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1. 发明申请

US20070148360A1 LOW TEMPERATURE BUMPING PROCESS 有权
标题翻译：低温保存过程
公开(公告)号：US20070148360A1
公开(公告)日：2007-06-28
申请号：US11684739
申请日：2007-03-12
申请人： Terry Sterrett , Tian-An Chen , Saikumar Jayaraman
发明人： Terry Sterrett , Tian-An Chen , Saikumar Jayaraman
IPC分类号： B05D7/00
CPC分类号： C08L101/12 , B29C39/026 , B29C70/58 , B29C70/882 , B29L2031/3406 , C08J5/10 , H01L24/10 , H01L24/13 , H01L2224/13 , H01L2224/13099 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01082 , H01L2924/14 , H01L2924/30107 , H05K3/321 , H05K2201/0367 , H05K2201/10674 , H05K2201/10719 , Y10T428/24917 , Y10T428/25 , Y10T428/31681 , H01L2924/00 , H01L2224/0401
摘要： A method for low temperature bumping is disclosed. A resin capable of being cross-linked by free-radical or cationic polymerization at low temperature is provided. Electrically conductive particles are then added to the resin to form a mixture. The mixture is then activated by heat or exposure to light to polymerize the mixture. In an alternative embodiment, a vinyl ether resin is used, to which electrically conductive particles are added. The mixture is polymerized by exposure to light.
摘要翻译：公开了一种低温碰撞的方法。提供能够在低温下通过自由基或阳离子聚合交联的树脂。然后将导电颗粒加入到树脂中以形成混合物。然后通过加热或暴露于光使混合物活化，以使混合物聚合。在替代实施方案中，使用乙烯基醚树脂，其中加入导电颗粒。混合物通过曝光聚合。

2. 发明授权

US07521115B2 Low temperature bumping process 有权
标题翻译：低温碰撞过程
公开(公告)号：US07521115B2
公开(公告)日：2009-04-21
申请号：US10321060
申请日：2002-12-17
申请人： Terry Lee Sterrett , Tian An Chen , Saikumar Jayaraman
发明人： Terry Lee Sterrett , Tian An Chen , Saikumar Jayaraman
IPC分类号： B32B9/00
CPC分类号： C08L101/12 , B29C39/026 , B29C70/58 , B29C70/882 , B29L2031/3406 , C08J5/10 , H01L24/10 , H01L24/13 , H01L2224/13 , H01L2224/13099 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01082 , H01L2924/14 , H01L2924/30107 , H05K3/321 , H05K2201/0367 , H05K2201/10674 , H05K2201/10719 , Y10T428/24917 , Y10T428/25 , Y10T428/31681 , H01L2924/00 , H01L2224/0401
摘要： A method for low temperature bumping is disclosed. A resin capable of being cross-linked by free-radical or cationic polymerization at low temperature is provided. Electrically conductive particles are then added to the resin to form a mixture. The mixture is then activated by heat or exposure to light to polymerize the mixture. In an alternative embodiment, a vinyl ether resin is used, to which electrically conductive particles are added. The mixture is polymerized by exposure to light.
摘要翻译：公开了一种低温碰撞的方法。提供能够在低温下通过自由基或阳离子聚合交联的树脂。然后将导电颗粒加入到树脂中以形成混合物。然后通过加热或暴露于光使混合物活化，以使混合物聚合。在替代实施方案中，使用乙烯基醚树脂，其中加入导电颗粒。混合物通过曝光聚合。

3. 发明授权

US07718216B2 Low temperature bumping process 有权
标题翻译：低温碰撞过程
公开(公告)号：US07718216B2
公开(公告)日：2010-05-18
申请号：US11684739
申请日：2007-03-12
申请人： Terry Lee Sterrett , Tian-An Chen , Saikumar Jayaraman
发明人： Terry Lee Sterrett , Tian-An Chen , Saikumar Jayaraman
IPC分类号： B05D5/12
CPC分类号： C08L101/12 , B29C39/026 , B29C70/58 , B29C70/882 , B29L2031/3406 , C08J5/10 , H01L24/10 , H01L24/13 , H01L2224/13 , H01L2224/13099 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01082 , H01L2924/14 , H01L2924/30107 , H05K3/321 , H05K2201/0367 , H05K2201/10674 , H05K2201/10719 , Y10T428/24917 , Y10T428/25 , Y10T428/31681 , H01L2924/00 , H01L2224/0401
摘要： A method for low temperature bumping is disclosed. A resin capable of being cross-linked by free-radical or cationic polymerization at low temperature is provided. Electrically conductive particles are then added to the resin to form a mixture. The mixture is then activated by heat or exposure to light to polymerize the mixture. In an alternative embodiment, a vinyl ether resin is used, to which electrically conductive particles are added. The mixture is polymerized by exposure to light.
摘要翻译：公开了一种低温碰撞的方法。提供能够在低温下通过自由基或阳离子聚合交联的树脂。然后将导电颗粒加入到树脂中以形成混合物。然后通过加热或暴露于光使混合物活化，以使混合物聚合。在替代实施方案中，使用乙烯基醚树脂，其中加入导电颗粒。混合物通过曝光聚合。

4. 发明申请

US20050068757A1 Stress compensation layer systems for improved second level solder joint reliability 审中-公开
标题翻译：应力补偿层系统可提高二级焊点的可靠性
公开(公告)号：US20050068757A1
公开(公告)日：2005-03-31
申请号：US10676548
申请日：2003-09-30
申请人： Saikumar Jayaraman , Terry Sterrett , Connie Gettinger , Vijay Wakharkar , Agnes Padovani
发明人： Saikumar Jayaraman , Terry Sterrett , Connie Gettinger , Vijay Wakharkar , Agnes Padovani
IPC分类号： H01L23/498 , H05K1/02 , H05K3/34 , H05K1/11 , H05K1/14
CPC分类号： H01L23/49816 , H01L2224/16225 , H01L2924/15311 , H05K1/0271 , H05K3/3436 , H05K2201/10977 , Y02P70/613
摘要： According to one aspect of the present invention, an electronic assembly and a method of forming an electronic assembly are provided. A semiconductor package includes a package substrate with a microelectronic die mounted to a first side and contact formations attached to a second side thereof. A stress compensation layer is formed on the first surface between the contact formations. The semiconductor package is then attached to a circuit board leaving an air space between the stress compensation layer and the circuit board. The stress compensation layer reduces stress on the contact formations and increases solder joint reliability.
摘要翻译：根据本发明的一个方面，提供一种电子组件和一种形成电子组件的方法。半导体封装包括具有安装到第一侧的微电子管芯的封装衬底和附接到其第二侧的接触结构。在接触层之间的第一表面上形成应力补偿层。然后，半导体封装被附接到电路板，留下应力补偿层和电路板之间的空气空间。应力补偿层减少了接触层的应力，增加了焊点的可靠性。

5. 发明授权

US09349698B2 Integrated WLUF and SOD process 有权
标题翻译：集成WLUF和SOD过程
公开(公告)号：US09349698B2
公开(公告)日：2016-05-24
申请号：US13534565
申请日：2012-06-27
申请人： Rubayat Mahmud , Saikumar Jayaraman , Sriram Muthukumar
发明人： Rubayat Mahmud , Saikumar Jayaraman , Sriram Muthukumar
IPC分类号： H01L23/48 , H01L23/00 , H01L23/31
CPC分类号： H01L24/05 , H01L23/3157 , H01L24/03 , H01L24/11 , H01L24/13 , H01L24/14 , H01L2224/02126 , H01L2224/0384 , H01L2224/03845 , H01L2224/0391 , H01L2224/0401 , H01L2224/05025 , H01L2224/05147 , H01L2224/05567 , H01L2224/05571 , H01L2224/05647 , H01L2224/1132 , H01L2224/1147 , H01L2224/11474 , H01L2224/1148 , H01L2224/11849 , H01L2224/13007 , H01L2224/13026 , H01L2924/00014 , H01L2924/351 , H01L2924/00012 , H01L2224/05552
摘要： This disclosure relates generally to a wafer having a plurality of semiconductor chips having a major surface, a metal contact positioned on one of the plurality of semiconductor chips and having a side surface and contact surface, the contact surface substantially parallel to the major surface, wherein the contact surface defines a thickness of the metal contact relative to the major surface, an underfill layer abutting the one of the plurality of semiconductor chips and the side surface of the metal contact, the underfill layer having a top surface substantially parallel to the major surface, wherein the top surface of the underfill layer defines a thickness of the underfill layer relative to the major surface, the thickness of the underfill layer being not greater than the thickness of the metal contact, and a solder bump formed in electrical contact with the contact surface of the metal contact.
摘要翻译：本公开总体上涉及具有多个具有主表面的半导体芯片的晶片，位于多个半导体芯片之一上的金属触点，并且具有侧表面和接触表面，该接触表面基本上平行于主表面，其中所述接触表面限定所述金属接触件相对于所述主表面的厚度，底部填充层邻接所述多个半导体芯片中的一个和所述金属接触件的侧表面，所述底部填充层具有基本上平行于所述主表面的顶表面其中所述底部填充层的顶表面相对于所述主表面限定所述底部填充层的厚度，所述底部填充层的厚度不大于所述金属接触件的厚度，以及形成为与所述触点电接触的焊料凸块表面的金属接触。

6. 发明授权

US07910674B2 Polymerized cycloolefins using transition metal catalyst and end products thereof 有权
标题翻译：使用过渡金属催化剂及其最终产物的聚合环烯烃
公开(公告)号：US07910674B2
公开(公告)日：2011-03-22
申请号：US10464978
申请日：2003-06-18
申请人： Larry Funderburk Rhodes , Andrew Bell , Ramakrishna Ravikiran , John C. Fondran , Saikumar Jayaraman , Brian Leslie Goodall , Richard A. Mimna , John-Henry Lipian
发明人： Larry Funderburk Rhodes , Andrew Bell , Ramakrishna Ravikiran , John C. Fondran , Saikumar Jayaraman , Brian Leslie Goodall , Richard A. Mimna , John-Henry Lipian
IPC分类号： C08F32/00 , G01R31/26 , H01L21/00 , H01L21/82 , H01L23/58 , H01L23/02 , H01L23/14 , H01L23/29
CPC分类号： C08G61/06 , C08F32/00 , C08F32/08 , G02B1/04 , C08L65/00
摘要： Methods for the addition polymerization of cycloolefins using a cationic Group 10 metal complex and a weakly coordinating anion of the formula: [(R′)zM(L′)x(L″)y]b[WCA]d wherein [(R′)zM(L′)x(L″)y] is a cation complex where M represents a Group 10 transition metal; R′ represents an anionic hydrocarbyl containing ligand; L′ represents a Group 15 neutral electron donor ligand; L″ represents a labile neutral electron donor ligand; x is 1 or 2; and y is 0, 1, 2, or 3; and z is 0 or 1, wherein the sum of x, y, and z is 4; and [WCA] represents a weakly coordinating counteranion complex; and b and d are numbers representing the number of times the cation complex and weakly coordinating counteranion complex are taken to balance the electronic charge on the overall catalyst complex.
摘要翻译：使用阳离子第10族金属络合物和式（[（R'）z M（L'）x（L“）y] b [WCA] d的弱配位阴离子进行环烯加成聚合的方法，其中[（R' ）zM（L'）x（L“）y]是阳离子络合物，其中M表示第10族过渡金属; R'表示含阴离子烃基的配体; L'表示15族中性电子给体配体; L“表示不稳定的中性电子给体配体; x为1或2; y为0,1,2或3; 且z为0或1，其中x，y和z之和为4; 和[WCA]代表弱协调的对抗综合体; b和d是表示阳离子络合物和弱配位抗衡阴离子络合物在总体催化剂络合物上平衡电荷的次数的数字。

7. 发明授权

US07387841B2 Silicone-based cyanate-ester cross-linkable die attach adhesive 有权
标题翻译：硅基氰酸酯 - 可交联的芯片附着胶
公开(公告)号：US07387841B2
公开(公告)日：2008-06-17
申请号：US11013626
申请日：2004-12-15
申请人： Saikumar Jayaraman
发明人： Saikumar Jayaraman
IPC分类号： B32B9/04
CPC分类号： C09D183/04 , C08K3/32 , C08K5/5419 , Y10T428/31663
摘要： The present invention describes a method including: providing a material A, the material A including a siloxane backbone with a hydride functional group; reacting the material A with a material B in the presence of a catalyst to form a material C, the material B including an alkenyl functional group and an aromatic carbonate functional group; heating the material C to form a material D, the material D including a phenol functional group; and reacting the material D with a material E and a material F to form a material G, the material E including a cyanogen halide, the material F including an acid acceptor, the material G including an aromatic cyanate ester functional group. The present invention further describes a die attach adhesive including a three-dimensional network of substituted triazine rings.
摘要翻译：本发明描述了一种方法，包括：提供材料A，包含具有氢化物官能团的硅氧烷主链的材料A; 在催化剂存在下使材料A与材料B反应形成材料C，材料B包括链烯基官能团和芳族碳酸酯官能团; 加热材料C以形成材料D，材料D包括酚官能团; 并使材料D与材料E和材料F反应以形成材料G，所述材料E包括卤化氰，包括酸受体的材料F，所述材料G包括芳族氰酸酯官能团。本发明进一步描述了包含取代的三嗪环的三维网络的管芯附着粘合剂。

8. 发明授权

US07332807B2 Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same 有权
标题翻译：具有用于体偏置的电介质障碍物的芯片封装热界面材料，其使用方法以及含有它们的体系
公开(公告)号：US07332807B2
公开(公告)日：2008-02-19
申请号：US11323512
申请日：2005-12-30
申请人： Ashay A. Dani , Anna M. Prakash , Saikumar Jayaraman , Mitesh Patel , Vijay S. Wakharkar
发明人： Ashay A. Dani , Anna M. Prakash , Saikumar Jayaraman , Mitesh Patel , Vijay S. Wakharkar
IPC分类号： H01L23/10 , H05K7/20
CPC分类号： H01L23/3737 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/2929 , H01L2224/293 , H01L2224/29486 , H01L2224/2949 , H01L2224/29499 , H01L2224/32245 , H01L2224/73253 , H01L2924/00014 , H01L2924/01079 , H01L2924/01327 , H01L2924/15311 , H01L2924/16152 , H01L2924/00 , H01L2224/05599
摘要： A chip package includes a thermal interface material disposed between a die backside and a heat sink. The thermal interface material includes a first metal particle that is covered by a dielectric film. The dielectric film is selected from an inorganic compound of the first metal or an inorganic compound coating of a second metal. The dielectric film diminishes overall heat transfer from the first metal particle in the thermal interface material by a small fraction of total possible heat transfer without the dielectric film. A method of operating the chip includes biasing the chip with the dielectric film in place.
摘要翻译：芯片封装包括设置在模具背面和散热器之间的热界面材料。热界面材料包括由电介质膜覆盖的第一金属颗粒。电介质膜选自第一金属的无机化合物或第二金属的无机化合物涂层。电介质膜减少热界面材料中的第一金属颗粒的总传热量，而不需要电介质膜的总可能传热的一小部分。一种操作该芯片的方法包括：将该电介质膜的芯片偏压就位。

9. 发明授权

US07312292B2 Polycyclic polymers containing pendant ion conducting moieties 有权
标题翻译：含有侧离子导电部分的多环聚合物
公开(公告)号：US07312292B2
公开(公告)日：2007-12-25
申请号：US10860876
申请日：2004-06-04
申请人： Ravi Ravikiran , Xiaoming Wu , Larry F. Rhodes , Robert A. Shick , Hiroko Nakano , Hirotaka Nonaka , Huabin Wang , Saikumar Jayaraman , Robert John Duff , John-Henry Lipian
发明人： Ravi Ravikiran , Xiaoming Wu , Larry F. Rhodes , Robert A. Shick , Hiroko Nakano , Hirotaka Nonaka , Huabin Wang , Saikumar Jayaraman , Robert John Duff , John-Henry Lipian
IPC分类号： C08F30/02
CPC分类号： C08J5/2256 , C08G61/06 , C08J2385/04 , H01B1/122 , H01M4/8605 , H01M8/1023 , H01M8/1025 , H01M8/1032 , H01M8/1039
摘要： A polymer comprising polycyclic repeating units having recurring ion conducting groups and optional crosslinkable groups is disclosed. The present invention provides the capability of tailoring polymers to impart unique properties to membranes fabricated from the polymers. Membranes comprising the polymers and methods for preparing the membranes and their use in ion conducting membranes, particularly in fuel cells, are also provided.
摘要翻译：公开了包含具有重复离子导电基团和任选的可交联基团的多环重复单元的聚合物。本发明提供了定制聚合物以赋予由聚合物制造的膜独特的性能的能力。还提供了包含聚合物的膜和用于制备膜的方法及其在离子传导膜中的用途，特别是在燃料电池中。

10. 发明申请

US20070287005A1 Phase change material containing fusible particles as thermally conductive filler 有权
标题翻译：相变材料含有可熔颗粒作为导热填料
公开(公告)号：US20070287005A1
公开(公告)日：2007-12-13
申请号：US11893420
申请日：2007-08-15
申请人： Saikumar Jayaraman , Paul Koning , Ashay Dani
发明人： Saikumar Jayaraman , Paul Koning , Ashay Dani
IPC分类号： B32B5/16 , B32B18/00 , H01S4/00
CPC分类号： H01L23/3737 , C08K3/08 , C08K3/22 , H01L23/4275 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H01L2924/15312 , H01L2924/16152 , Y10T29/49002 , Y10T29/49083 , Y10T29/49099 , Y10T29/4913 , Y10T428/12701 , Y10T428/12896 , Y10T428/23 , Y10T428/25 , Y10T428/252 , Y10T428/2982 , H01L2924/00
摘要： A thermal interface material made with a phase change polymer and a fusible filler material.
摘要翻译：由相变聚合物和易熔填料制成的热界面材料。

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