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1. 发明申请

US20100124726A1 SUBSTRATE PROCESSING APPARATUS, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND TEMPERATURE CONTROLLING METHOD 有权
标题翻译：基板加工装置，半导体装置制造方法及温度控制方法
公开(公告)号：US20100124726A1
公开(公告)日：2010-05-20
申请号：US12609541
申请日：2009-10-30
申请人： Masashi Sugishita , Masaaki Ueno , Tsukasa Iida , Susumu Nishiura , Masao Aoyama , Kenichi Fujimoto , Yoshihiko Nakagawa , Hiroyuki Mitsui
发明人： Masashi Sugishita , Masaaki Ueno , Tsukasa Iida , Susumu Nishiura , Masao Aoyama , Kenichi Fujimoto , Yoshihiko Nakagawa , Hiroyuki Mitsui
IPC分类号： H01L21/477
CPC分类号： H01L21/67248
摘要： Provided are a substrate processing apparatus, a semiconductor device manufacturing method, and a temperature controlling method, which are adapted to improve equipment operational rate. A calculation parameter computing unit computes a calculation parameter using at least a first calculation parameter correction value determined by a first calculation parameter setting unit based on an accumulated film thickness on a reaction vessel, a second calculation parameter correction value determined by a second calculation parameter setting unit based on an accumulated film thickness on a filler wafer, and a third calculation parameter correction value determined by a third calculation parameter setting unit based on the number of filler wafers. Product and filler wafers are accommodated and heat-treated in the reaction vessel while controlling a heating unit using calculation results obtained using at least the calculation parameter and deviation between a set temperature and a temperature detected in the heating unit by a temperature detector.
摘要翻译：提供了适于提高设备运行速率的基板处理装置，半导体装置制造方法和温度控制方法。计算参数计算单元使用由第一计算参数设定单元确定的至少第一计算参数校正值，基于反应容器上累积的膜厚计算计算参数，由第二计算参数设定确定的第二计算参数校正值基于填充晶片上的累积膜厚的单位和由第三计算参数设定单元基于填充晶片的数量确定的第三计算参数校正值。使用至少计算参数获得的计算结果和通过温度检测器在加热单元中检测到的设定温度和温度之间的偏差来控制加热单元，从而在反应容器中容纳和热处理产物和填料晶片。

2. 发明授权

US5580443A Process for cracking low-quality feed stock and system used for said process 失效
标题翻译：破碎低品质原料的方法和用于所述方法的系统
公开(公告)号：US5580443A
公开(公告)日：1996-12-03
申请号：US241676
申请日：1994-05-12
申请人： Masahiko Yoshida , Yutaka Kitayama , Tsukasa Iida
发明人： Masahiko Yoshida , Yutaka Kitayama , Tsukasa Iida
IPC分类号： C10G9/00 , C10G9/14 , C10G9/20 , C10G55/04 , C10G9/36
CPC分类号： C10G9/20 , C10G55/04 , C10G9/00 , C10G9/14
摘要： In a process for thermally cracking a low-quality feed stock containing a considerable proportion of heavy fractions such as high-boiling fractions, and evaporation residual oil, and a system used therefor, in which the low-quality feed stock is withdrawn from the preheater of the thermal cracking furnace to separate and remove a required proportion of said heavy fractions and thereafter returned to subject the feed stock to further preheating and thermal cracking. The low-quality feed stock thermally cracked has a predetermined proportion of the heavy fractions removed, and coking in the thermal cracking system at various lines is avoided from occurring.
摘要翻译：在用于热裂解含有相当比例的重馏分如高沸点馏分和蒸发残余油的低质量原料的方法及其使用的系统中，其中低质量原料从预热器中取出的热裂解炉分离并除去所需重量份的所需比例，然后返回进行原料进一步预热和热裂解。热裂化的低质原料具有除去重质馏分的预定比例，避免了在各种生产线上的热裂解体系中的焦化。

3. 发明授权

US5062948A Mercury removal from liquid hydrocarbon compound 失效
标题翻译：从液体烃化合物中除去汞
公开(公告)号：US5062948A
公开(公告)日：1991-11-05
申请号：US486607
申请日：1990-02-28
申请人： Tetsu Kawazoe , Tsukasa Iida
发明人： Tetsu Kawazoe , Tsukasa Iida
IPC分类号： B01D15/00 , C09K3/00 , C10G25/00 , C10G53/08 , C10G67/06
CPC分类号： C10G25/00 , C10G25/003 , C10G53/08 , C10G67/06 , C10G2300/205
摘要： The invention provides a method for removing mercury from a liquid hydrocarbon feed material by (a) removing those components having a higher molecular weight than the desired hydrocarbon from the feed material, (b) removing water from the feed material, and thereafter (c) removing mercury from the feed material. Mercury can be removed to an extremely low concentration of 0.001 ppm or lower from a wide variety of liquid hydrocarbon feed materials containing either a relatively large amount or a trace amount of mercury.

4. 发明授权

US07808396B2 Substrate processing apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US07808396B2
公开(公告)日：2010-10-05
申请号：US11991093
申请日：2006-09-26
申请人： Tsukasa Iida , Akihiko Yoneda , Kaori Inoshima
发明人： Tsukasa Iida , Akihiko Yoneda , Kaori Inoshima
IPC分类号： G08B3/00
CPC分类号： G05B23/0267 , G05B2219/31455 , G05B2219/45031 , H01L21/67253
摘要： It is intended to provide a substrate processing apparatus capable of reliably informing a running state of the apparatus. The substrate processing apparatus 100 having a signal indicator for indicating the running state, including a signal indicator 306 capable of setting at least one operation condition under which the signal indicator 306 operates as well as of operating under any one of a plurality of operation conditions and a display unit 314 capable of displaying that a cause of the operation is any one of the operation conditions during the operation of the signal indicator 306.
摘要翻译：旨在提供能够可靠地通知装置的运行状态的基板处理装置。具有用于指示运行状态的信号指示器的基板处理装置100包括能够设定信号指示器306运行的至少一个操作状态的信号指示器306以及在多个操作条件中的任何一个下运行的信号指示器306，显示单元314，其能够显示操作的原因是在信号指示器306的操作期间的操作条件中的任何一个。

5. 发明申请

US20090072990A1 Substrate processing apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US20090072990A1
公开(公告)日：2009-03-19
申请号：US11991093
申请日：2006-09-26
申请人： Tsukasa Iida , Akihiko Yoneda , Kaori Inoshima
发明人： Tsukasa Iida , Akihiko Yoneda , Kaori Inoshima
IPC分类号： G08B7/00
CPC分类号： G05B23/0267 , G05B2219/31455 , G05B2219/45031 , H01L21/67253
摘要： It is intended to provide a substrate processing apparatus capable of reliably informing a running state of the apparatus. The substrate processing apparatus 100 having a signal indicator for indicating the running state, including a signal indicator 306 capable of setting at least one operation condition under which the signal indicator 306 operates as well as of operating under any one of a plurality of operation conditions and a display unit 314 capable of displaying that a cause of the operation is any one of the operation conditions during the operation of the signal indicator 306.
摘要翻译：旨在提供能够可靠地通知装置的运行状态的基板处理装置。具有用于指示运行状态的信号指示器的基板处理装置100包括能够设定信号指示器306运行的至少一个操作状态的信号指示器306以及在多个操作条件中的任何一个下运行的信号指示器306，显示单元314，其能够显示操作的原因是在信号指示器306的操作期间的操作条件中的任何一个。

6. 发明授权

US08417394B2 Substrate processing apparatus, semiconductor device manufacturing method and temperature controlling method 有权
标题翻译：基板加工装置，半导体装置的制造方法以及温度控制方法
公开(公告)号：US08417394B2
公开(公告)日：2013-04-09
申请号：US12609541
申请日：2009-10-30
申请人： Masashi Sugishita , Masaaki Ueno , Tsukasa Iida , Susumu Nishiura , Masao Aoyama , Kenichi Fujimoto , Yoshihiko Nakagawa , Hiroyuki Mitsui
发明人： Masashi Sugishita , Masaaki Ueno , Tsukasa Iida , Susumu Nishiura , Masao Aoyama , Kenichi Fujimoto , Yoshihiko Nakagawa , Hiroyuki Mitsui
IPC分类号： H01L21/67
CPC分类号： H01L21/67248
摘要： Provided are a substrate processing apparatus, a semiconductor device manufacturing method, and a temperature controlling method, which are adapted to improve equipment operational rate. A calculation parameter computing unit computes a calculation parameter using at least a first calculation parameter correction value determined by a first calculation parameter setting unit based on an accumulated film thickness on a reaction vessel, a second calculation parameter correction value determined by a second calculation parameter setting unit based on an accumulated film thickness on a filler wafer, and a third calculation parameter correction value determined by a third calculation parameter setting unit based on the number of filler wafers. Product and filler wafers are accommodated and heat-treated in the reaction vessel while controlling a heating unit using calculation results obtained using at least the calculation parameter and deviation between a set temperature and a temperature detected in the heating unit by a temperature detector.
摘要翻译：提供了适于提高设备运行速率的基板处理装置，半导体装置制造方法和温度控制方法。计算参数计算单元使用由第一计算参数设定单元确定的至少第一计算参数校正值，基于反应容器上累积的膜厚计算计算参数，由第二计算参数设定确定的第二计算参数校正值基于填充晶片上的累积膜厚的单位和由第三计算参数设定单元基于填充晶片的数量确定的第三计算参数校正值。使用至少计算参数获得的计算结果和通过温度检测器在加热单元中检测到的设定温度和温度之间的偏差来控制加热单元，从而在反应容器中容纳和热处理产物和填料晶片。

7. 发明授权

US06335599B1 Actuator for a drive mode shifting device 有权
标题翻译：驱动模式换档装置的执行器
公开(公告)号：US06335599B1
公开(公告)日：2002-01-01
申请号：US09609716
申请日：2000-06-30
申请人： Noriaki Nonaka , Tsukasa Iida , Mutsuroh Aoyama
发明人： Noriaki Nonaka , Tsukasa Iida , Mutsuroh Aoyama
IPC分类号： B60K17344
CPC分类号： B60K23/0808 , B60K17/3467
摘要： An actuator for a driving mode shifting device. A motor having a motor shaft which outputs rotational torque according to electrified electric current. An output member, which is moved by the rotational torque, shifts drive modes according to positions thereof. A torque transmitting mechanism transmits the rotational torque from the motor shaft to the output member. A control mechanism selects drive modes and controls the electric current to energize the motor so as to provide the selected drive mode. A one-way rotational mechanism is disposed between the motor shaft and the torque transmitting mechanism for preventing the motor shaft rotating against the motor. A rotational torque absorption mechanism is disposed between the one-way rotational mechanism and the torque transmitting mechanism for absorbing the rotational torque, when the motor shaft is rotated and the output member can not be moved. A rotational angle detecting means detects the rotational angle of the motor shaft.
摘要翻译：用于驱动模式移动装置的致动器。具有电动机轴的电动机，其根据带电电流输出转矩。通过旋转力矩移动的输出构件根据其位置移动驱动模式。扭矩传递机构将来自电动机轴的旋转扭矩传递到输出构件。控制机构选择驱动模式并控制电流以使电动机通电以提供所选择的驱动模式。电动机轴和转矩传递机构之间设置有单向旋转机构，用于防止电动机轴旋转抵抗电动机。旋转扭矩吸收机构设置在单向旋转机构和扭矩传递机构之间，用于吸收旋转扭矩，当电动机轴旋转并且输出构件不能移动时。旋转角检测装置检测电动机轴的旋转角度。

8. 发明授权

US08482426B2 Substrate processing apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US08482426B2
公开(公告)日：2013-07-09
申请号：US12805889
申请日：2010-08-23
申请人： Tsukasa Iida , Akihiko Yoneda , Kaori Inoshima
发明人： Tsukasa Iida , Akihiko Yoneda , Kaori Inoshima
IPC分类号： G08B3/00
CPC分类号： G05B23/0267 , G05B2219/31455 , G05B2219/45031 , H01L21/67253
摘要： It is intended to provide a substrate processing apparatus capable of reliably informing a running state of the apparatus. The substrate processing apparatus having a signal indicator for indicating the running state, including a signal indicator capable of setting at least one operation condition under which the signal indicator operates as well as of operating under anyone of a plurality of operation conditions and a display unit capable of displaying that a cause of the operation is anyone of the operation conditions during the operation of the signal indicator.
摘要翻译：旨在提供能够可靠地通知装置的运行状态的基板处理装置。所述基板处理装置具有用于指示运行状态的信号指示器，包括能够设定信号指示器工作的至少一个操作状态以及在多个操作条件中的任何一个下操作的信号指示器，以及能够显示的显示单元显示操作的原因是在信号指示器的操作期间的任何操作条件。

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