专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08513111B2 Forming semiconductor structures 有权
标题翻译：形成半导体结构
公开(公告)号：US08513111B2
公开(公告)日：2013-08-20
申请号：US11485078
申请日：2006-07-12
申请人： Robert P. Meagley , Kevin P. O'Brien , Tian-An Chen , Michael D. Goodner , James Powers , Huey-Chiang Liou
发明人： Robert P. Meagley , Kevin P. O'Brien , Tian-An Chen , Michael D. Goodner , James Powers , Huey-Chiang Liou
IPC分类号： H01L23/58
CPC分类号： H01L23/5222 , H01L21/02118 , H01L21/02134 , H01L21/02137 , H01L21/02164 , H01L21/0234 , H01L21/02351 , H01L21/312 , H01L21/76224 , H01L21/7682 , H01L21/76825 , H01L21/76826 , H01L21/76828 , H01L21/76829 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor structure may be covered with a thermally decomposing film. That film may then be covered by a sealing cover. Subsequently, the thermally decomposing material may be decomposed, forming a cavity.
摘要翻译：半导体结构可以被热分解膜覆盖。然后该膜可以被密封盖覆盖。随后，热分解材料可能被分解，形成空腔。

2. 发明授权

US08431223B2 Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications 有权
标题翻译：用于集成电路应用的低热膨胀系数（CTE）热固性树脂
公开(公告)号：US08431223B2
公开(公告)日：2013-04-30
申请号：US13550526
申请日：2012-07-16
申请人： James C. Matayabas, Jr. , Tian-An Chen
发明人： James C. Matayabas, Jr. , Tian-An Chen
IPC分类号： B32B27/26 , B32B27/38 , H01L23/29 , C08L63/00
CPC分类号： C08G59/18 , C08G59/20 , H01L2224/16245 , H01L2224/32245 , H01L2224/40245 , H01L2924/181 , Y10T428/2848 , Y10T428/31511 , Y10T428/31515 , H01L2924/00012
摘要： An embodiment of the present invention is a technique to form a resin. A mixture is formed by a curing agent dissolved in the epoxy resin. The epoxy resin contains a first rigid rod mesogen. The curing agent contains a second rigid rod mesogen and one of a hydroxyl, amine, and anhydride.
摘要翻译：本发明的一个实施方案是形成树脂的技术。混合物由溶解在环氧树脂中的固化剂形成。环氧树脂含有第一刚性棒介晶。固化剂含有第二刚性棒介晶和羟基，胺和酸酐之一。

3. 发明申请

US20070148360A1 LOW TEMPERATURE BUMPING PROCESS 有权
标题翻译：低温保存过程
公开(公告)号：US20070148360A1
公开(公告)日：2007-06-28
申请号：US11684739
申请日：2007-03-12
申请人： Terry Sterrett , Tian-An Chen , Saikumar Jayaraman
发明人： Terry Sterrett , Tian-An Chen , Saikumar Jayaraman
IPC分类号： B05D7/00
CPC分类号： C08L101/12 , B29C39/026 , B29C70/58 , B29C70/882 , B29L2031/3406 , C08J5/10 , H01L24/10 , H01L24/13 , H01L2224/13 , H01L2224/13099 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01082 , H01L2924/14 , H01L2924/30107 , H05K3/321 , H05K2201/0367 , H05K2201/10674 , H05K2201/10719 , Y10T428/24917 , Y10T428/25 , Y10T428/31681 , H01L2924/00 , H01L2224/0401
摘要： A method for low temperature bumping is disclosed. A resin capable of being cross-linked by free-radical or cationic polymerization at low temperature is provided. Electrically conductive particles are then added to the resin to form a mixture. The mixture is then activated by heat or exposure to light to polymerize the mixture. In an alternative embodiment, a vinyl ether resin is used, to which electrically conductive particles are added. The mixture is polymerized by exposure to light.
摘要翻译：公开了一种低温碰撞的方法。提供能够在低温下通过自由基或阳离子聚合交联的树脂。然后将导电颗粒加入到树脂中以形成混合物。然后通过加热或暴露于光使混合物活化，以使混合物聚合。在替代实施方案中，使用乙烯基醚树脂，其中加入导电颗粒。混合物通过曝光聚合。

4. 发明申请

US20070117263A1 Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material 审中-公开
标题翻译：具有聚苯并恶嗪类膜作为底部填充材料的微电子或光电子封装
公开(公告)号：US20070117263A1
公开(公告)日：2007-05-24
申请号：US11651273
申请日：2007-01-08
申请人： Song-Hua Shi , Lejun Wang , Tian-An Chen
发明人： Song-Hua Shi , Lejun Wang , Tian-An Chen
IPC分类号： H01L21/00
CPC分类号： C08G73/02 , B32B27/08 , C08L79/02 , C09J161/34 , C09J179/04 , H01B3/303 , H01B3/38 , H01L21/563 , H01L23/293 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/29 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01051 , H01L2924/01056 , H01L2924/0665 , H01L2924/14 , H01L2924/3025 , H05K3/323 , H05K2201/0269 , Y10T428/12528 , Y10T428/31511 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： Microelectronic and optoelectronic packaging embodiments are described with underfill materials including polybenzoxazine, having the general formula:
摘要翻译：使用具有以下通式的聚苯并恶嗪的底部填充材料描述微电子和光电子封装实施例：

5. 发明申请

US20060025500A1 No-flow underfill composition and method 有权
公开(公告)号：US20060025500A1
公开(公告)日：2006-02-02
申请号：US11238596
申请日：2005-09-29
申请人： Christopher Rumer , Tian-An Chen , Vijay Wakharkar , Paul Koning
发明人： Christopher Rumer , Tian-An Chen , Vijay Wakharkar , Paul Koning
IPC分类号： C08K9/00
CPC分类号： H01L24/31 , H01L21/563 , H01L23/295 , H01L24/29 , H01L24/81 , H01L2224/16225 , H01L2224/29499 , H01L2224/32225 , H01L2224/32505 , H01L2224/73203 , H01L2224/73204 , H01L2224/81193 , H01L2224/81801 , H01L2224/83192 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01021 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/3512 , H01L2924/00 , H01L2924/00012
摘要： In some embodiments, a method includes providing a composition which includes a base at least partially filled with filler particles and applying the composition as an underfill composition. At least some of the filler particles are electrically conductive.

6. 发明授权

US06982492B2 No-flow underfill composition and method 失效
公开(公告)号：US06982492B2
公开(公告)日：2006-01-03
申请号：US10692062
申请日：2003-10-23
申请人： Christopher L. Rumer , Tian-An Chen , Vijay Wakharkar , Paul A. Koning
发明人： Christopher L. Rumer , Tian-An Chen , Vijay Wakharkar , Paul A. Koning
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/31 , H01L21/563 , H01L23/295 , H01L24/29 , H01L24/81 , H01L2224/16225 , H01L2224/29499 , H01L2224/32225 , H01L2224/32505 , H01L2224/73203 , H01L2224/73204 , H01L2224/81193 , H01L2224/81801 , H01L2224/83192 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01021 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/3512 , H01L2924/00 , H01L2924/00012
摘要： In some embodiments, a method includes providing a composition which includes a base at least partially filled with filler particles and applying the composition as an underfill composition. At least some of the filler particles are electrically conductive.

7. 发明申请

US20050288454A1 Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications 有权
标题翻译：用于集成电路应用的低热膨胀系数（CTE）热固性树脂
公开(公告)号：US20050288454A1
公开(公告)日：2005-12-29
申请号：US10876444
申请日：2004-06-25
申请人： James Matayabas , Tian-An Chen
发明人： James Matayabas , Tian-An Chen
IPC分类号： C08G59/14 , C08G59/18 , C08G59/20
CPC分类号： C08G59/18 , C08G59/20 , H01L2224/16245 , H01L2224/32245 , H01L2224/40245 , H01L2924/181 , Y10T428/2848 , Y10T428/31511 , Y10T428/31515 , H01L2924/00012
摘要： An embodiment of the present invention is a technique to form a resin. A mixture is formed by a curing agent dissolved in the epoxy resin. The epoxy resin contains a first rigid rod mesogen. The curing agent contains a second rigid rod mesogen and one of a hydroxyl, amine, and anhydride.
摘要翻译：本发明的一个实施方案是形成树脂的技术。混合物由溶解在环氧树脂中的固化剂形成。环氧树脂含有第一刚性棒介晶。固化剂含有第二刚性棒介晶和羟基，胺和酸酐之一。

9. 发明授权

US06303733B1 Poly(arylene ether) homopolymer compositions and methods of manufacture thereof 失效
标题翻译：聚（亚芳基醚）均聚物组合物及其制造方法
公开(公告)号：US06303733B1
公开(公告)日：2001-10-16
申请号：US09197478
申请日：1998-11-20
申请人： Kreisler S. Y. Lau , Tian-An Chen , Boris A. Korolev , Emma Brouk
发明人： Kreisler S. Y. Lau , Tian-An Chen , Boris A. Korolev , Emma Brouk
IPC分类号： C08G7902
CPC分类号： C08G65/40 , C08G65/4006 , C08G65/4012 , C08G65/4025 , C08G2650/48 , C08L2203/20 , H01L23/49894 , H01L23/5329 , H01L2924/0002 , H01L2924/12044 , H05K1/0326 , Y10T428/31504 , H01L2924/00
摘要： Dielectric compositions encompassing one or more poly(arylene ether) polymers are provided. The dielectric compositions have the repetitive structural unit: where n=1 to 200, Y and Ar are each a divalent arylene radical, Y derived from bisphenol compounds of general formula HO—Y—OH, Ar derived from difluoro diarylacetylenes and/or ethynylated benzophenones of general formula F—Ar—F and Z is optionally hydrogen, a methyl group or derived from a monofluoro-benzophenone derivative of general formula Z—F. Such poly(arylene ether) polymers are employed with a variety of microelectronic devices, for example, integrated circuits and multichip modules.
摘要翻译：提供包含一种或多种聚（亚芳基醚）聚合物的介电组合物。介电组合物具有重复的结构单元：其中n = 1-200，Y和Ar各自为二价亚芳基，Y衍生自通式HO-Y-OH的双酚化合物，衍生自二氟二芳基乙炔和/或乙炔二苯甲酮的Ar 的通式为F-Ar-F，Z为氢，甲基或衍生自通式ZF的一氟二苯甲酮衍生物。这种聚（亚芳基醚）聚合物用于各种微电子器件，例如集成电路和多芯片模块。

10. 发明授权

US06172128B2 Nanoporous polymers crosslinked via cyclic structures 失效
标题翻译：通过环状结构交联的纳米多孔聚合物
公开(公告)号：US06172128B2
公开(公告)日：2001-01-09
申请号：US09544722
申请日：2000-04-06
申请人： Kreisler Lau , Tian-An Chen , Roger Leung
发明人： Kreisler Lau , Tian-An Chen , Roger Leung
IPC分类号： C08J902
CPC分类号： C08J3/246 , C08J9/26 , C08J2201/046
摘要： Nanoporous polymeric materials are fabricated in which polymeric strands are crosslinked via ring structures. Preferred ring structures are formed de novo during crosslinking, and at least some of the ring structures are preferably included in the backbones of the strands. At least one of the ring structures may advantageously comprise an aromatic structure, and may more advantageously comprise a benzyl moiety. Especially preferred polymers comprise a poly(arylene ether) synthesized from a difluoroaromatic portion and an aromatic bisphenolic portion. In another preferred aspect, the difluoroaromatic portions of the poly(arylene ether) carry at least two different crosslinking functionalities. In an even more preferred aspect, the crosslinking functionalities comprise an ethynyl and a tetracyclone. Nanoporosity is preferably introduced by thermolyzing one or more thermolabile portions in the crosslinked polymer. An especially preferred thermolabile portion comprises ethylene glycol-poly(caprolactone).
摘要翻译：制造纳米多孔聚合材料，其中聚合物链通过环结构交联。优选的环结构在交联期间从头形成，并且至少一些环结构优选包含在该链的主链中。至少一个环结构可以有利地包含芳族结构，并且可以更有利地包含苄基部分。特别优选的聚合物包括由二氟芳族部分和芳族双酚部分合成的聚（亚芳基醚）。在另一个优选的方面，聚（亚芳基醚）的二氟芳香族部分携带至少两种不同的交联官能团。在更优选的方面，交联官能团包括乙炔基和四环。优选通过热交换聚合物中的一个或多个热不稳定部分来引入纳米孔。特别优选的耐热不稳定部分包括乙二醇 - 聚（己内酯）。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式