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1. 发明授权

US08783753B2 Stowable rear seat 有权
标题翻译：后排座椅
公开(公告)号：US08783753B2
公开(公告)日：2014-07-22
申请号：US13978619
申请日：2011-12-28
申请人： Teppei Ito , Kazuyuki Kaneko
发明人： Teppei Ito , Kazuyuki Kaneko
IPC分类号： B60N2/30
CPC分类号： B60N2/10 , B60N2/0155 , B60N2/2245 , B60N2/3013 , B60N2/305 , B60N2/3065 , B60N2/3075 , B60N2/309 , B60N2/36 , B60N2/366 , B60N2002/948
摘要： A stowable rear seat, wherein a seat back section comprises: a seat back body stood in a floor surface so as to tilt freely; a seat back locking mechanism that locks the tilting of the seat back body; and a swinging member that swings in the forward/backward direction in conjunction with the tilting movement of the seat back body when the lock of the seat back locking mechanism is released and the seat back body tilts. The seat cushion section of the stowable rear seat comprises: a seat cushion body freely housed in the underfoot floor surface and arranged horizontally in the floor surface in front of the seat back body, and a seat cushion locking mechanism that locks the seat cushion body in a horizontal state on the floor surface.
摘要翻译：一种可收起的后座椅，其中座椅靠背部分包括：座椅靠背体，其自由倾斜地站立在地板表面上; 座椅靠背锁定机构，其锁定座椅靠背体的倾斜; 以及当座椅靠背锁定机构的锁定被释放并且座椅靠背体倾斜时，结合座椅靠背体的倾斜运动而在前后方向上摆动的摆动构件。可收起的后排座椅的座垫部分包括：坐垫体，其自由地容纳在脚下地板表面中并且水平地布置在座椅靠背体前面的地板表面中;以及座垫锁定机构，其将座垫主体锁定在在地面上的水平状态。

2. 发明授权

US09126503B2 Stowable rear seat 有权
标题翻译：后排座椅
公开(公告)号：US09126503B2
公开(公告)日：2015-09-08
申请号：US13978476
申请日：2011-12-28
申请人： Teppei Ito
发明人： Teppei Ito
IPC分类号： B60N2/015 , B60N2/30 , B60N2/36
CPC分类号： B60N2/01516 , B60N2/0155 , B60N2/3013 , B60N2/305 , B60N2/3065 , B60N2/36
摘要： A stowable rear seat includes a seat back unit; and a seat cushion unit. The seat back unit includes a tiltable seat back erected on a floor surface; a seat back locking mechanism for locking a tilt of the seat back; and a rocking member rocking in cooperation with a tilting operation of the seat back after unlocking the seat back locking mechanism. The seat cushion unit includes a seat cushion horizontally placed on the floor surface in front of the seat back, the seat cushion being foldable on a foot floor surface at a lower position than the floor surface; a lock shaft provided at a back end of the seat cushion; and a seat cushion locking mechanism provided in the floor surface, the seat cushion locking mechanism engaging with the lock shaft to lock a horizontal state of the seat cushion on the floor surface.
摘要翻译：可收起的后排座椅包括座椅靠背单元; 和座垫单元。座椅靠背单元包括竖立在地板表面上的可倾斜座椅靠背; 座椅靠背锁定机构，用于锁定座椅靠背的倾斜; 以及在解锁座椅靠背锁定机构之后与座椅靠背的倾斜操作协同摇摆的摇摆构件。座垫单元包括水平放置在座椅靠背前面的地板表面上的座垫，座垫可在比地板表面更低的位置处在脚踏板表面上折叠; 设置在所述座垫的后端的锁定轴; 以及设置在地板表面的座垫锁定机构，座垫锁定机构与锁定轴接合，以将座垫的水平状态锁定在地板表面上。

3. 发明授权

US08871660B2 Laminated body, circuit board including laminated body, semiconductor package and process for manufacturing laminated body 有权
标题翻译：层叠体，层叠体的电路基板，半导体封装以及层叠体的制造工序
公开(公告)号：US08871660B2
公开(公告)日：2014-10-28
申请号：US12523320
申请日：2008-02-07
申请人： Kazuyuki Yoshizaki , Teppei Ito , Iji Onozuka , Kensuke Nakamura
发明人： Kazuyuki Yoshizaki , Teppei Ito , Iji Onozuka , Kensuke Nakamura
IPC分类号： B32B15/14 , B32B27/38 , D03D13/00 , B32B5/08 , B32B5/26 , H05K1/03 , D04H13/00 , B29C65/00 , B32B5/28 , B32B5/12 , H05K1/02
CPC分类号： H05K1/0366 , B32B5/024 , B32B5/12 , B32B5/22 , B32B5/26 , B32B5/28 , B32B15/14 , B32B15/18 , B32B15/20 , B32B27/12 , B32B27/281 , B32B27/304 , B32B27/32 , B32B27/322 , B32B27/36 , B32B29/005 , B32B29/02 , B32B2260/021 , B32B2260/028 , B32B2260/046 , B32B2262/02 , B32B2262/0261 , B32B2262/0269 , B32B2262/0276 , B32B2262/101 , B32B2307/30 , B32B2307/50 , B32B2307/54 , B32B2307/718 , B32B2457/08 , H05K1/0271 , H05K1/036 , H05K2201/029 , H05K2201/09136 , Y10T156/10 , Y10T428/24124 , Y10T442/2951 , Y10T442/3179 , Y10T442/3301 , Y10T442/3415 , Y10T442/3431 , Y10T442/3463 , Y10T442/3496
摘要： There is provided a laminated body comprising a first resin layer consisting of a first fibrous base material and a resin and a second resin layer consisting of a second fibrous base material and a resin, wherein the first resin layer and the second resin layer are disposed such that the first resin layer and the second resin layer are at least partly positioned in separate regions separated by the center line in a thickness direction of the laminated body; wherein at least one of the first fibrous base material and the second fibrous base material has a bowing region where a bowing region is a region in which a smaller warp/weft crossing angle is less than 90° in the fibrous base material; and wherein in the bowing region, an angle formed by a warp of the first fibrous base material and a warp of the second fibrous base material and an angle formed by a weft of the first fibrous base material and a weft of the second fibrous base material, whichever is larger, is 2° or less.
摘要翻译：提供了一种层叠体，其包括由第一纤维基材和树脂构成的第一树脂层和由第二纤维基材和树脂组成的第二树脂层，其中第一树脂层和第二树脂层被设置为所述第一树脂层和所述第二树脂层至少部分地位于沿所述层叠体的厚度方向由所述中心线分开的分离区域中; 其中所述第一纤维基材和所述第二纤维基材中的至少一个具有弯曲区域，在所述弯曲区域中，所述纤维基材中弯曲区域是较小经纱/纬纱交叉角度小于90°的区域; 并且其中在所述弯曲区域中，由所述第一纤维基材的翘曲和所述第二纤维基材的翘曲形成的角度和由所述第一纤维基材的纬纱和所述第二纤维基材的纬纱形成的角度以较大者为准，为2°以下。

4. 发明申请

US20130278005A1 STOWABLE REAR SEAT 有权
标题翻译：可靠的后座
公开(公告)号：US20130278005A1
公开(公告)日：2013-10-24
申请号：US13978619
申请日：2011-12-28
申请人： Teppei Ito , Kazuyuki Kaneko
发明人： Teppei Ito , Kazuyuki Kaneko
IPC分类号： B60N2/10
CPC分类号： B60N2/10 , B60N2/0155 , B60N2/2245 , B60N2/3013 , B60N2/305 , B60N2/3065 , B60N2/3075 , B60N2/309 , B60N2/36 , B60N2/366 , B60N2002/948
摘要： A stowable rear seat, wherein a seat back section comprises: a seat back body stood in a floor surface so as to tilt freely; a seat back locking mechanism that locks the tilting of the seat back body; and a swinging member that swings in the forward/backward direction in conjunction with the tilting movement of the seat back body when the lock of the seat back locking mechanism is released and the seat back body tilts. The seat cushion section of the stowable rear seat comprises: a seat cushion body freely housed in the underfoot floor surface and arranged horizontally in the floor surface in front of the seat back body, and a seat cushion locking mechanism that locks the seat cushion body in a horizontal state on the floor surface.
摘要翻译：一种可收起的后座椅，其中座椅靠背部分包括：座椅靠背体，其自由倾斜地站立在地板表面上; 座椅靠背锁定机构，其锁定座椅靠背体的倾斜; 以及当座椅靠背锁定机构的锁定被释放并且座椅靠背体倾斜时，结合座椅靠背体的倾斜运动而在前后方向上摆动的摆动构件。可收起的后排座椅的座垫部分包括：坐垫体，其自由地容纳在脚下地板表面中并且水平地布置在座椅靠背体前面的地板表面中;以及座垫锁定机构，其将座垫主体锁定在在地面上的水平状态。

5. 发明申请

US20100258938A1 SUBSTRATE AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：基板和半导体器件
公开(公告)号：US20100258938A1
公开(公告)日：2010-10-14
申请号：US12742926
申请日：2007-12-05
申请人： Teppei Ito , Hitoshi Kawaguchi , Hiroyuki Tanaka
发明人： Teppei Ito , Hitoshi Kawaguchi , Hiroyuki Tanaka
IPC分类号： H01L23/498 , H05K1/03
CPC分类号： H05K1/0271 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H05K1/0224 , H05K3/4602 , H05K3/4682 , H05K2201/068 , H05K2201/09136 , H05K2201/09236 , H05K2201/09681 , H05K2201/09709 , H01L2924/00 , H01L2224/0401
摘要： A substrate (3) has a build-up layer in which insulating layers containing a resin and conductor interconnect layers (312) are alternately laminated and the conductor interconnect layers (312) are mutually connected through the conductor layer formed in a via-hole of the insulating layer. A conductor interconnect layer (312D) arranged on the outermost surface side of a substrate among the conductor interconnect layers (312) has a plurality of signal lines (312D1) formed in a signal line arrangement area (A) and extended in a predetermined direction. When αsig-x represents a coefficient of thermal expansion in a direction substantially parallel to the signal lines (312D1) in the signal line arrangement area (A) having the signal lines (312D1) as determined by a laser speckle method and αsig-y represents a coefficient of thermal expansion in a direction substantially orthogonal to the signal lines as determined by a laser speckle method, a dependence rate in the signal line direction of a coefficient of thermal expansion represented by the following equation is 25 or less. Dependence rate in the signal line direction of the coefficient of thermal expansion=(|αsig-y−αsig-x|/αsig-x)×100.
摘要翻译：基板（3）具有积层层，其中包含树脂和导体互连层（312）的绝缘层交替层叠，并且导体互连层（312）通过形成在通孔中的导体层相互连接绝缘层。布置在导体互连层（312）中的基板的最外表面侧的导体互连层（312D）具有形成在信号线布置区域（A）中并沿预定方向延伸的多条信号线（312D1）。当αsig-x表示与通过激光散斑法确定的具有信号线（312D1）的信号线配置区域（A）中的信号线（312D1）基本平行的方向的热膨胀系数，αsig-y表示通过激光散斑法确定的与信号线基本正交的方向的热膨胀系数，由下式表示的热膨胀系数的信号线方向的相关率为25以下。热膨胀系数的信号线方向的依赖率=（|αsig-y-αsig-x | /αsig-x）×100。

6. 发明申请

US20130313849A1 STOWABLE REAR SEAT 有权
标题翻译：可靠的后座
公开(公告)号：US20130313849A1
公开(公告)日：2013-11-28
申请号：US13978476
申请日：2011-12-28
申请人： Teppei Ito
发明人： Teppei Ito
IPC分类号： B60N2/015
CPC分类号： B60N2/01516 , B60N2/0155 , B60N2/3013 , B60N2/305 , B60N2/3065 , B60N2/36
摘要： A stowable rear seat includes a seat back unit; and a seat cushion unit. The seat back unit includes a tiltable seat back erected on a floor surface; a seat back locking mechanism for locking a tilt of the seat back; and a rocking member rocking in cooperation with a tilting operation of the seat back after unlocking the seat back locking mechanism. The seat cushion unit includes a seat cushion horizontally placed on the floor surface in front of the seat back, the seat cushion being foldable on a foot floor surface at a lower position than the floor surface; a lock shaft provided at a back end of the seat cushion; and a seat cushion locking mechanism provided in the floor surface, the seat cushion locking mechanism engaging with the lock shaft to lock a horizontal state of the seat cushion on the floor surface.
摘要翻译：可收起的后排座椅包括座椅靠背单元; 和座垫单元。座椅靠背单元包括竖立在地板表面上的可倾斜座椅靠背; 座椅靠背锁定机构，用于锁定座椅靠背的倾斜; 以及在解锁座椅靠背锁定机构之后与座椅靠背的倾斜操作协同摇摆的摇摆构件。座垫单元包括水平放置在座椅靠背前面的地板表面上的座垫，座垫可在比地板表面更低的位置处在脚踏板表面上折叠; 设置在所述座垫的后端的锁定轴; 以及设置在地板表面的座垫锁定机构，座垫锁定机构与锁定轴接合，以将座垫的水平状态锁定在地板表面上。

7. 发明申请

US20130058062A1 METHOD FOR MANUFACTURING BASE MATERIAL HAVING GOLD-PLATED METAL FINE PATTERN, BASE MATERIAL HAVING GOLD-PLATED METAL FINE PATTERN, PRINTED WIRING BOARD, INTERPOSER, AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：用于制造具有金属镀金属图案的基材的方法，具有金属镀金属图案的基底材料，印刷线路板，插入器和半导体器件
公开(公告)号：US20130058062A1
公开(公告)日：2013-03-07
申请号：US13697720
申请日：2011-05-26
申请人： Kenya Tachibana , Teppei Ito , Yasuaki Mitsui
发明人： Kenya Tachibana , Teppei Ito , Yasuaki Mitsui
IPC分类号： H05K3/10 , H05K7/06 , H05K1/09
CPC分类号： H05K3/108 , C23C18/1651 , C23C18/1653 , C23C18/1689 , C23C18/1844 , C23C18/2006 , C23C18/2086 , C23C18/22 , C23C18/30 , C23C18/34 , C23C18/36 , C23C18/44 , C25D5/022 , H01L23/49816 , H01L23/49827 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014 , H01L2924/15174 , H01L2924/15311 , H01L2924/181 , H05K3/244 , H05K3/387 , H05K2201/0761 , H01L2924/00012 , H01L2924/00 , H01L2224/05599
摘要： A method for manufacturing a base material having a gold-plated metal fine pattern is disclosed, comprising the steps of preparing a base material having a supporting surface made of a resin; forming a primer resin layer having surface roughness of 0.5 μm or less on the supporting surface, and forming a metal fine pattern thereon by an SAP process to obtain a base material having a metal fine pattern; and applying a gold-plating treatment to at least one part of a surface of the metal fine pattern; wherein the base material having a metal fine pattern is subjected to a palladium removal treatment in an optional stage before carrying out the gold-plating treatment.
摘要翻译：公开了一种具有镀金属精细图案的基材的制造方法，包括制备具有由树脂制成的支撑面的基材的工序; 在支撑面上形成表面粗糙度为0.5μm以下的底漆树脂层，通过SAP工序在其上形成金属微细图案，得到具有金属微细图案的基材; 对所述金属精细图案的表面的至少一部分进行镀金处理; 其中，在进行镀金处理之前，在任意阶段对具有金属精细图案的基材进行脱钯处理。

8. 发明申请

US20110120760A1 ELECTROLESS COPPER PLATING METHOD, PRINTED WIRING BOARD, METHOD FOR PRODUCING THE SAME, AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：电镀铜镀层方法，印刷电路板，其制造方法和半导体器件
公开(公告)号：US20110120760A1
公开(公告)日：2011-05-26
申请号：US13055960
申请日：2009-07-17
申请人： Ryoichi Okada , Teppei Ito
发明人： Ryoichi Okada , Teppei Ito
IPC分类号： H05K1/09 , H05K3/02
CPC分类号： H05K3/381 , C23C18/1692 , C23C18/2086 , C23C18/24 , C23C18/30 , C23C18/38 , H05K3/181 , H05K3/422 , H05K2203/0789 , H05K2203/1152
摘要： The present invention is to provide a printed wiring board having a fine wiring formed on a resin base material by the semi-additive method, and is also to provide an electroless copper plating method capable of producing the printed wiring board, a method for producing a printed wiring board using the electroless copper plating method, a printed wiring board produced by the production method, and a semiconductor device provided with the printed wiring board. An electroless copper plating method comprising the step of performing acid treatment before an electroless copper plating step including cleaner, providing palladium catalyst, palladium reduction, and electroless copper plating process, a method for producing a printed wiring board using the electroless copper plating method, a printed wiring board produced by the method for producing the printed wiring board, and a semiconductor device provided with the printed wiring board.
摘要翻译：本发明提供一种通过半添加法形成在树脂基材上的精细布线的印刷布线板，并且还提供能够制造印刷布线板的无电镀铜方法，使用无电镀铜方法的印刷线路板，通过该制造方法制造的印刷线路板，以及设置有印刷线路板的半导体器件。一种无电镀铜方法，包括在包括清洁剂，提供钯催化剂，钯还原和无电镀铜处理的无电镀铜步骤之前进行酸处理的步骤，使用无电镀铜法制造印刷线路板的方法，通过印刷电路板的制造方法制造的印刷线路板以及设置有印刷线路板的半导体装置。

9. 发明申请

US20080036097A1 SEMICONDUCTOR PACKAGE, METHOD OF PRODUCTION THEREOF AND ENCAPSULATION RESIN 审中-公开
标题翻译：半导体封装，其生产方法和封装树脂
公开(公告)号：US20080036097A1
公开(公告)日：2008-02-14
申请号：US11835774
申请日：2007-08-08
申请人： Teppei Ito , Masahiro Wada , Hiroshi Hirose
发明人： Teppei Ito , Masahiro Wada , Hiroshi Hirose
IPC分类号： H01L23/29 , H01L21/58 , H01L23/48
CPC分类号： H01L21/563 , C08L63/00 , H01L23/293 , H01L24/31 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83951 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01041 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/10253 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/3512
摘要： A flip-chip semiconductor package and method of manufacture thereof, the flip-chip semiconductor being highly reliable due to suppression of cracking. The flip-chip semiconductor package is formed by flip-chip bonding of a semiconductor chip-connecting electrode surface of a circuit board 1 and an electrode surface of a semiconductor chip 2, dispensing of an encapsulation resin 4 between the circuit board 1 and the semiconductor chip 2, and formation of fillet 4b by providing the encapsulation resin 4 on peripheral side portions of the semiconductor chip, the fillet 4b having inclined surfaces extending from upper edges 2a of the peripheral side portions of the semiconductor chip 2 outward toward the circuit board, wherein the angle of inclination formed between the inclined surfaces and the peripheral side portions of the semiconductor chip 2 is 50 degrees or less in the vicinity of the upper edges of the peripheral side portions 2a of the semiconductor chip.
摘要翻译：一种倒装芯片半导体封装及其制造方法，由于抑制裂纹，倒装芯片半导体是高度可靠的。倒装芯片半导体封装通过电路板1的半导体芯片连接电极表面和半导体芯片2的电极表面的倒装焊接形成，在电路板1和半导体芯片2之间分配封装树脂4 芯片2，并通过在半导体芯片的周边部分上设置密封树脂4形成圆角4b，圆角4b具有从半导体芯片2的周边侧部分的上边缘2a向外延伸的倾斜表面电路基板，其中，所述半导体芯片2的所述倾斜面与所述周边侧部之间形成的倾斜角在所述半导体芯片的周边部2a的上边缘附近为50度以下。

10. 发明申请

US20100078201A1 LAMINATED BODY, CIRCUIT BOARD INCLUDING LAMINATED BODY, SEMICONDUCTOR PACKAGE AND PROCESS FOR MANUFACTURING LAMINATED BODY 有权
标题翻译：层压体，电路板，包括层压体，半导体封装和制造层压体的工艺
公开(公告)号：US20100078201A1
公开(公告)日：2010-04-01
申请号：US12523320
申请日：2008-02-07
申请人： Kazuyuki Yoshizaki , Teppei Ito , Iji Onozuka , Kensuke Nakamura
发明人： Kazuyuki Yoshizaki , Teppei Ito , Iji Onozuka , Kensuke Nakamura
IPC分类号： H05K1/03 , B32B5/12 , B32B37/00
CPC分类号： H05K1/0366 , B32B5/024 , B32B5/12 , B32B5/22 , B32B5/26 , B32B5/28 , B32B15/14 , B32B15/18 , B32B15/20 , B32B27/12 , B32B27/281 , B32B27/304 , B32B27/32 , B32B27/322 , B32B27/36 , B32B29/005 , B32B29/02 , B32B2260/021 , B32B2260/028 , B32B2260/046 , B32B2262/02 , B32B2262/0261 , B32B2262/0269 , B32B2262/0276 , B32B2262/101 , B32B2307/30 , B32B2307/50 , B32B2307/54 , B32B2307/718 , B32B2457/08 , H05K1/0271 , H05K1/036 , H05K2201/029 , H05K2201/09136 , Y10T156/10 , Y10T428/24124 , Y10T442/2951 , Y10T442/3179 , Y10T442/3301 , Y10T442/3415 , Y10T442/3431 , Y10T442/3463 , Y10T442/3496
摘要： There is provided a laminated body comprising a first resin layer consisting of a first fibrous base material and a resin and a second resin layer consisting of a second fibrous base material and a resin, wherein the first resin layer and the second resin layer are disposed such that the first resin layer and the second resin layer are at least partly positioned in separate regions separated by the center line in a thickness direction of the laminated body; wherein at least one of the first fibrous base material and the second fibrous base material has a bowing region where a bowing region is a region in which a smaller warp/weft crossing angle is less than 90° in the fibrous base material; and wherein in the bowing region, an angle formed by a warp of the first fibrous base material and a warp of the second fibrous base material and an angle formed by a weft of the first fibrous base material and a weft of the second fibrous base material, whichever is larger, is 2° or less.
摘要翻译：提供了一种层叠体，其包括由第一纤维基材和树脂构成的第一树脂层和由第二纤维基材和树脂组成的第二树脂层，其中第一树脂层和第二树脂层被设置为所述第一树脂层和所述第二树脂层至少部分地位于沿所述层叠体的厚度方向由所述中心线分开的分离区域中; 其中所述第一纤维基材和所述第二纤维基材中的至少一个具有弯曲区域，在所述弯曲区域中，所述纤维基材中弯曲区域是较小经纱/纬纱交叉角度小于90°的区域; 并且其中在所述弯曲区域中，由所述第一纤维基材的翘曲和所述第二纤维基材的翘曲形成的角度和由所述第一纤维基材的纬纱和所述第二纤维基材的纬纱形成的角度以较大者为准，为2°以下。

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