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1. 发明申请

US20130058062A1 METHOD FOR MANUFACTURING BASE MATERIAL HAVING GOLD-PLATED METAL FINE PATTERN, BASE MATERIAL HAVING GOLD-PLATED METAL FINE PATTERN, PRINTED WIRING BOARD, INTERPOSER, AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：用于制造具有金属镀金属图案的基材的方法，具有金属镀金属图案的基底材料，印刷线路板，插入器和半导体器件
公开(公告)号：US20130058062A1
公开(公告)日：2013-03-07
申请号：US13697720
申请日：2011-05-26
申请人： Kenya Tachibana , Teppei Ito , Yasuaki Mitsui
发明人： Kenya Tachibana , Teppei Ito , Yasuaki Mitsui
IPC分类号： H05K3/10 , H05K7/06 , H05K1/09
CPC分类号： H05K3/108 , C23C18/1651 , C23C18/1653 , C23C18/1689 , C23C18/1844 , C23C18/2006 , C23C18/2086 , C23C18/22 , C23C18/30 , C23C18/34 , C23C18/36 , C23C18/44 , C25D5/022 , H01L23/49816 , H01L23/49827 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014 , H01L2924/15174 , H01L2924/15311 , H01L2924/181 , H05K3/244 , H05K3/387 , H05K2201/0761 , H01L2924/00012 , H01L2924/00 , H01L2224/05599
摘要： A method for manufacturing a base material having a gold-plated metal fine pattern is disclosed, comprising the steps of preparing a base material having a supporting surface made of a resin; forming a primer resin layer having surface roughness of 0.5 μm or less on the supporting surface, and forming a metal fine pattern thereon by an SAP process to obtain a base material having a metal fine pattern; and applying a gold-plating treatment to at least one part of a surface of the metal fine pattern; wherein the base material having a metal fine pattern is subjected to a palladium removal treatment in an optional stage before carrying out the gold-plating treatment.
摘要翻译：公开了一种具有镀金属精细图案的基材的制造方法，包括制备具有由树脂制成的支撑面的基材的工序; 在支撑面上形成表面粗糙度为0.5μm以下的底漆树脂层，通过SAP工序在其上形成金属微细图案，得到具有金属微细图案的基材; 对所述金属精细图案的表面的至少一部分进行镀金处理; 其中，在进行镀金处理之前，在任意阶段对具有金属精细图案的基材进行脱钯处理。

2. 发明申请

US20110308848A1 RESIN COMPOSITION FOR WIRING BOARD, RESIN SHEET FOR WIRING BOARD, COMPOSITE BODY, METHOD FOR PRODUCING COMPOSITE BODY, AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：接线板用树脂组合物，导线板用树脂片，复合体，生产复合体的方法及半导体器件
公开(公告)号：US20110308848A1
公开(公告)日：2011-12-22
申请号：US13148774
申请日：2010-02-08
申请人： Yuka Ito , Kenichi Kaneda , Yasuaki Mitsui , Iji Onozuka , Noriyuki Ohigashi , Hideki Hara
发明人： Yuka Ito , Kenichi Kaneda , Yasuaki Mitsui , Iji Onozuka , Noriyuki Ohigashi , Hideki Hara
IPC分类号： H05K1/18 , H05K3/00 , B32B3/00
CPC分类号： H05K3/045 , H05K3/107 , H05K3/281 , H05K3/421 , H05K3/465 , H05K2201/0209 , H05K2201/09509 , H05K2201/09563 , Y10T29/49124 , Y10T428/24355
摘要： Disclosed are a composite body, a method for producing the composite body and a semiconductor device, the composite body comprising a resin layer and a fine wiring and/or via hole being formed in the resin layer, having high adhesion and high reliability, and being capable of high frequencies. Also disclosed are a resin composition and a resin sheet, both of which can provide such a composite body.The composite body comprises a resin layer and an electroconductive layer, wherein a groove having a maximum width of 1 μm or more and 10 μm or less is on a surface of the resin layer; the electroconductive layer is inside the groove; and a surface of the resin layer being in contact with the electroconductive layer has an arithmetic average roughness (Ra) of 0.05 μm or more and 0.45 μm or less, and/or wherein the resin layer has a via hole having a diameter of 1 μm or more and 25 μm or less; the electroconductive layer is inside the via hole; and a surface of the resin layer of the inside of the via hole has an arithmetic average roughness (Ra) of 0.05 μm or more and 0.45 μm or less. The resin composition comprises an inorganic filler and a thermosetting resin, wherein the inorganic filler contains coarse particles having a diameter of more than 2 μm in an amount of 500 ppm or less. The resin sheet comprises a resin layer and a substrate, wherein the resin layer is on the substrate and comprises the resin composition.
摘要翻译：公开了一种复合体，该复合体的制造方法以及半导体装置，该复合体包括树脂层和在该树脂层中形成的精细布线和/或通孔，具有高粘合性和高可靠性，并且能够高频率。还公开了树脂组合物和树脂片，两者都可以提供这种复合体。复合体包括树脂层和导电层，其中在树脂层的表面上具有最大宽度为1μm以上且10μm以下的槽; 导电层在槽内; 并且与导电层接触的树脂层的表面的算术平均粗糙度（Ra）为0.05μm以上且0.45μm以下，和/或其中树脂层具有直径为1μm的通孔以上且25μm以下; 导电层在通孔内; 通孔内侧的树脂层的表面的算术平均粗糙度（Ra）为0.05μm以上且0.45μm以下。树脂组合物包含无机填料和热固性树脂，其中无机填料含有直径大于2μm的粗颗粒的量在500ppm以下。树脂片包括树脂层和基材，其中树脂层在基材上并包含树脂组合物。

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