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    • 2. 发明申请
    • PLASMA PROCESSING APPARATUS AND METHOD
    • 等离子体加工设备和方法
    • US20140011365A1
    • 2014-01-09
    • US13590242
    • 2012-08-21
    • Naoki YASUINorihiko IKEDATooru ARAMAKIYasuhiro NISHIMORI
    • Naoki YASUINorihiko IKEDATooru ARAMAKIYasuhiro NISHIMORI
    • H01L21/3065
    • H01J37/32192H01J37/32082H01J37/32642H01L21/3065
    • To improve processing uniformity by improving a working characteristic in an edge exclusion region. Provided is a plasma processing apparatus for processing a sample by generating plasma in a vacuum vessel to which a processing gas is supplied and that is exhausted to a predetermined pressure and by applying a radio frequency bias to a sample placed in the vacuum vessel, wherein a conductive radio frequency ring to which a radio frequency bias power is applied is arranged in a stepped part formed outside a convex part of the sample stage on which the wafer is mounted, and a dielectric cover ring is provided in the stepped part, covering the radio frequency ring, the cover ring substantially blocks penetration of the radio frequency power to the plasma from the radio frequency ring, and the radio frequency ring top surface is set higher than a wafer top surface.
    • 通过改善边缘排除区域的工作特性来提高加工均匀性。 提供了一种等离子体处理装置,用于通过在供给处理气体的真空容器中产生等离子体并将其排出到预定压力并通过对放置在真空容器中的样品施加射频偏置来处理样品,其中a 在安装有晶片的样品台的凸部的外侧形成的台阶部布置有施加有射频偏置功率的导电射频环,并且在台阶部设置介电盖环,覆盖无线电 所述盖环基本上阻挡从所述射频环对所述等离子体的射频功率的穿透,并且所述射频环顶面被设定为高于晶片顶面。
    • 10. 发明授权
    • Plasma processing method
    • 等离子体处理方法
    • US07303998B2
    • 2007-12-04
    • US11002265
    • 2004-12-03
    • Tooru AramakiTsunehiko TsuboneRyujiro UdoMotohiko YoshigaiTakashi Fujii
    • Tooru AramakiTsunehiko TsuboneRyujiro UdoMotohiko YoshigaiTakashi Fujii
    • H01L21/302
    • C23C16/4581C23C16/4586C23C16/46H01J2237/2001H01L21/67109H01L21/6719
    • A plasma processing method for processing a sample by reducing a pressure within a processing chamber, including mounting the sample on a sample holder disposed in the processing chamber, and processing using a plasma generated in the processing chamber above the sample holder while supplying a gas for heat transfer to a space between a surface of the sample holder having the sample mounted thereon and a rear surface of the sample. The sample holder has a plurality of substantially ring-shaped depressed portions at the surface where the sample is mounted. A pressure in a space between the depressed portions arranged at a central portion of the sample holder with respect to outer circumferential portion and the sample is set to be lower than a pressure in a space between the depressed portions at the outer circumferential portion and the sample.
    • 一种用于通过减小处理室内的压力来处理样品的等离子体处理方法,包括将样品安装在设置在处理室中的样本保持器上,以及使用在样品架上方的处理室中产生的等离子体进行处理,同时为 热传递到安装有样品的样品保持器的表面与样品的后表面之间的空间。 样品保持器在样品安装的表面具有多个基本环形的凹陷部分。 设置在样品保持架的中心部分相对于外周部分的凹陷部分和样品之间的空间中的压力被设定为低于外周部分的凹陷部分和样品之间的空间中的压力 。