN , HUNG-YI CHANG , TUNG-YAO KUO , CHENG-HSIEN LIN
发明人： CHUNG-JEN TSAI , CHIA-CHENG CHEN , HUNG-YI CHANG , TUNG-YAO KUO , CHENG-HSIEN LIN
IPC分类号： H01L21/52
CPC分类号： H05K1/0271 , H05K3/0052 , H05K3/303 , H05K3/341 , H05K2201/09127 , H05K2201/09136 , H05K2201/09681 , H05K2201/09781 , H05K2201/10674 , H05K2201/2009
摘要： A method for assembling an electronic component on a printed circuit board includes following steps. Firstly, a printed circuit board substrate including a central main portion and a peripheral unwanted portion is provided. Secondly, electrically conductive patterns and reinforcing patterns are formed on the main portion and the unwanted portion respectively. Thirdly, an electronic component is mounted on the main portion and electrically connected with the electrically conductive patterns. Fifthly, the unwanted portion is removed.
摘要翻译：一种用于在印刷电路板上组装电子部件的方法包括以下步骤。首先，提供包括中央主要部分和外围不想要的部分的印刷电路板基板。其次，分别在主要部分和不想要的部分上形成导电图案和加强图案。第三，电子部件安装在主体部分上并与导电图形电连接。第五，去除不想要的部分。

8. 发明申请

US20090014031A1 CLEANING APPARATUS 有权
标题翻译：清洁装置
公开(公告)号：US20090014031A1
公开(公告)日：2009-01-15
申请号：US11967006
申请日：2007-12-29
申请人： TSO-HUNG YEH , HUNG-YI CHANG , CHIH-LUNG HSIAO , CHENG-HSIEN LIN
发明人： TSO-HUNG YEH , HUNG-YI CHANG , CHIH-LUNG HSIAO , CHENG-HSIEN LIN
IPC分类号： B08B1/02
CPC分类号： H05K3/26 , H05K2203/0143 , H05K2203/0191 , H05K2203/1545
摘要： The present invention relates to a cleaning apparatus for printed circuit board. The cleaning apparatus includes a base, a clamping plate fixed to the base, at least one holding member, at least one cleaning roller, and a driving mechanism. The holding member is elastically supported on the base. The at least one cleaning roller is pivotably disposed on the at least one holding member respectively. The cleaning roller includes a cleaning layer attached to a surface of the cleaning roller. The clamping plate is opposite to and departs from the cleaning roller at a distance. The driving mechanism is coupled to the cleaning roller and configured for driving the cleaning roller to rotate. The cleaning apparatus can clean printed circuit board high efficiently.
摘要翻译：本发明涉及一种用于印刷电路板的清洁装置。清洁装置包括基座，固定到基座的夹板，至少一个保持构件，至少一个清洁辊和驱动机构。保持构件弹性地支撑在基座上。所述至少一个清洁辊分别枢转地设置在所述至少一个保持构件上。清洁辊包括附接到清洁辊的表面的清洁层。夹紧板与清洁辊相对并离开一段距离。所述驱动机构与所述清洁辊连接并构造成驱动所述清洁辊旋转。清洁装置可以高效地清洁印刷电路板。

9. 发明公开

US20240179855A1 PORTABLE CONTROLLER WITH REPLACEABLE MODULE 审中-公开
公开(公告)号：US20240179855A1
公开(公告)日：2024-05-30
申请号：US18058880
申请日：2022-11-28
申请人： HUNG-YI CHANG
发明人： HUNG-YI CHANG
IPC分类号： H05K5/00
CPC分类号： H05K5/0086 , H05K5/0018
摘要： A portable controller with replaceable module includes: a main body having a touchable display screen; a control system installed in the main body; a power supply system installed in the main body and connected to the control system to detect and adjust the power supply; a functional module, detachably connected to the main body to provide data, wherein, the control system is used to display data on the touchable display screen relative to the function module and to control the function module through the touchable display screen. Therefore, the portable controller with replaceable module could be applied to different functional modules to achieve wide area use purpose.

10. 发明申请

US20100051332A1 CIRCUIT SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENT AND CIRCUIT SUBSTRATE ASSEMBLY HAVING SAME 有权
标题翻译：用于安装电子元件的电路基板和具有相同电路元件的电路基板组件
公开(公告)号：US20100051332A1
公开(公告)日：2010-03-04
申请号：US12471396
申请日：2009-05-24
申请人： CHUNG-JEN TSAI , HUNG-YI CHANG , CHIA-CHENG CHEN , MENG-CHIEH HSU , CHENG-HSIEN LIN
发明人： CHUNG-JEN TSAI , HUNG-YI CHANG , CHIA-CHENG CHEN , MENG-CHIEH HSU , CHENG-HSIEN LIN
IPC分类号： H05K1/02
CPC分类号： H05K1/186 , B82Y10/00 , H01L23/373 , H01L23/5384 , H01L23/5389 , H01L24/19 , H01L2224/04105 , H01L2224/73267 , H01L2224/9222 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/18162 , H01L2924/19042 , H05K3/4038 , H05K2201/026
摘要： A circuit substrate includes an electrically conductive layer having electrically conductive patterns formed therein, an insulating layer having a through hole, and a composite layer positioned between the electrically conductive layer and the insulating layer. The through hole is configured for having an electronic component mounted thereon. The composite layer includes a polymer matrix and at least one carbon nanotube bundle embedded in the polymer matrix. One end of the at least one carbon nanotube bundle contacts the electrically conductive patterns, and the other is exposed in the through hole of the insulation layer.
摘要翻译：电路基板包括其中形成有导电图案的导电层，具有通孔的绝缘层和位于导电层和绝缘层之间的复合层。通孔被配置为具有安装在其上的电子部件。复合层包括聚合物基质和嵌入聚合物基质中的至少一个碳纳米管束。至少一个碳纳米管束的一端与导电图案接触，另一端暴露在绝缘层的通孔中。

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